SCHEMBL3406537

SCHEMBL3406537

COOP(=O)(O)c1ccccc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA2 P00918 3/20 0.50
CA4 P22748 2/20 0.50
CA5A P35218 2/20 0.50
CFTR P13569 1/20 0.45
POLB P06746 1/20 0.44
CA12 O43570 1/20 0.42
CA1 P00915 1/20 0.42
CA7 P43166 1/20 0.42
CA9 Q16790 1/20 0.42
CA5B Q9Y2D0 1/20 0.42
TSHR P16473 2/20 0.42
ALOX15 P16050 1/20 0.42
ESR1 P03372 1/20 0.42
ALDH1A1 P00352 3/20 0.41
L3MBTL1 Q9Y468 2/20 0.41
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
SRC P12931 1/20 0.40
ACP3 P15309 1/20 0.39
TDP1 Q9NUW8 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL344018 0.82 CA2 (0.54) CA2CA4CA5ACFTRPOLB
SCHEMBL9584053 0.80 CA2 (0.52) CA2CA4CA5ACFTRPOLB
Hydrochloric Acid SCHEMBL11034039 0.80 CA2 (0.52) CA2CA4CA5ACFTRPOLB
SCHEMBL9751694 0.78 L3MBTL1 (0.46) CA2CA4CA5ACFTRPOLB
SCHEMBL27944332 0.78 CA2 (0.45) CA2CA4CA5ACFTRPOLB
SCHEMBL10380089 0.77 L3MBTL1 (0.52) CA2CA4CA5ACFTRPOLB
SCHEMBL28666079 0.77 L3MBTL1 (0.54) CA2CA4CA5ACFTRPOLB
SCHEMBL11122924 0.77 SRC (0.48) CA2CA4CA5ACFTRCA12
SCHEMBL7128526 0.77 CA2 (0.59) CA2CA4CA5ACFTRCA12
SCHEMBL11583769 0.75 CA2 (0.56) CA2CA4CA5ACFTRCA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0439470-A1 PROCESS FOR INCREASING THE MOLECULAR WEIGHT OF A POLYAMIDE. DU PONT (US) 1991-08-07 EP claimed
CN-113334866-B Adhesive layer, optical film with adhesive layer, optical laminate, and image display device 日东电工株式会社 2023-04-07 CN disclosed
US-20210363391-A1 PRESSURE-SENSITIVE ADHESIVE LAYER, OPTICAL FILM HAVING PRESSURE-SENSITIVE ADHESIVE LAYER, OPTICAL LAMINATE, AND IMAGE DISPLAY DEVICE NITTO DENKO CORPORATION (JP) 2021-11-25 US disclosed
CN-113334866-A Adhesive layer, optical film with adhesive layer, optical laminate, and image display device 日东电工株式会社 2021-09-03 CN disclosed
CN-110637069-B Adhesive layer, optical film with adhesive layer, optical laminate, and image display device 日东电工株式会社 2021-06-29 CN disclosed
CN-105738998-B Polarizing film with coating layer, polarizing film with adhesive layer, and image display device 日东电工株式会社 2020-06-16 CN disclosed
CN-110637069-A Adhesive layer, optical film with adhesive layer, optical laminate, and image display device 日东电工株式会社 2019-12-31 CN disclosed
US-10253220-B2 Acrylic pressure-sensitive adhesive composition, acrylic pressure-sensitive adhesive layer, pressure-sensitive adhesive layer-attached substrate film, laminate, and image display device NITTO DENKO CORPORATION (JP) 2019-04-09 US disclosed
CN-108774485-A Acrylic adhesive composition, acrylic adhesive layer, the base material film with adhesive phase, laminated body and image display device 日东电工株式会社 2018-11-09 CN disclosed
CN-105874026-B Acrylic pressure-sensitive adhesive composition, acrylic pressure-sensitive adhesive layer, pressure-sensitive adhesive layer-attached base film, laminate, and image display device 日东电工株式会社 2018-07-06 CN disclosed
US-9080091-B2 Polyester resin composition for electrical/electronic part-sealing material, sealed product, and production method thereof TOYOBO CO., LTD. (JP) 2015-07-14 US disclosed
CN-103155270-B Electrolyte for photoelectric conversion element, and photoelectric conversion element and dye-sensitized solar cell using same YOKOHAMA RUBBER CO LTD 2014-11-12 CN disclosed
EP-2687573-A1 POLYESTER RESIN COMPOSITION FOR ELECTRICAL / ELECTRONIC PART-SEALING MATERIAL, SEALED PRODUCT AND PRODUCTION METHOD THEREFOR Toyobo Co., Ltd. (JP) 2014-01-22 EP disclosed
US-20130338318-A1 POLYESTER RESIN COMPOSITION FOR ELECTRICAL/ELECTRONIC PART-SEALING MATERIAL, SEALED PRODUCT, AND PRODUCTION METHOD THEREOF TOYOBO CO., LTD. (JP) 2013-12-19 US disclosed
US-20130206234-A1 ELECTROLYTE FOR PHOTOELECTRIC CONVERSION ELEMENT, AND PHOTOELECTRIC CONVERSION ELEMENT AND DYE-SENSITISED SOLAR CELL USING SAME THE YOKOHAMA RUBBER CO., LTD. (JP) 2013-08-15 US disclosed
CN-103155270-A Electrolyte for photoelectric conversion element, and photoelectric conversion element and dye-sensitized solar cell using same YOKOHAMA RUBBER CO LTD 2013-06-12 CN disclosed
US-7786198-B2 Crosslinkable substances based on organosilicon compounds WACKER CHEMIE AG (DE) 2010-08-31 US disclosed
US-20070244230-A1 CROSSLINKABLE SUBSTANCES BASED ON ORGANOSILICON COMPOUNDS WACKER CHEMIE AG (DE) 2007-10-18 US disclosed
EP-0602068-B1 PROCESS FOR INCREASING POLYAMIDE MOLECULAR WEIGHT WITH ORGANOPHOSPHONIC ACID OR ESTER CATALYSTS IN THE PRESENCE OF ALUMINA-CONTAINING TiO 2? DU PONT (US) 1997-04-23 EP disclosed
US-5142000-A Process for increasing polyamide molecular weight with organophosphonic acid or ester catalysts in the presence of alumina-containing titanium dioxide E. I. DU PONT DE NEMOURS AND COMPANY (US) 1992-08-25 US disclosed