SCHEMBL3473508

SCHEMBL3473508

COC[Si](C)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5036720 0.71
SCHEMBL915334 0.71
SCHEMBL9860469 0.70
SCHEMBL310297 0.69
SCHEMBL514264 0.69
SCHEMBL557237 0.69
SCHEMBL9224470 0.67
SCHEMBL94015 0.67
SCHEMBL758104 0.67
SCHEMBL12244811 0.66

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 74 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7015297-B2 Method of increasing the elasticity of moisture-cured elastomers WACKER-CHEMIE GMBH (DE) 2006-03-21 US claimed
US-20050101753-A1 Method of increasing the elasticity of moisture-cured elastomers WACKER-CHEMIE GMBH (DE) 2005-05-12 US claimed
WO-2025079728-A1 CURABLE COMPOSITION AND CURED PRODUCT 株式会社カネカ 2025-04-17 WO disclosed
US-20240199912-A1 ROOM-TEMPERATURE-CURABLE SILICONE COATING COMPOSITION AND ARTICLE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-06-20 US disclosed
EP-4328261-A1 ROOM-TEMPERATURE-CURABLE SILICONE COATING COMPOSITION AND ARTICLE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-02-28 EP disclosed
WO-2022224885-A1 ROOM-TEMPERATURE-CURABLE SILICONE COATING COMPOSITION AND ARTICLE 信越化学工業株式会社 2022-10-27 WO disclosed
EP-3608365-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2022-08-10 EP disclosed
EP-3098267-B2 CURABLE COMPOSITION KANEKA CORP (JP) 2022-05-25 EP disclosed
WO-2022030470-A1 ROOM TEMPERATURE CURABLE RESIN COMPOSITION, COATING AGENT, ADHESIVE AGENT, SEALING AGENT, AND ARTICLE 信越化学工業株式会社 2022-02-10 WO disclosed
EP-3936569-A1 POLYMER BLEND, COMPOSITION, SEALANT, AND SEALANT FOR TIRE KANEKA CORPORATION (JP) 2022-01-12 EP disclosed
US-20210388204-A1 POLYMER BLEND, COMPOSITION, SEALANT, AND SEALANT FOR TIRE KANEKA CORPORATION (JP) 2021-12-16 US disclosed
EP-1529813-B1 Method for increasing elasticity of moisture curing elastomers WACKER CHEMIE GMBH (DE) 2005-12-21 EP disclosed
CN-1629212-A Method of increasing the elasticity of moisture-cured elastomers WACKER CHEMIE GMBH (DE) 2005-06-22 CN disclosed
US-20050101753-A1 Method of increasing the elasticity of moisture-cured elastomers WACKER-CHEMIE GMBH (DE) 2005-05-12 US disclosed
EP-1529813-A1 Method for increasing elasticity of moisture curing elastomers Wacker-Chemie GmbH (DE) 2005-05-11 EP disclosed
CN-1538993-A Alcoxy cross-linking single-component mosture-hardening materials 电化学工业有限公司(国际) 2004-10-20 CN disclosed
EP-1414909-B1 ALCOXY CROSS-LINKING, SINGLE-COMPONENT, MOISTURE-HARDENING MATERIALS CONSORTIUM ELEKTROCHEM IND (DE) 2004-10-13 EP disclosed
US-20040181025-A1 Alcoxy cross-linking, single-component, moisture-hardening materials WACKER CHEMIE AG (DE) 2004-09-16 US disclosed
EP-1414909-A1 ALCOXY CROSS-LINKING, SINGLE-COMPONENT, MOISTURE-HARDENING MATERIALS Consortium für elektrochemische Industrie GmbH (DE) 2004-05-06 EP disclosed
WO-2003014226-A1 ALCOXY CROSS-LINKING, SINGLE-COMPONENT, MOISTURE-HARDENING MATERIALS Consortium für elektrochemische Industrie GmbH (DE) 2003-02-20 WO disclosed