Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TRPA1 | O75762 | 4/20 | 0.52 |
| ▸ | TAAR1 | Q96RJ0 | 3/20 | 0.48 |
| ▸ | AOC3 | Q16853 | 2/20 | 0.44 |
| ▸ | RIPK1 | Q13546 | 1/20 | 0.42 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.40 |
| ▸ | GFER | P55789 | 1/20 | 0.40 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.40 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29192824 | 0.83 | TRPA1 (0.55) | TRPA1TAAR1AOC3RIPK1KDM4E | |
| SCHEMBL3672929 | 0.79 | TRPA1 (0.67) | TRPA1TAAR1AOC3RIPK1KDM4E | |
| SCHEMBL3482593 | 0.79 | TRPA1 (0.51) | TRPA1TAAR1AOC3RIPK1ALDH1A1 | |
| SCHEMBL9579271 | 0.75 | TRPA1 (0.61) | TRPA1TAAR1AOC3RIPK1KDM4E | |
| SCHEMBL3864354 | 0.75 | TRPA1 (0.61) | TRPA1TAAR1AOC3RIPK1CYP2D6 | |
| SCHEMBL508412 | 0.75 | TRPA1 (0.61) | TRPA1TAAR1AOC3RIPK1KDM4E | |
| SCHEMBL6268405 | 0.74 | TAAR1 (0.52) | TRPA1TAAR1AOC3RIPK1KDM4E | |
| SCHEMBL3674520 | 0.73 | TRPA1 (0.59) | TRPA1TAAR1AOC3RIPK1KDM4E | |
| SCHEMBL17038679 | 0.73 | TRPA1 (0.59) | TRPA1TAAR1AOC3RIPK1KDM4E | |
| Hydrogen Peroxide SCHEMBL11213135 | 0.73 | TRPA1 (0.65) | TRPA1TAAR1AOC3RIPK1KDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |