SCHEMBL348056

SCHEMBL348056

CC(C)(c1ccc(Oc2ccc(N3C(=O)C=CC3=O)cc2)c(Cl)c1)c1ccc(Oc2ccc(N3C(=O)C=CC3=O)cc2)c(Cl)c1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 8/20 0.47
FAAH O00519 1/20 0.40
FFAR1 O14842 2/20 0.39
ALDH1A1 P00352 3/20 0.39
HSP90AA1 P07900 2/20 0.39
PKM P14618 2/20 0.39
CCR6 P51684 2/20 0.39
LMNA P02545 2/20 0.39
HPGD P15428 2/20 0.39
HTT P42858 2/20 0.39
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
ATM Q13315 1/20 0.39
MAPT P10636 2/20 0.38
NPSR1 Q6W5P4 2/20 0.38
MAPK1 P28482 1/20 0.38
RAB9A P51151 1/20 0.38
CACNA1B Q00975 1/20 0.38
APBA1 Q02410 1/20 0.38
APOBEC3G Q9HC16 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8732715 0.86 MGLL (0.49) MGLLFAAHALDH1A1HSP90AA1PKM
SCHEMBL30194282 0.84 MGLL (0.53) MGLLFAAHALDH1A1HSP90AA1PKM
SCHEMBL1259749 0.84 MGLL (0.47) MGLLFAAHALDH1A1HSP90AA1PKM
SCHEMBL349156 0.84 MGLL (0.53) MGLLFAAHALDH1A1HSP90AA1PKM
SCHEMBL348030 0.84 MGLL (0.47) MGLLFAAHALDH1A1HSP90AA1PKM
SCHEMBL8735708 0.84 MGLL (0.47) MGLLFAAHALDH1A1HSP90AA1PKM
SCHEMBL349441 0.83 MGLL (0.46) MGLLFAAHALDH1A1HSP90AA1PKM
SCHEMBL8767472 0.82 MGLL (0.53) MGLLFAAHALDH1A1HSP90AA1PKM
SCHEMBL347850 0.82 MGLL (0.44) MGLLFAAHALDH1A1HSP90AA1PKM
SCHEMBL8730168 0.82 MGLL (0.44) MGLLFAAHALDH1A1HSP90AA1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240006183-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING AMIDE SOLVENT NISSAN CHEMICAL CORPORATION (JP) 2024-01-04 US disclosed
US-11798810-B2 Resist underlayer film-forming composition containing amide solvent NISSAN CHEMICAL CORPORATION (JP) 2023-10-24 US disclosed
US-20190354018-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING AMIDE SOLVENT NISSAN CHEMICAL CORPORATION (JP) 2019-11-21 US disclosed
US-20190203048-A1 Maleimide Resin Composition, Prepreg, Cured Product Of Same And Semiconductor Device NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2019-07-04 US disclosed
US-8785567-B2 Liquid crystal alignment agent, film and display element CHI MEI CORPORATION (TW) 2014-07-22 US disclosed
EP-1646486-B1 Process for preparing medical devices BOSTON SCIENT LTD (BB) 2012-02-22 EP disclosed
US-20120013043-A1 MEDICAL DEVICES AND PROCESSES FOR PREPARING SAME BOSTON SCIENTIFIC SCIMED, INC. (US) 2012-01-19 US disclosed
US-8025637-B2 Medical balloons and processes for preparing same BOSTON SCIENTIFIC SCIMED, INC. (US) 2011-09-27 US disclosed
US-7649027-B2 having juts via photopolymerization in supercritical carbon dioxide; calcining KANSAI PAINT CO., LTD. (JP) 2010-01-19 US disclosed
US-20090023830-A1 POLYMER AND PROCESS FOR PRODUCING POLYMER KANSAI PAINT CO., LTD. (JP) 2009-01-22 US disclosed
WO-2005007375-A2 MEDICAL DEVICES AND PROCESSES FOR PREPARING SAME BOSTON SCIENTIFIC LIMITED (BB) 2005-01-27 WO disclosed
US-20050015046-A1 Medical devices and processes for preparing same SCIMED LIFE SYSTEMS, INC. (US) 2005-01-20 US disclosed
US-20020151659-A1 Formed from 6,6'-bis(2-(4-fluorophenyl)-4- phenylquinoline) and 4,4'-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol and 2,2-bis((4-maleimidophenoxy)phenyl)propane; dielectrics HITACHI CHEMICAL CO., LTD. (JP) 2002-10-17 US disclosed
US-6462148-B1 RESIN COMPOSITION COMPRISING A POLYMER CONTAINING A QUINOLINE RING AND A THERMOSETTING RESIN, AN INSULATING MATERIAL CONSTITUTED BY SAID RESIN COMPOSITION AND AN ADHESIVE FILM, PARTICULARLY A RESIN FOR AN INTERLAYER INSULATION FILM HITACHI CHEMICAL CO., LTD. (JP) 2002-10-08 US disclosed
US-6132852-A LAMINATE OF POLYMER CONDUCTOR AND DIELECTRIC HITACHI, LTD. (JP) 2000-10-17 US disclosed
EP-0618269-B1 Thermosetting resin compositions and their use for making resin articles and thin film wiring boards HITACHI LTD (JP) 1998-11-11 EP disclosed
EP-0755979-A2 Thermosetting resin compositions and their use for thin film wiring boards HITACHI, LTD. (JP) 1997-01-29 EP disclosed
EP-0476589-B1 Multi-layer wiring substrate and production thereof HITACHI LTD (JP) 1996-06-12 EP disclosed
EP-0618269-A1 Thermosetting resin compositions and their use for thin film wiring boards HITACHI, LTD. (JP) 1994-10-05 EP disclosed
EP-0476589-A2 Multi-layer wiring substrate and production thereof HITACHI, LTD. (JP) 1992-03-25 EP disclosed