Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 7/20 | 0.43 |
| ▸ | THRB | P10828 | 1/20 | 0.36 |
| ▸ | GSTP1 | P09211 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.34 |
| ▸ | TP53 | P04637 | 3/20 | 0.34 |
| ▸ | HIF1A | Q16665 | 3/20 | 0.34 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.34 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.34 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | HPGD | P15428 | 1/20 | 0.32 |
| ▸ | TBXAS1 | P24557 | 1/20 | 0.31 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29010382 | 0.87 | GSTP1 (0.43) | GSTP1CYP3A4TBXAS1ALOX15 | |
| SCHEMBL4870943 | 0.85 | GSTP1 (0.31) | TSHRGSTP1 | |
| SCHEMBL29010386 | 0.83 | HCAR2 (0.41) | GSTP1TBXAS1 | |
| SCHEMBL4872196 | 0.77 | TSHR (0.46) | TSHRTHRBGSTP1ALDH1A1 | |
| SCHEMBL57576 | 0.76 | TSHR (0.41) | TSHRTHRBGSTP1ALDH1A1TP53 | |
| SCHEMBL9274895 | 0.76 | TSHR (0.37) | TSHRTHRBGSTP1ALDH1A1TP53 | |
| SCHEMBL6065383 | 0.76 | GSTP1 (0.32) | GSTP1 | |
| Bromide SCHEMBL29698919 | 0.75 | TSHR (0.40) | TSHRTHRBGSTP1ALDH1A1TP53 | |
| SCHEMBL28385076 | 0.73 | GSTP1 (0.31) | GSTP1 | |
| SCHEMBL2457507 | 0.71 | ALDH1A1 (0.41) | TSHRTHRBGSTP1ALDH1A1TP53 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7364833-B2 | coating uniformity on large-scale substrate; acrylic ester polymer; mixed solvent of ethylene diglycol methylethyl ether (EDM) and a solvent having a vapor pressure lower than the EDM; photosensitizer | SAMSUNG ELECTRONICS CO., LTD (KR) | 2008-04-29 | — | — | US | claimed |
| US-20050266339-A1 | coating uniformity on large-scale substrate; acrylic ester polymer; mixed solvent of ethylene diglycol methylethyl ether (EDM) and a solvent having a vapor pressure lower than the EDM; photosensitizer | SAMSUNG DISPLAY CO., LTD. (KR) | 2005-12-01 | — | — | US | claimed |
| WO-2004107053-A1 | POSITIVE PHOTORESIST COMPOSITION FOR SPINLESS (SLIT) COATING | ADMS TECHNOLOGY CO., LTD. (KR) | 2004-12-09 | — | — | WO | claimed |
| WO-2004107052-A1 | NEGATIVE PHOTORESIST COMPOSITION FOR SPINLESS (SLIT) COATING | ADMS TECHNOLOGY CO., LTD. (KR) | 2004-12-09 | — | — | WO | claimed |
| WO-2004097522-A1 | NEGATIVE RESIST COMPOSITION FOR ORGANIC INSULATOR OF HIGH APERTURE LCD | ADMS TECHNOLOGY CO. LTD. (KR) | 2004-11-11 | — | — | WO | claimed |
| US-20100234523-A1 | Active energy beam-curable ink | RISO KAGAKU CORPORATION (JP) | 2010-09-16 | — | — | US | disclosed |
| CN-100538517-C | Negative resist composition for organic insulating layer of high aperture LCD | ADMS TECHNOLOGY CO LTD (KR) | 2009-09-09 | — | — | CN | disclosed |
| US-7364833-B2 | coating uniformity on large-scale substrate; acrylic ester polymer; mixed solvent of ethylene diglycol methylethyl ether (EDM) and a solvent having a vapor pressure lower than the EDM; photosensitizer | SAMSUNG ELECTRONICS CO., LTD (KR) | 2008-04-29 | — | — | US | disclosed |
| CN-1781057-A | Negative resist composition for organic insulating layer of high aperture LCD | ADMS TECHNOLOGY CO LTD (KR) | 2006-05-31 | — | — | CN | disclosed |
| EP-1016547-B1 | Method and material for erasable recording by heat | RICOH KK (JP) | 2006-03-29 | — | — | EP | disclosed |
| US-20050266339-A1 | coating uniformity on large-scale substrate; acrylic ester polymer; mixed solvent of ethylene diglycol methylethyl ether (EDM) and a solvent having a vapor pressure lower than the EDM; photosensitizer | SAMSUNG DISPLAY CO., LTD. (KR) | 2005-12-01 | — | — | US | disclosed |
| WO-2004107053-A1 | POSITIVE PHOTORESIST COMPOSITION FOR SPINLESS (SLIT) COATING | ADMS TECHNOLOGY CO., LTD. (KR) | 2004-12-09 | — | — | WO | disclosed |
| US-20010029236-A1 | Method of using reversible thermosensitive recording medium and the reversible thermosensitive recording medium | RICOH COMPANY, LTD. (JP) | 2001-10-11 | — | — | US | disclosed |
| EP-1142965-A1 | Ultraviolet radiation curable ink | RISO KAGAKU CORPORATION (JP) | 2001-10-10 | — | — | EP | disclosed |
| US-20010025587-A1 | Reversible thermosensitive coloring composition and recording material using the composition and recording method using the recording material | TORII MASAFUMI (JP) | 2001-10-04 | — | — | US | disclosed |
| US-6261992-B1 | AMIDE ERASURE PROMOTER | RICOH COMPANY, LTD. (JP) | 2001-07-17 | — | — | US | disclosed |
| US-6207613-B1 | ELECTRON ACCEPTING COLOR DEVELOPER INCLUDES A PHENOLIC COMPOUND | RICOH COMPANY, LTD. (JP) | 2001-03-27 | — | — | US | disclosed |
| US-6090748-A | IMAGEWISE HEATING THE RECORDING LAYER TO NOT LOWER THAN AN IMAGE FORMING TEMPERATURE TO FORM A COLORED IMAGE, AND ERASING BY HEATING TO A TEMPERATURE LOWER THAN IMAGE FORMING TEMPERATURE, NOT LOWER THAN IMAGE ERASING TEMPERATURE | RICOH COMPANY, LTD. (JP) | 2000-07-18 | — | — | US | disclosed |
| EP-1016547-A1 | Method and material for erasable recording by heat | Ricoh Company, Ltd. (JP) | 2000-07-05 | — | — | EP | disclosed |
| US-5981115-A | RECORDING LAYER COMPRISES A RESIN AN ISOCYANATE COMPOUND CROSSLINKED WITH RESIN, ELECTRON DONATING COLORING AGENT AND AN ELECTRON ACCEPTING COLORING DEVELOPER | RICOH COMPANY, LTD. (JP) | 1999-11-09 | — | — | US | disclosed |