SCHEMBL3404313

SCHEMBL3404313

CCO[Si](C)(F)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17763391 0.79
SCHEMBL23700988 0.79
SCHEMBL138265 0.74
SCHEMBL704746 0.74
SCHEMBL3890552 0.74
SCHEMBL25327708 0.73 CA1 (0.32)
SCHEMBL3482339 0.71
SCHEMBL28236606 0.71
SCHEMBL27813 0.69
SCHEMBL9123116 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118613545-A Mixed composition, film obtained by curing the mixed composition, and glass having the film 住友化学株式会社 2024-09-06 CN disclosed
CN-108139671-B Photosensitive resin composition and cured film prepared therefrom 罗门哈斯电子材料韩国有限公司 2022-02-11 CN disclosed
CN-107428891-B Curable composition 施敏打硬株式会社 2021-04-20 CN disclosed
US-10890846-B2 Photosensitive resin composition and cured film prepared therefrom ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD (KR) 2021-01-12 US disclosed
EP-3081612-B1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES CEMEDINE CO LTD (JP) 2018-11-14 EP disclosed
US-20180314153-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM PREPARED THEREFROM ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2018-11-01 US disclosed
CN-105829485-B Photocurable composition with adhesiveness 思美定株式会社 2018-10-12 CN disclosed
US-9718999-B2 Photocurable composition having adhesive properties CEMEDINE CO., LTD (JP) 2017-08-01 US disclosed
US-20160312089-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES CEMEDINE CO., LTD. (JP) 2016-10-27 US disclosed
EP-3081612-A1 PHOTOCURABLE COMPOSITION HAVING ADHESIVE PROPERTIES Cemedine Co., Ltd. (JP) 2016-10-19 EP disclosed
CN-101326255-B Continuous process for producing silicone pressure sensitive adhesives DOW CORNING 2013-09-25 CN disclosed
CN-101223257-B Pressure sensitive adhesives and methods for their preparation DOW CORNING INC 2011-06-29 CN disclosed
US-20100324240-A1 CATALYST FOR THE POLYMERIZATION OF OLEFINS BASELL POLYOLEFINE ITALIA S.R.L (IT) 2010-12-23 US disclosed
EP-2252637-A1 CATALYST FOR THE POLYMERIZATION OF OLEFINS Basell Poliolefine Italia S.R.L. (IT) 2010-11-24 EP disclosed
WO-2009112399-A1 CATALYST FOR THE POLYMERIZATION OF OLEFINS BASELL POLIOLEFINE ITALIA S.R.L. (IT) 2009-09-17 WO disclosed
CN-101326255-A Continuous process for producing silicone pressure sensitive adhesives DOW CORNING (US) 2008-12-17 CN disclosed
CN-101223257-A Pressure sensitive adhesives and methods for their preparation DOW CORNING (US) 2008-07-16 CN disclosed
EP-0768352-A1 MATERIAL FOR FORMING SILICA-BASE COATED INSULATION FILM, PROCESS FOR PRODUCING THE MATERIAL, SILICA-BASE INSULATION FILM, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING THE DEVICE HITACHI CHEMICAL CO., LTD. (JP) 1997-04-16 EP disclosed
EP-0285092-B1 PROCESS TO STRENGTHEN THE ADHERENCE OF POLYMER MATERIALS Wacker-Chemie GmbH (DE) 1990-11-14 EP disclosed
US-4874638-A PRECOATING AN ALKALINE CARBONATE SURFACE WITH AN APROTIC SOLVENT SOLUTION CONTAINING AN ORGANO SILICON FLUORIDE; DESOLVENTIZING WACKER-CHEMIE GMBH (DE) 1989-10-17 US disclosed