SCHEMBL4870943

SCHEMBL4870943

C=CC(=O)OOCC(C1=CCCC1)C1=CCCC1

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
GSTP1 P09211 1/20 0.31
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3421769 0.85 TSHR (0.43) GSTP1TSHR
SCHEMBL4872198 0.78 TSHR (0.33) TSHR
SCHEMBL28898955 0.77 GSTP1 (0.30) GSTP1
SCHEMBL28385076 0.77 GSTP1 (0.31) GSTP1
SCHEMBL29010382 0.75 GSTP1 (0.43) GSTP1
SCHEMBL6065383 0.73 GSTP1 (0.32) GSTP1
SCHEMBL29010386 0.72 HCAR2 (0.41) GSTP1
SCHEMBL4872196 0.69 TSHR (0.46) GSTP1TSHR
SCHEMBL4872192 0.69 GSTP1 (0.32) GSTP1
SCHEMBL8733563 0.69 GSTP1 (0.30) GSTP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7364833-B2 coating uniformity on large-scale substrate; acrylic ester polymer; mixed solvent of ethylene diglycol methylethyl ether (EDM) and a solvent having a vapor pressure lower than the EDM; photosensitizer SAMSUNG ELECTRONICS CO., LTD (KR) 2008-04-29 US claimed
US-20050266339-A1 coating uniformity on large-scale substrate; acrylic ester polymer; mixed solvent of ethylene diglycol methylethyl ether (EDM) and a solvent having a vapor pressure lower than the EDM; photosensitizer SAMSUNG DISPLAY CO., LTD. (KR) 2005-12-01 US claimed
WO-2004107053-A1 POSITIVE PHOTORESIST COMPOSITION FOR SPINLESS (SLIT) COATING ADMS TECHNOLOGY CO., LTD. (KR) 2004-12-09 WO claimed
WO-2004107052-A1 NEGATIVE PHOTORESIST COMPOSITION FOR SPINLESS (SLIT) COATING ADMS TECHNOLOGY CO., LTD. (KR) 2004-12-09 WO claimed
WO-2004097522-A1 NEGATIVE RESIST COMPOSITION FOR ORGANIC INSULATOR OF HIGH APERTURE LCD ADMS TECHNOLOGY CO. LTD. (KR) 2004-11-11 WO claimed
US-4388434-A ACRYLIC ESTER POLYMERS ROHM AND HAAS COMPANY (US) 1983-06-14 US claimed
CN-110007563-B Negative photosensitive resin composition, spacer, protective film, and liquid crystal display element 奇美实业股份有限公司 2024-04-02 CN disclosed
CN-113423789-B Stabilized printing material 科迪华公司 2023-04-07 CN disclosed
CN-115236939-A Positive photoresist composition for organic insulating film of high-aperture-ratio liquid crystal display element 烟台希尔德材料科技有限公司 2022-10-25 CN disclosed
CN-113423789-A Stabilized printing material 科迪华公司 2021-09-21 CN disclosed
CN-106795396-B Adhesive sheet and method for producing processed product 琳得科株式会社 2020-12-18 CN disclosed
CN-110007563-A Negative photosensitive resin constituent, clearance body, protective film and liquid crystal display element 奇美实业股份有限公司 2019-07-12 CN disclosed
US-9897729-B2 Photosensitive resin composition for color filter and application thereof CHI MEI CORPORATION (TW) 2018-02-20 US disclosed
WO-2004107053-A1 POSITIVE PHOTORESIST COMPOSITION FOR SPINLESS (SLIT) COATING ADMS TECHNOLOGY CO., LTD. (KR) 2004-12-09 WO disclosed
WO-2004097522-A1 NEGATIVE RESIST COMPOSITION FOR ORGANIC INSULATOR OF HIGH APERTURE LCD ADMS TECHNOLOGY CO. LTD. (KR) 2004-11-11 WO disclosed
EP-0618244-B1 Multiple curable composition and use thereof NAT STARCH CHEM INVEST (US) 1998-07-15 EP disclosed
EP-0549116-B1 Method for coating printed circuit boards NAT STARCH CHEM INVEST (US) 1998-02-04 EP disclosed
EP-0618244-A2 Multiple curable composition and use thereof W.R. GRACE & CO.-CONN. (US) 1994-10-05 EP disclosed
US-5234970-A Conformal coatings W. R. GRACE & CO.-CONN. (US) 1993-08-10 US disclosed
EP-0549116-A2 Dual curing composition and use thereof W.R. Grace & Co.-Conn. (US) 1993-06-30 EP disclosed