SCHEMBL341032

SCHEMBL341032

C=C(C)C(=O)OC[Si](CC)(CC)OCC

nearest known ligand 0.47

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.47
TSHR P16473 4/20 0.42
ALDH1A1 P00352 4/20 0.37
LMNA P02545 1/20 0.32
HSD17B10 Q99714 1/20 0.32
ALOX15 P16050 1/20 0.31
MGAM O43451 1/20 0.31
GAA P10253 1/20 0.31
SI P14410 1/20 0.31
MGAM2 Q2M2H8 1/20 0.31
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16537344 0.90 THRB (0.42) THRBTSHRALDH1A1
SCHEMBL16537246 0.86 THRB (0.44) THRBTSHRALDH1A1LMNAHSD17B10
SCHEMBL339886 0.83 THRB (0.44) THRBTSHRALDH1A1TDP1
SCHEMBL340972 0.82 THRB (0.53) THRBTSHRALDH1A1LMNAHSD17B10
SCHEMBL338995 0.81 THRB (0.47) THRBTSHRALDH1A1LMNAHSD17B10
SCHEMBL80190 0.81 THRB (0.50) THRBTSHRALDH1A1LMNAHSD17B10
SCHEMBL16537817 0.80 THRB (0.46) THRBTSHRALDH1A1LMNAHSD17B10
SCHEMBL340572 0.80 TSHR (0.53) THRBTSHRALDH1A1TDP1
SCHEMBL143881 0.79 THRB (0.48) THRBTSHRALDH1A1LMNAHSD17B10
SCHEMBL81163 0.79 THRB (0.48) THRBTSHRALDH1A1LMNAHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9266981-B2 Conjugated diene random copolymer having alkoxysilane unit KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) 2016-02-23 US disclosed
US-20150065639-A1 CONJUGATED DIENE RANDOM COPOLYMER HAVING ALKOXYSILANE UNIT KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) 2015-03-05 US disclosed
EP-2065455-B1 Pressure-sensitive adhesive tape NITTO DENKO CORP (JP) 2012-05-16 EP disclosed
US-20120015100-A1 Pressure-Sensitive Adhesive Tape NITTO DENKO CORPORATION (JP) 2012-01-19 US disclosed
EP-2383321-A2 Process for producing an adhesive composition and adhesive tape comprising an adhesive composition produced by said process Nitto Denko Corporation (JP) 2011-11-02 EP disclosed
US-20090142593-A1 PRESSURE-SENSITIVE ADHESIVE TAPE NITTO DENKO CORPORATION (JP) 2009-06-04 US disclosed
EP-2065455-A1 Pressure-sensitive adhesive tape NITTO DENKO CORPORATION (JP) 2009-06-03 EP disclosed
EP-1711537-A1 CURABLE COMPOSITION CONTAINING SURFACE-MODIFIED PARTICLES Consortium für elektrochemische Industrie GmbH (DE) 2006-10-18 EP disclosed
WO-2005092932-A1 CURABLE COMPOSITION CONTAINING SURFACE-MODIFIED PARTICLES Consortium für elektrochemische Industrie GmbH (DE) 2005-10-06 WO disclosed