⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3616783 | 0.89 | — | — | |
| SCHEMBL5415601 | 0.89 | — | — | |
| SCHEMBL5419407 | 0.89 | — | — | |
| SCHEMBL976998 | 0.87 | LMNA (0.32) | — | |
| SCHEMBL2856938 | 0.87 | — | — | |
| SCHEMBL5408553 | 0.87 | — | — | |
| SCHEMBL2739834 | 0.87 | — | — | |
| SCHEMBL704740 | 0.85 | — | — | |
| SCHEMBL646421 | 0.85 | — | — | |
| SCHEMBL18472639 | 0.84 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 494 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250304819-A1 | Flexible and foldable abrasion resistant photopatternable siloxane hard coat | OPTITUNE OY (FI) | 2025-10-02 | — | — | US | claimed |
| CN-120192741-A | Equal-proportion semitransparent bi-component dealcoholized organosilicon sealant for electric kettle and preparation method and application thereof | 广东皓明有机硅材料有限公司 | 2025-06-24 | — | — | CN | claimed |
| US-20240361695-A1 | STRUCTURES INCLUDING A SiOCN PHOTORESIST ADHESION LAYER AND METAL-OXIDE RESIST AND METHODS OF FORMING SAME | ASM IP HOLDING B.V. (NL) | 2024-10-31 | — | — | US | claimed |
| CN-118859631-A | Structure including photoresist adhesive layer and method of forming the same | ASM IP私人控股有限公司 | 2024-10-29 | — | — | CN | claimed |
| US-20240093058-A1 | POLYSILAZANE HARD COATING COMPOSITIONS | MERCK PATENT GMBH (DE) | 2024-03-21 | — | — | US | claimed |
| EP-4307343-A2 | USE OF SILYL BRIDGED ALKYL COMPOUNDS FOR DENSE OSG FILMS | Versum Materials US, LLC (US) | 2024-01-17 | — | — | EP | claimed |
| CN-117343638-A | Porous spin-on dielectric coating materials from silicon-containing polymers | 上海艾深斯科技有限公司 | 2024-01-05 | — | — | CN | claimed |
| EP-4274866-A1 | POLYSILAZANE HARD COATING COMPOSITIONS | Merck Patent GmbH (DE) | 2023-11-15 | — | — | EP | claimed |
| US-20230288810-A1 | METHOD OF FORMING A STRUCTURE COMPRISING A PHOTORESIST UNDERLAYER | ASM IP HOLDING B.V. (NL) | 2023-09-14 | — | — | US | claimed |
| CN-116736637-A | Method of forming a structure comprising a photoresist underlayer | ASM IP私人控股有限公司 | 2023-09-12 | — | — | CN | claimed |
| US-7932295-B2 | Organic silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device | JSR CORPORATION (JP) | 2011-04-26 | — | — | US | claimed |
| US-7875317-B2 | formed by hydrolyzing and condensing a siloxy compound in the presence of a polycarbosilane; low relative dielectric constant and excellent mechanical strength, storage stability, and chemical resistance; semiconductors | JSR CORPORATION (JP) | 2011-01-25 | — | — | US | claimed |
| US-20080246153-A1 | ORGANIC SILICA-BASED FILM, METHOD OF FORMING THE SAME, COMPOSITION FOR FORMING INSULATING FILM FOR SEMICONDUCTOR DEVICE, INTERCONNECT STRUCTURE, AND SEMICONDUCTOR DEVICE | JSR CORPORATION (JP) | 2008-10-09 | — | — | US | claimed |
| US-7399715-B2 | Organic silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device | JSR CORPORATION (JP) | 2008-07-15 | — | — | US | claimed |
| US-20040047988-A1 | Poly(methylsilsesquioxane) copolymers and preparation method thereof | LEE JIN-KYU (KR) | 2004-03-11 | — | — | US | claimed |
| WO-2002040571-A1 | POLY (METHYLSILSESQUIOXANE) COPOLYMERS AND PREPARATION METHOD THEREOF | LEE JIN KYU (KR) | 2002-05-23 | — | — | WO | claimed |
| EP-0653472-B1 | Curable organopolysiloxane composition containing adhesion promoter | DOW CORNING TORAY SILICONE (JP) | 2000-01-19 | — | — | EP | claimed |
| US-5527932-A | REACTION PRODUCT OF AMINE, UNSATURATED EPOXY COMPOUNDS AND SILICON COMPOUND WITH AT LEAST TWO SILICON-BONDED ALKOXY GROUPS | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 1996-06-18 | — | — | US | claimed |
| US-5445891-A | A reaction product of an amine compound with an aliphatically unsaturated epoxy compound | DOW CORNING TORAY SILICONCO., LTD. (JP) | 1995-08-29 | — | — | US | claimed |
| EP-0653472-A2 | Curable organopolysiloxane composition containing adhesion promoter | Dow Corning Toray Silicone Company, Limited (JP) | 1995-05-17 | — | — | EP | claimed |