SCHEMBL3460030

SCHEMBL3460030

O=S(=O)(O)CCn1nnc2ccccc21

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ EGLN3 Q9H6Z9 1/20 0.62
▸ SLC9A1 P19634 8/20 0.60
▸ RAB9A P51151 3/20 0.57
▸ MAPT P10636 2/20 0.57
▸ NPC1 O15118 1/20 0.57
▸ KDM4E B2RXH2 1/20 0.56
▸ GLA P06280 1/20 0.55
▸ TSHR P16473 1/20 0.55
▸ MGAM O43451 1/20 0.53
▸ AMY1A P0DUB6 1/20 0.53
▸ GAA P10253 1/20 0.53
▸ SI P14410 1/20 0.53
▸ MGAM2 Q2M2H8 1/20 0.53
▸ GRM2 Q14416 1/20 0.51
▸ KCNMA1 Q12791 1/20 0.50
▸ APAF1 O14727 1/20 0.50
▸ POLB P06746 1/20 0.50
▸ ALDH1A1 P00352 1/20 0.49
▸ LMNA P02545 1/20 0.49
▸ KMT2A Q03164 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4346795 0.89 SLC9A1 (0.63) EGLN3SLC9A1RAB9AMAPTNPC1
SCHEMBL27267352 0.85 SLC9A1 (0.63) EGLN3SLC9A1RAB9AMAPTNPC1
SCHEMBL2490329 0.85 SLC9A1 (0.58) EGLN3SLC9A1RAB9AMAPTNPC1
SCHEMBL2800642 0.83 SLC9A1 (0.58) EGLN3SLC9A1RAB9AMAPTNPC1
Sulfuric Acid SCHEMBL31557704 0.80 SLC9A1 (0.83) EGLN3SLC9A1RAB9AMAPTNPC1
SCHEMBL7672465 0.79 SLC9A1 (0.68) EGLN3SLC9A1RAB9AMAPTNPC1
SCHEMBL2936169 0.79 SLC9A1 (0.68) EGLN3SLC9A1RAB9AMAPTNPC1
SCHEMBL14796568 0.78 SLC9A1 (0.79) EGLN3SLC9A1RAB9AMAPTNPC1
SCHEMBL9340128 0.77 SLC9A1 (0.59) EGLN3SLC9A1RAB9AMAPTNPC1
SCHEMBL6885340 0.77 EGLN3 (1.00) EGLN3SLC9A1RAB9AMAPTNPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240213475-A1 ADDITIVE FOR ELECTROLYTE, ELECTROLYTE FOR RECHARGEABLE LITHIUM BATTERY, AND RECHARGEABLE LITHIUM BATTERY INCLUDING THE SAME SAMSUNG SDI CO., LTD. (KR) 2024-06-27 — — US disclosed
US-20240213475-A1 ADDITIVE FOR ELECTROLYTE, ELECTROLYTE FOR RECHARGEABLE LITHIUM BATTERY, AND RECHARGEABLE LITHIUM BATTERY INCLUDING THE SAME SAMSUNG SDI CO., LTD. (KR) 2024-06-27 — — US disclosed
US-9202709-B2 Polishing liquid for metal and polishing method using the same FUJIFILM CORPORATION (JP) 2015-12-01 — — US disclosed
US-9202709-B2 Polishing liquid for metal and polishing method using the same FUJIFILM CORPORATION (JP) 2015-12-01 — — US disclosed
US-8480920-B2 Chemical mechanical polishing aqueous dispersion, method of preparing the same, chemical mechanical polishing aqueous dispersion preparation kit, and chemical mechanical polishing method JSR CORPORATION (JP) 2013-07-09 — — US disclosed
US-8470195-B2 Chemical mechanical polishing aqueous dispersion preparation set, method of preparing chemical mechanical polishing aqueous dispersion, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method JSR CORPORATION (JP) 2013-06-25 — — US disclosed
EP-2017318-B1 Chemical mechanical polishing aqueous dispersion preparation set, method of preparing chemical mechanical polishing aqueous dispersion, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method JSR CORP (JP) 2012-05-30 — — EP disclosed
US-20100252774-A1 CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION, METHOD OF PREPARING THE SAME, CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION PREPARATION KIT, AND CHEMICAL MECHANICAL POLISHING METHOD JSR CORPORATION (JP) 2010-10-07 — — US disclosed
US-20090239380-A1 POLISHING LIQUID FOR METAL AND POLISHING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2009-09-24 — — US disclosed
US-20090239380-A1 POLISHING LIQUID FOR METAL AND POLISHING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2009-09-24 — — US disclosed
EP-2017318-A2 Chemical mechanical polishing aqueous dispersion preparation set, method of preparing chemical mechanical polishing aqueous dispersion, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method JSR Corporation (JP) 2009-01-21 — — EP disclosed
US-20080318427-A1 CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION PREPARATION SET, METHOD OF PREPARING CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION, CHEMICAL MECHANICAL POLISHING AQUEOUS DISPERSION, AND CHEMICAL MECHANICAL POLISHING METHOD JSR CORPORATION (JP) 2008-12-25 — — US disclosed
EP-1724317-B1 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion JSR CORP (JP) 2008-10-22 — — EP disclosed
EP-1700893-B1 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion JSR CORP (JP) 2008-10-01 — — EP disclosed
US-20060276041-A1 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion JSR CORPORATION (JP) 2006-12-07 — — US disclosed
EP-1724317-A1 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion JSR Corporation (JP) 2006-11-22 — — EP disclosed
US-20060201914-A1 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion JSR CORPORATION (JP) 2006-09-14 — — US disclosed
EP-1700893-A1 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion JSR Corporation (JP) 2006-09-13 — — EP disclosed
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