Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.46 |
| ▸ | CFTR | P13569 | 1/20 | 0.45 |
| ▸ | POLB | P06746 | 2/20 | 0.45 |
| ▸ | CA2 | P00918 | 1/20 | 0.45 |
| ▸ | CA4 | P22748 | 1/20 | 0.45 |
| ▸ | CA5A | P35218 | 1/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.44 |
| ▸ | TSHR | P16473 | 2/20 | 0.44 |
| ▸ | MEN1 | O00255 | 5/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 5/20 | 0.44 |
| ▸ | AOX1 | Q06278 | 1/20 | 0.44 |
| ▸ | ACHE | P22303 | 1/20 | 0.43 |
| ▸ | GAA | P10253 | 1/20 | 0.42 |
| ▸ | PKM | P14618 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11779188 | 0.82 | HIF1A (0.49) | L3MBTL1CFTRPOLBTSHRMEN1 | |
| SCHEMBL8583780 | 0.80 | MEN1 (0.55) | L3MBTL1POLBCA2ALDH1A1TSHR | |
| SCHEMBL344619 | 0.80 | ACHE (0.55) | L3MBTL1CFTRPOLBCA2CA4 | |
| SCHEMBL8527129 | 0.80 | L3MBTL1 (0.48) | L3MBTL1CFTRPOLBCA2CA4 | |
| SCHEMBL29257281 | 0.80 | L3MBTL1 (0.39) | L3MBTL1CFTRCA2ALDH1A1MEN1 | |
| SCHEMBL27944202 | 0.79 | TSHR (0.53) | L3MBTL1CFTRCA2CA4CA5A | |
| Hydrochloric Acid SCHEMBL10824665 | 0.78 | ACHE (0.53) | L3MBTL1CFTRPOLBCA2CA4 | |
| Fluoride SCHEMBL29262354 | 0.78 | ACHE (0.53) | L3MBTL1CFTRPOLBCA2CA4 | |
| SCHEMBL3406537 | 0.78 | CA2 (0.50) | L3MBTL1CFTRPOLBCA2CA4 | |
| Butane SCHEMBL10939785 | 0.77 | MEN1 (0.52) | L3MBTL1POLBALDH1A1MEN1KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118450886-A | Liquid compositions with enhanced antimicrobial activity | 联合利华知识产权控股有限公司 | 2024-08-06 | — | — | CN | claimed |
| CN-113334866-B | Adhesive layer, optical film with adhesive layer, optical laminate, and image display device | 日东电工株式会社 | 2023-04-07 | — | — | CN | disclosed |
| US-20210363391-A1 | PRESSURE-SENSITIVE ADHESIVE LAYER, OPTICAL FILM HAVING PRESSURE-SENSITIVE ADHESIVE LAYER, OPTICAL LAMINATE, AND IMAGE DISPLAY DEVICE | NITTO DENKO CORPORATION (JP) | 2021-11-25 | — | — | US | disclosed |
| CN-113334866-A | Adhesive layer, optical film with adhesive layer, optical laminate, and image display device | 日东电工株式会社 | 2021-09-03 | — | — | CN | disclosed |
| US-10253220-B2 | Acrylic pressure-sensitive adhesive composition, acrylic pressure-sensitive adhesive layer, pressure-sensitive adhesive layer-attached substrate film, laminate, and image display device | NITTO DENKO CORPORATION (JP) | 2019-04-09 | — | — | US | disclosed |
| CN-106700053-A | Anti-dripping and flame-retardant fiber as well as production method and application thereof | 东丽纤维研究所（中国）有限公司 | 2017-05-24 | — | — | CN | disclosed |
| US-20160326402-A1 | ACRYLIC PRESSURE-SENSITIVE ADHESIVE COMPOSITION, ACRYLIC PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE LAYER-ATTACHED SUBSTRATE FILM, LAMINATE, AND IMAGE DISPLAY DEVICE | NITTO DENKO CORPORATION (JP) | 2016-11-10 | — | — | US | disclosed |
| EP-2687573-B1 | POLYESTER RESIN COMPOSITION FOR ELECTRICAL / ELECTRONIC PART-SEALING MATERIAL, SEALED PRODUCT AND PRODUCTION METHOD THEREFOR | TOYO BOSEKI (JP) | 2016-05-11 | — | — | EP | disclosed |
| US-9080091-B2 | Polyester resin composition for electrical/electronic part-sealing material, sealed product, and production method thereof | TOYOBO CO., LTD. (JP) | 2015-07-14 | — | — | US | disclosed |
| EP-2687573-A1 | POLYESTER RESIN COMPOSITION FOR ELECTRICAL / ELECTRONIC PART-SEALING MATERIAL, SEALED PRODUCT AND PRODUCTION METHOD THEREFOR | Toyobo Co., Ltd. (JP) | 2014-01-22 | — | — | EP | disclosed |
| US-20130338318-A1 | POLYESTER RESIN COMPOSITION FOR ELECTRICAL/ELECTRONIC PART-SEALING MATERIAL, SEALED PRODUCT, AND PRODUCTION METHOD THEREOF | TOYOBO CO., LTD. (JP) | 2013-12-19 | — | — | US | disclosed |
| EP-0439470-A1 | PROCESS FOR INCREASING THE MOLECULAR WEIGHT OF A POLYAMIDE. | DU PONT (US) | 1991-08-07 | — | — | EP | disclosed |