SCHEMBL4872196

SCHEMBL4872196

C=C(C)C(=O)OCC(C1=CCCC1)C1=CCCC1

nearest known ligand 0.46

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.46
ALDH1A1 P00352 1/20 0.35
POLB P06746 1/20 0.34
APEX1 P27695 1/20 0.34
HTT P42858 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
THRB P10828 1/20 0.33
GSTP1 P09211 1/20 0.32
KMT2A Q03164 1/20 0.30
ATM Q13315 1/20 0.30
HDAC1 Q13547 1/20 0.30
HDAC2 Q92769 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4872198 0.85 TSHR (0.33) TSHR
SCHEMBL3421769 0.77 TSHR (0.43) TSHRALDH1A1THRBGSTP1
SCHEMBL128997 0.77 TSHR (0.44) TSHRALDH1A1POLBAPEX1HTT
SCHEMBL29010382 0.76 GSTP1 (0.43) GSTP1KMT2AHDAC1HDAC2
Methacrylic Acid SCHEMBL25435014 0.76 TSHR (0.41) TSHRALDH1A1POLBAPEX1HTT
SCHEMBL8463984 0.74 KMT2A (0.31) ALDH1A1KMT2AATM
Acrylic Acid SCHEMBL8676132 0.73 TSHR (0.38) TSHR
SCHEMBL29010386 0.73 HCAR2 (0.41) GSTP1
SCHEMBL9813172 0.72 TSHR (0.38) TSHRALDH1A1POLBAPEX1HTT
SCHEMBL8733252 0.71 SMN1; SMN2 (0.31) ALDH1A1HTTKMT2AATM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7364833-B2 coating uniformity on large-scale substrate; acrylic ester polymer; mixed solvent of ethylene diglycol methylethyl ether (EDM) and a solvent having a vapor pressure lower than the EDM; photosensitizer SAMSUNG ELECTRONICS CO., LTD (KR) 2008-04-29 US claimed
US-20050266339-A1 coating uniformity on large-scale substrate; acrylic ester polymer; mixed solvent of ethylene diglycol methylethyl ether (EDM) and a solvent having a vapor pressure lower than the EDM; photosensitizer SAMSUNG DISPLAY CO., LTD. (KR) 2005-12-01 US claimed
WO-2004107053-A1 POSITIVE PHOTORESIST COMPOSITION FOR SPINLESS (SLIT) COATING ADMS TECHNOLOGY CO., LTD. (KR) 2004-12-09 WO claimed
WO-2004107052-A1 NEGATIVE PHOTORESIST COMPOSITION FOR SPINLESS (SLIT) COATING ADMS TECHNOLOGY CO., LTD. (KR) 2004-12-09 WO claimed
WO-2004097522-A1 NEGATIVE RESIST COMPOSITION FOR ORGANIC INSULATOR OF HIGH APERTURE LCD ADMS TECHNOLOGY CO. LTD. (KR) 2004-11-11 WO claimed
CN-101116036-B Positive photoresist composition SAMYANGEMS CO LTD 2011-02-02 CN disclosed
CN-100538517-C Negative resist composition for organic insulating layer of high aperture LCD ADMS TECHNOLOGY CO LTD (KR) 2009-09-09 CN disclosed
US-7364833-B2 coating uniformity on large-scale substrate; acrylic ester polymer; mixed solvent of ethylene diglycol methylethyl ether (EDM) and a solvent having a vapor pressure lower than the EDM; photosensitizer SAMSUNG ELECTRONICS CO., LTD (KR) 2008-04-29 US disclosed
CN-101116036-A Positive photoresist composition SAMYANGEMS CO LTD (KR) 2008-01-30 CN disclosed
CN-1781057-A Negative resist composition for organic insulating layer of high aperture LCD ADMS TECHNOLOGY CO LTD (KR) 2006-05-31 CN disclosed
US-20050266339-A1 coating uniformity on large-scale substrate; acrylic ester polymer; mixed solvent of ethylene diglycol methylethyl ether (EDM) and a solvent having a vapor pressure lower than the EDM; photosensitizer SAMSUNG DISPLAY CO., LTD. (KR) 2005-12-01 US disclosed
WO-2004107053-A1 POSITIVE PHOTORESIST COMPOSITION FOR SPINLESS (SLIT) COATING ADMS TECHNOLOGY CO., LTD. (KR) 2004-12-09 WO disclosed
WO-2004107052-A1 NEGATIVE PHOTORESIST COMPOSITION FOR SPINLESS (SLIT) COATING ADMS TECHNOLOGY CO., LTD. (KR) 2004-12-09 WO disclosed
WO-2004097522-A1 NEGATIVE RESIST COMPOSITION FOR ORGANIC INSULATOR OF HIGH APERTURE LCD ADMS TECHNOLOGY CO. LTD. (KR) 2004-11-11 WO disclosed
US-5157072-A For curing unsaturated polyesters and vinyl esters; fillers, phenol-formaldehyde resins, additives HILTI AKTIENGESELLSCHAFT (LI) 1992-10-20 US disclosed