Ethylamine

Ethylamine

SCHEMBL342520

CCN.CCN.CCN.F.F.F

nearest known ligand 0.33

Full drug profile on Sugi Atlas →

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 8/20 0.33
ALDH1A1 P00352 4/20 0.33
TSHR P16473 2/20 0.33
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33
EPHX1 P07099 1/20 0.33
CYP2D6 P10635 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylamine SCHEMBL4518356 1.00 DNM1 (0.33) DNM1ALDH1A1TSHRMEN1KMT2A
Ethylamine SCHEMBL979530 1.00
Ethylamine SCHEMBL635354 1.00
Ethylamine SCHEMBL28448202 1.00
Ethylamine SCHEMBL342521 1.00
Ethylamine SCHEMBL28351218 0.94 DNM1 (0.31) DNM1ALDH1A1TSHRMEN1KMT2A
Ethylamine SCHEMBL28658917 0.94
Ethylamine SCHEMBL15646032 0.94
Ethylamine SCHEMBL476178 0.94
Ethylamine SCHEMBL5742265 0.94

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 198 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2630187-A1 A SEMICONDUCTIVE POLYOLEFIN COMPOSITION WHICH CONTAINS EPOXY-GROUPS Borealis AG (AT) 2013-08-28 EP claimed
WO-2012052075-A1 A SEMICONDUCTIVE POLYOLEFIN COMPOSITION WHICH CONTAINS EPOXY-GROUPS BOREALIS AG (AT) 2012-04-26 WO claimed
EP-1055699-B1 Epoxy foam precursor NEO EX LAB INC (JP) 2004-08-11 EP claimed
EP-1297048-A1 LOW MOISTURE ABSORPTION EPOXY RESIN SYSTEMS CYTEC TECHNOLOGY CORP. (US) 2003-04-02 EP claimed
US-6379799-B1 CURABLE EPOXIDE REACTION PRODUCT OF PHENOL, DICYCLOPENTADIENE AND EPICHLOROHYDRIN; HEAT RESISTANCE, WATERPROOFING; AEROSPACE CYTEC TECHNOLOGY CORP. 2002-04-30 US claimed
WO-2002002666-A1 LOW MOISTURE ABSORPTION EPOXY RESIN SYSTEMS CYTEC TECHNOLOGY CORP. (US) 2002-01-10 WO claimed
EP-4606867-A1 CURABLE RESIN COMPOSITION Mizuno Corporation (JP) 2025-08-27 EP disclosed
US-20240229304-A9 CARBON FIBER BUNDLE AND PRODUCTION METHOD FOR SAME TORAY INDUSTRIES, INC. (JP) 2024-07-11 US disclosed
WO-2024122254-A1 CURABLE RESIN COMPOSITION 美津濃株式会社 2024-06-13 WO disclosed
EP-4379100-A1 CARBON FIBER BUNDLE AND PRODUCTION METHOD FOR SAME Toray Industries, Inc. (JP) 2024-06-05 EP disclosed
WO-2024090012-A1 CARBON FIBER BUNDLE, TOW-PREG, CARBON FIBER-REINFORCED COMPOSITE MATERIAL AND PRESSURE VESSEL, AND METHOD FOR PRODUCING CARBON FIBER BUNDLE 東レ株式会社 2024-05-02 WO disclosed
US-20240133081-A1 CARBON FIBER BUNDLE AND PRODUCTION METHOD FOR SAME TORAY INDUSTRIES, INC. (JP) 2024-04-25 US disclosed
CN-114667310-B Fiber-reinforced thermoplastic resin molded article 东丽株式会社 2024-04-19 CN disclosed
WO-1996017026-A1 RESIN COMPOSITION FOR POWDER COATING NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 1996-06-06 WO disclosed
US-5356499-A Method for increasing fiber strength translation in composite pressure vessels using matrix resin formulations containing surface acting agents THIOKOL CORPORATION (US) 1994-10-18 US disclosed
US-5348802-A Compressive strength TORAY INDUSTRIES, INC. (JP) 1994-09-20 US disclosed
US-5227237-A Uniform crystal structure, surface smoothness, tensile, bending and compressive strength TORAY INDUSTRIES, INC. (JP) 1993-07-13 US disclosed
US-5011721-A Controlling viscosity THIOKOL CORPORATION (US) 1991-04-30 US disclosed
EP-0378007-A2 Carbon fiber made from acrylic fiber and process for production thereof TORAY INDUSTRIES, INC. (JP) 1990-07-18 EP disclosed
US-4626474-A WITH EPOXY ADHESIVE STAUFFER CHEMICAL COMPANY (US) 1986-12-02 US disclosed