Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 14/20 | 0.46 |
| ▸ | FAAH | O00519 | 5/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.38 |
| ▸ | HSP90AA1 | P07900 | 2/20 | 0.38 |
| ▸ | HPGD | P15428 | 2/20 | 0.38 |
| ▸ | HTT | P42858 | 2/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.38 |
| ▸ | PKM | P14618 | 1/20 | 0.38 |
| ▸ | CCR6 | P51684 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | ATM | Q13315 | 1/20 | 0.38 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.38 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.38 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.38 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.38 |
| ▸ | G6PD | P11413 | 1/20 | 0.37 |
| ▸ | TLR9 | Q9NR96 | 1/20 | 0.37 |
| ▸ | HTR2A | P28223 | 1/20 | 0.36 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31314481 | 0.91 | MGLL (0.46) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL350368 | 0.91 | MGLL (0.46) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL30394499 | 0.89 | MGLL (0.43) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL194671 | 0.89 | MGLL (0.43) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL14891696 | 0.86 | MGLL (0.43) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL30806244 | 0.86 | MGLL (0.43) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL8732715 | 0.85 | MGLL (0.49) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL28608624 | 0.84 | MGLL (0.41) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL348030 | 0.83 | MGLL (0.47) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL348056 | 0.83 | MGLL (0.47) | MGLLFAAHALDH1A1HSP90AA1HPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0449292-B1 | Multilayer printed circuit board and production thereof | HITACHI LTD (JP) | 1997-08-20 | — | — | EP | claimed |
| US-12504687-B2 | Curable photosensitive resin composition, cured product, resist pattern, method of producing resist pattern, semiconductor device and electronic device | ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) | 2025-12-23 | — | — | US | disclosed |
| CN-117700990-A | Resin composition, adhesive, coating agent, cured product, adhesive sheet, resin-coated copper foil, copper-clad laminate, and printed wiring board | 荒川化学工业株式会社 | 2024-03-15 | — | — | CN | disclosed |
| US-20240006183-A1 | RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING AMIDE SOLVENT | NISSAN CHEMICAL CORPORATION (JP) | 2024-01-04 | — | — | US | disclosed |
| US-11798810-B2 | Resist underlayer film-forming composition containing amide solvent | NISSAN CHEMICAL CORPORATION (JP) | 2023-10-24 | — | — | US | disclosed |
| CN-115877658-A | Curable photosensitive resin composition, cured product, resist pattern and method for producing same, semiconductor element, and electronic device | 荒川化学工业株式会社 | 2023-03-31 | — | — | CN | disclosed |
| US-20230101181-A1 | CURABLE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, RESIST PATTERN, METHOD OF PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) | 2023-03-30 | — | — | US | disclosed |
| CN-113156762-A | Photosensitive resin composition, dry film, cured product and printed wiring board | 日本化药株式会社 | 2021-07-23 | — | — | CN | disclosed |
| US-20190354018-A1 | RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING AMIDE SOLVENT | NISSAN CHEMICAL CORPORATION (JP) | 2019-11-21 | — | — | US | disclosed |
| US-20190203048-A1 | Maleimide Resin Composition, Prepreg, Cured Product Of Same And Semiconductor Device | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2019-07-04 | — | — | US | disclosed |
| US-6132852-A | LAMINATE OF POLYMER CONDUCTOR AND DIELECTRIC | HITACHI, LTD. (JP) | 2000-10-17 | — | — | US | disclosed |
| EP-0618269-B1 | Thermosetting resin compositions and their use for making resin articles and thin film wiring boards | HITACHI LTD (JP) | 1998-11-11 | — | — | EP | disclosed |
| EP-0449292-B1 | Multilayer printed circuit board and production thereof | HITACHI LTD (JP) | 1997-08-20 | — | — | EP | disclosed |
| EP-0755979-A2 | Thermosetting resin compositions and their use for thin film wiring boards | HITACHI, LTD. (JP) | 1997-01-29 | — | — | EP | disclosed |
| EP-0476589-B1 | Multi-layer wiring substrate and production thereof | HITACHI LTD (JP) | 1996-06-12 | — | — | EP | disclosed |
| EP-0618269-A1 | Thermosetting resin compositions and their use for thin film wiring boards | HITACHI, LTD. (JP) | 1994-10-05 | — | — | EP | disclosed |
| US-5352762-A | Fluorine-containing biscyanamide thermosetting resin, heat resistance, adhesion | HITACHI, LTD. (JP) | 1994-10-04 | — | — | US | disclosed |
| US-5225499-A | Molding materials of epoxy resins and ether imides | HITACHI, LTD. (JP) | 1993-07-06 | — | — | US | disclosed |
| EP-0476589-A2 | Multi-layer wiring substrate and production thereof | HITACHI, LTD. (JP) | 1992-03-25 | — | — | EP | disclosed |
| EP-0449292-A2 | Multilayer printed circuit board and production thereof | HITACHI, LTD. (JP) | 1991-10-02 | — | — | EP | disclosed |