SCHEMBL339886

SCHEMBL339886

C=C(C)C(=O)OC[Si](CC)(CC)OC

nearest known ligand 0.44

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.44
TSHR P16473 3/20 0.43
ALDH1A1 P00352 2/20 0.41
TDP1 Q9NUW8 2/20 0.31
POLB P06746 1/20 0.30
APEX1 P27695 1/20 0.30
HTT P42858 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16537559 0.90 TSHR (0.42) THRBTSHRALDH1A1
SCHEMBL16537473 0.85 TSHR (0.44) THRBTSHRALDH1A1
SCHEMBL341032 0.83 THRB (0.47) THRBTSHRALDH1A1TDP1
SCHEMBL339021 0.81 THRB (0.50) THRBTSHRALDH1A1TDP1POLB
SCHEMBL341111 0.81 THRB (0.44) THRBTSHRALDH1A1TDP1POLB
SCHEMBL145163 0.80 TSHR (0.45) THRBTSHRALDH1A1TDP1POLB
SCHEMBL12094993 0.79 TSHR (0.48) THRBTSHRALDH1A1TDP1POLB
SCHEMBL16536937 0.79 TSHR (0.46) THRBTSHRALDH1A1
SCHEMBL10615579 0.79 TSHR (0.46) THRBTSHRALDH1A1TDP1
SCHEMBL340795 0.79 TSHR (0.54) THRBTSHRALDH1A1TDP1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9266981-B2 Conjugated diene random copolymer having alkoxysilane unit KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) 2016-02-23 US disclosed
US-20150065639-A1 CONJUGATED DIENE RANDOM COPOLYMER HAVING ALKOXYSILANE UNIT KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) 2015-03-05 US disclosed
EP-2065455-B1 Pressure-sensitive adhesive tape NITTO DENKO CORP (JP) 2012-05-16 EP disclosed
US-20120015100-A1 Pressure-Sensitive Adhesive Tape NITTO DENKO CORPORATION (JP) 2012-01-19 US disclosed
EP-2383321-A2 Process for producing an adhesive composition and adhesive tape comprising an adhesive composition produced by said process Nitto Denko Corporation (JP) 2011-11-02 EP disclosed
US-20090142593-A1 PRESSURE-SENSITIVE ADHESIVE TAPE NITTO DENKO CORPORATION (JP) 2009-06-04 US disclosed
EP-2065455-A1 Pressure-sensitive adhesive tape NITTO DENKO CORPORATION (JP) 2009-06-03 EP disclosed
US-20080242766-A1 Curable Composition Containing Surface-Modified Particles CONSORTIUM FUER ELEKTROCHEMISCHE INDUSTRIE GMBH (DE) 2008-10-02 US disclosed
EP-1711537-B1 CURABLE COMPOSITION CONTAINING SURFACE-MODIFIED PARTICLES WACKER CHEMIE AG (DE) 2007-12-05 EP disclosed