Ethylamine

Ethylamine

SCHEMBL5742265

B.CCN.F.F.F.F

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylamine SCHEMBL6054891 1.00
Ethylamine SCHEMBL28351218 1.00 DNM1 (0.31)
Ethylamine SCHEMBL15646032 1.00
Ethylamine SCHEMBL979530 0.94
Ethylamine SCHEMBL342520 0.94 DNM1 (0.33)
Ethylamine SCHEMBL28448202 0.94
Ethylamine SCHEMBL635354 0.94
Ethylamine SCHEMBL4297060 0.94
Ethylamine SCHEMBL4518356 0.94 DNM1 (0.33)
Ethylamine SCHEMBL342521 0.94

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11939466-B2 Thermoplastic polyester resin composition and molded article TORAY INDUSTRIES, INC. (JP) 2024-03-26 US disclosed
EP-3854849-B1 THERMOPLASTIC POLYESTER RESIN COMPOSITION AND MOLDED ARTICLE TORAY INDUSTRIES (JP) 2023-09-06 EP disclosed
CN-115850765-A Preparation method of toughened high-temperature-resistant epoxy resin prepreg 哈尔滨玻璃钢研究院有限公司 2023-03-28 CN disclosed
CN-115651164-A Phosphorus-containing controllable degradable epoxy resin precursor and preparation method and application thereof 中国科学院宁波材料技术与工程研究所 2023-01-31 CN disclosed
CN-113354920-B High-temperature-resistance epoxy aramid fiber insulating layer, molded part and preparation method thereof 四川东材科技集团股份有限公司 2022-08-12 CN disclosed
CN-113278179-B High-temperature-resistance epoxy glass fiber insulating layer, molded part and preparation method thereof 四川东材科技集团股份有限公司 2022-08-12 CN disclosed
CN-113278180-B High-temperature-resistance epoxy carbon fiber insulating layer, molded part and preparation method thereof 四川东材科技集团股份有限公司 2022-08-12 CN disclosed
CN-109884859-B High-flexibility and high-resolution photosensitive epoxy acrylic resin composition 杭州福斯特电子材料有限公司 2022-06-10 CN disclosed
CN-111040382-B Melamine-epoxy glass fiber pipe and preparation method thereof 四川东材科技集团股份有限公司 2022-06-03 CN disclosed
CN-110554567-B Resin composition and use thereof 浙江福斯特新材料研究院有限公司 2022-04-15 CN disclosed
CN-105793354-B Thermoplastic polyester resin composition and molded product 东丽株式会社 2018-05-29 CN disclosed
EP-0896972-B1 METHOD FOR PRODUCING A SELENIZED TRANSPARENT OPTICAL MATERIAL MITSUI CHEMICALS INC (JP) 2006-11-29 EP disclosed
US-6664364-B2 Selenium-containing transparent optical material MITSUI CHEMICALS, INC. (JP) 2003-12-16 US disclosed
US-20030166830-A1 Selenium-containing transparent optical material OKAZAKI KOJU (JP) 2003-09-04 US disclosed
US-6482918-B2 HIGH REFRACTIVE INDEX, LOW DISPERSION AND EXCELLENT OPTICAL PROPERTY, AND IS USED FOR A GLASSES LENS, CAMERA LENS, PRISM, SUBSTRATE FOR AN INFORMATION RECORDING MEDIUM, PICK UP LENS, OPTICAL FIBER, OPTICAL FILTER MITSUI CHEMICALS, INC. (JP) 2002-11-19 US disclosed
US-20020120097-A1 Selenium-containing transparent optical material OKAZAKI KOJU (JP) 2002-08-29 US disclosed
US-6303747-B1 SELENIUM-CONTAINING POLYTHIOL HAVING 3 OR MORE FUNCTIONAL GROUPS; MONOMERS FOR PREPARING TRANSPARENT OPTICAL MATERIAL WHICH HAS HIGH REFRACTIVE INDEX, LOW DISPERSION AND EXCELLENT OPTICAL PROPERTIES MITSUI CHEMICALS, INC. (JP) 2001-10-16 US disclosed
US-6124424-A A TRANSPARENT OPTICAL LENS IS OBTAINED BY CAST-POLYMERIZING AT LEAST ONE REACTIVE MONOMER OR OLIGOMER HAVING AT LEAST ONE SELENIUM ATOM IN ITS MOLECULE; IMPROVED REFRACTIVE INDEX MITSUI CHEMICALS, INC. (JP) 2000-09-26 US disclosed
EP-0896972-A1 SELENIZED TRANSPARENT OPTICAL MATERIAL Mitsui Chemicals, Inc. (JP) 1999-02-17 EP disclosed
US-4829134-A OXAZOLINE KABUSHIKI KAISHA TOSHIBA (JP) 1989-05-09 US disclosed