SCHEMBL915334

SCHEMBL915334

CCO[Si](C)(COC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5596862 0.90
SCHEMBL12458672 0.77
SCHEMBL5862089 0.77
SCHEMBL3871372 0.73
SCHEMBL332696 0.71
SCHEMBL66058 0.71
SCHEMBL135560 0.71
SCHEMBL3473508 0.71
SCHEMBL19809166 0.71
Water SCHEMBL27489244 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12545809-B2 Moisture-curing conformal coating compositions WACKER CHEMIE AG (DE) 2026-02-10 US disclosed
EP-4172246-B1 MOISTURE-CURING CONFORMAL COATING COMPOSITIONS WACKER CHEMIE AG (DE) 2024-08-07 EP disclosed
US-20230279263-A1 MOISTURE-CURING CONFORMAL COATING COMPOSITIONS WACKER CHEMIE AG (DE) 2023-09-07 US disclosed
EP-4172246-A1 MOISTURE-CURING CONFORMAL COATING COMPOSITIONS Wacker Chemie AG (DE) 2023-05-03 EP disclosed
CN-115702188-A Moisture-curable conformal coating composition 瓦克化学股份公司 2023-02-14 CN disclosed
WO-2022030470-A1 ROOM TEMPERATURE CURABLE RESIN COMPOSITION, COATING AGENT, ADHESIVE AGENT, SEALING AGENT, AND ARTICLE 信越化学工業株式会社 2022-02-10 WO disclosed
WO-2021259460-A1 MOISTURE-CURING CONFORMAL COATING COMPOSITIONS WACKER CHEMIE AG (DE) 2021-12-30 WO disclosed
US-8951711-B2 Patterning process and composition for forming silicon-containing film usable therefor SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-02-10 US disclosed
US-20140342289-A1 PATTERNING PROCESS AND COMPOSITION FOR FORMING SILICON-CONTAINING FILM USABLE THEREFOR SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-11-20 US disclosed
US-8835102-B2 Patterning process and composition for forming silicon-containing film usable therefor SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-09-16 US disclosed
WO-2006119916-A1 METHOD FOR PRODUCING CROSSLINKABLE ORGANOPOLYSILOXANE DISPERSIONS WACKER CHEMIE AG (DE) 2006-11-16 WO disclosed
US-20060258820-A1 Process for preparing dispersions of crosslinked organopolysiloxanes WACKER CHEMIE AG (DE) 2006-11-16 US disclosed
EP-1721926-A1 Process for the production of dispersions of cross linked organopolysiloxanes Wacker Chemie AG (DE) 2006-11-15 EP disclosed
CN-1861664-A Process for the production of dispersions of cross linked organopolysiloxanes WACKER CHEMIE AG (DE) 2006-11-15 CN disclosed
US-7126020-B2 Reactions rapidly complete or proceeds at low temperature such as room temperature; highly viscous and stable products with Si C-bonded radicals containing basic nitrogen WACKER CHEMIE AG (DE) 2006-10-24 US disclosed
EP-1541615-B1 Method for the production of highly viscous organopolysiloxanes WACKER CHEMIE AG (DE) 2006-03-22 EP disclosed
WO-2006015740-A1 METHOD FOR THE PRODUCTION OF EMULSIONS OF HIGHLY-VISCOUS ORGANOPOLYSILOXANES WACKER CHEMIE AG (DE) 2006-02-16 WO disclosed
CN-1637046-A Method for the production of highly viscous organopolysiloxanes WACKER CHEMIE GMBH (DE) 2005-07-13 CN disclosed
US-20050131243-A1 Process for preparing highly viscous organopolysiloxanes WACKER-CHEMIE GMBH (DE) 2005-06-16 US disclosed
EP-1541615-A1 Method for the production of highly viscous organopolysiloxanes Wacker-Chemie GmbH (DE) 2005-06-15 EP disclosed