⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19532753 | 0.85 | CA2 (0.38) | — | |
| SCHEMBL786072 | 0.84 | — | — | |
| SCHEMBL7637888 | 0.83 | OPRM1 (0.36) | — | |
| SCHEMBL4437318 | 0.83 | — | — | |
| SCHEMBL22462200 | 0.83 | ALDH1A1 (0.32) | — | |
| SCHEMBL21750612 | 0.81 | ZDHHC7 (0.37) | — | |
| SCHEMBL28510570 | 0.81 | ZDHHC7 (0.37) | — | |
| SCHEMBL22721264 | 0.81 | ZDHHC7 (0.37) | — | |
| Ammonia Solution, Strong SCHEMBL27617745 | 0.81 | OPRM1 (0.34) | — | |
| SCHEMBL28718391 | 0.81 | ZDHHC7 (0.37) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109666115-A | A kind of amino-silane terminated modified polyurethane resin and preparation method thereof | 万华化学集团股份有限公司 | 2019-04-23 | — | — | CN | claimed |
| CN-108047266-A | A kind of preparation method and applications of the load-type ion liquid desulphurization catalyst of organic polymeric support support | 河南科技大学 | 2018-05-18 | — | — | CN | claimed |
| US-20250223451-A1 | COATING COMPOSITIONS OF ISOCYANATES AND BASIC METAL COMPOUNDS | SIKA TECHNOLOGY AG (CH) | 2025-07-10 | — | — | US | disclosed |
| EP-4508107-A1 | COATING COMPOSITIONS OF ISOCYANATES AND BASIC METAL COMPOUNDS | Sika Technology AG (CH) | 2025-02-19 | — | — | EP | disclosed |
| CN-118974125-A | Coating composition of isocyanate and basic metal compound | SIKA技术股份公司 | 2024-11-15 | — | — | CN | disclosed |
| WO-2023198738-A1 | COATING COMPOSITIONS OF ISOCYANATES AND BASIC METAL COMPOUNDS | SIKA TECHNOLOGY AG (CH) | 2023-10-19 | — | — | WO | disclosed |
| CN-108884210-B | Moisture-curable silylated resins derived from polycarbonate diols and coatings, sealants and adhesive compositions containing the same | 莫门蒂夫性能材料股份有限公司 | 2021-11-02 | — | — | CN | disclosed |
| CN-113423790-A | Resin composition and method for producing the same | 迈图高新材料公司 | 2021-09-21 | — | — | CN | disclosed |
| CN-113396174-A | Latent curing agent, method for producing same, composition for forming coating film, and cationically curable composition | 迪睿合株式会社 | 2021-09-14 | — | — | CN | disclosed |
| CN-109666115-A | A kind of amino-silane terminated modified polyurethane resin and preparation method thereof | 万华化学集团股份有限公司 | 2019-04-23 | — | — | CN | disclosed |
| CN-108047266-A | A kind of preparation method and applications of the load-type ion liquid desulphurization catalyst of organic polymeric support support | 河南科技大学 | 2018-05-18 | — | — | CN | disclosed |
| EP-1566417-B1 | COMPOSITION FOR POROUS FILM FORMATION, POROUS FILM, PROCESS FOR PRODUCING THE SAME, INTERLAYER INSULATION FILM AND SEMICONDUCTOR DEVICE | PANASONIC CORP (JP) | 2010-03-24 | — | — | EP | disclosed |
| US-20070087124-A1 | COMPOSITION FOR FORMING POROUS FILM, POROUS FILM AND METHOD FOR FORMING THE SAME, INTERLEVEL INSULATOR FILM, AND SEMICONDUCTOR DEVICE | MATSUSHITA ELECTRIC INDUSTRIAL CO. LTD. (JP) | 2007-04-19 | — | — | US | disclosed |
| US-7126208-B2 | Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2006-10-24 | — | — | US | disclosed |
| EP-1566417-A1 | COMPOSITION FOR POROUS FILM FORMATION, POROUS FILM, PROCESS FOR PRODUCING THE SAME, INTERLAYER INSULATION FILM AND SEMICONDUCTOR DEVICE | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) | 2005-08-24 | — | — | EP | disclosed |
| US-20040232553-A1 | Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. | 2004-11-25 | — | — | US | disclosed |
| US-6221943-B1 | VULCANIZABLE ELASTOMER; TIRE | BRIDGESTONE CORPORATION (JP) | 2001-04-24 | — | — | US | disclosed |