Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 6/20 | 0.53 |
| ▸ | G6PD | P11413 | 1/20 | 0.47 |
| ▸ | TLR9 | Q9NR96 | 1/20 | 0.47 |
| ▸ | MEN1 | O00255 | 3/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.41 |
| ▸ | NTRK1 | P04629 | 1/20 | 0.40 |
| ▸ | IGF1R | P08069 | 1/20 | 0.40 |
| ▸ | FGFR1 | P11362 | 1/20 | 0.40 |
| ▸ | NTRK2 | Q16620 | 1/20 | 0.40 |
| ▸ | FAAH | O00519 | 1/20 | 0.40 |
| ▸ | HTT | P42858 | 2/20 | 0.39 |
| ▸ | LMNA | P02545 | 2/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.39 |
| ▸ | PKM | P14618 | 1/20 | 0.39 |
| ▸ | HPGD | P15428 | 1/20 | 0.39 |
| ▸ | CCR6 | P51684 | 1/20 | 0.39 |
| ▸ | ATM | Q13315 | 1/20 | 0.39 |
| ▸ | AR | P10275 | 1/20 | 0.38 |
| ▸ | FGFR2 | P21802 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30194282 | 1.00 | MGLL (0.53) | MGLLG6PDTLR9MEN1KMT2A | |
| SCHEMBL8732715 | 0.86 | MGLL (0.49) | MGLLG6PDTLR9MEN1KMT2A | |
| SCHEMBL8735708 | 0.84 | MGLL (0.47) | MGLLG6PDTLR9MEN1KMT2A | |
| SCHEMBL348056 | 0.84 | MGLL (0.47) | MGLLG6PDTLR9MEN1KMT2A | |
| SCHEMBL1259749 | 0.84 | MGLL (0.47) | MGLLG6PDTLR9MEN1KMT2A | |
| SCHEMBL348030 | 0.84 | MGLL (0.47) | MGLLG6PDTLR9MEN1KMT2A | |
| SCHEMBL349441 | 0.83 | MGLL (0.46) | MGLLG6PDTLR9MEN1KMT2A | |
| SCHEMBL347850 | 0.82 | MGLL (0.44) | MGLLG6PDTLR9MEN1KMT2A | |
| SCHEMBL8730168 | 0.82 | MGLL (0.44) | MGLLG6PDTLR9MEN1KMT2A | |
| SCHEMBL24541383 | 0.82 | MGLL (0.70) | MGLLG6PDTLR9MEN1KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115926379-A | Non-covalent modified boron nitride/epoxy resin heat-conducting and insulating composite material and preparation method thereof | 江南大学 | 2023-04-07 | — | — | CN | claimed |
| CN-113845775-B | Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material | 江南大学 | 2022-06-21 | — | — | CN | claimed |
| CN-113845775-A | Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material | 江南大学 | 2021-12-28 | — | — | CN | claimed |
| EP-0449292-B1 | Multilayer printed circuit board and production thereof | HITACHI LTD (JP) | 1997-08-20 | — | — | EP | claimed |
| US-20240006183-A1 | RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING AMIDE SOLVENT | NISSAN CHEMICAL CORPORATION (JP) | 2024-01-04 | — | — | US | disclosed |
| US-11798810-B2 | Resist underlayer film-forming composition containing amide solvent | NISSAN CHEMICAL CORPORATION (JP) | 2023-10-24 | — | — | US | disclosed |
| CN-116444796-A | Toughening agent, preparation method thereof and bismaleimide resin composition | 江南大学 | 2023-07-18 | — | — | CN | disclosed |
| CN-116285211-A | Bismaleimide resin composition for packaging third-generation semiconductor power device | 无锡创达新材料股份有限公司 | 2023-06-23 | — | — | CN | disclosed |
| CN-115926379-A | Non-covalent modified boron nitride/epoxy resin heat-conducting and insulating composite material and preparation method thereof | 江南大学 | 2023-04-07 | — | — | CN | disclosed |
| CN-114836034-B | Bismaleimide resin composition and application thereof | 江南大学 | 2023-02-17 | — | — | CN | disclosed |
| CN-111978726-B | Thermosetting resin composition and preparation method and application thereof | 江南大学 | 2022-09-16 | — | — | CN | disclosed |
| CN-114836034-A | Bismaleimide resin composition and application thereof | 江南大学 | 2022-08-02 | — | — | CN | disclosed |
| EP-0449292-B1 | Multilayer printed circuit board and production thereof | HITACHI LTD (JP) | 1997-08-20 | — | — | EP | disclosed |
| EP-0755979-A2 | Thermosetting resin compositions and their use for thin film wiring boards | HITACHI, LTD. (JP) | 1997-01-29 | — | — | EP | disclosed |
| EP-0476589-B1 | Multi-layer wiring substrate and production thereof | HITACHI LTD (JP) | 1996-06-12 | — | — | EP | disclosed |
| EP-0618269-A1 | Thermosetting resin compositions and their use for thin film wiring boards | HITACHI, LTD. (JP) | 1994-10-05 | — | — | EP | disclosed |
| US-5352762-A | Fluorine-containing biscyanamide thermosetting resin, heat resistance, adhesion | HITACHI, LTD. (JP) | 1994-10-04 | — | — | US | disclosed |
| US-5225499-A | Molding materials of epoxy resins and ether imides | HITACHI, LTD. (JP) | 1993-07-06 | — | — | US | disclosed |
| EP-0476589-A2 | Multi-layer wiring substrate and production thereof | HITACHI, LTD. (JP) | 1992-03-25 | — | — | EP | disclosed |
| EP-0449292-A2 | Multilayer printed circuit board and production thereof | HITACHI, LTD. (JP) | 1991-10-02 | — | — | EP | disclosed |