SCHEMBL3481983

SCHEMBL3481983

CCc1ccc([SiH](Cl)c2ccccc2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.54
ALDH1A1 P00352 2/20 0.43
CYP2A6 P11509 2/20 0.39
CYP1A2 P05177 1/20 0.39
KDM1A O60341 1/20 0.39
MAPK1 P28482 2/20 0.38
L3MBTL1 Q9Y468 2/20 0.38
TSHR P16473 1/20 0.38
ATM Q13315 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
RAB9A P51151 4/20 0.37
NPC1 O15118 2/20 0.37
KDM4E B2RXH2 1/20 0.37
KIF11 P52732 2/20 0.37
TAAR1 Q96RJ0 1/20 0.37
LPL P06858 1/20 0.35
LIPG Q9Y5X9 1/20 0.35
MGLL Q99685 1/20 0.35
SMN1; SMN2 Q16637 2/20 0.35
POLB P06746 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27887297 0.82 TP53 (0.59) TP53ALDH1A1CYP2A6CYP1A2KDM1A
SCHEMBL27949736 0.80 HSD11B1 (0.46) TP53ALDH1A1KDM4ESMN1; SMN2LMNA
SCHEMBL10319291 0.79 TP53 (0.50) TP53ALDH1A1CYP2A6CYP1A2KDM1A
Ethylbenzene SCHEMBL306950 0.79 TP53 (0.78) TP53ALDH1A1CYP2A6CYP1A2MAPK1
SCHEMBL3481968 0.78 TP53 (0.54) TP53ALDH1A1CYP2A6CYP1A2RAB9A
SCHEMBL297217 0.78 TSHR (0.39) ALDH1A1CYP1A2TSHRTDP1MGLL
Ethylbenzene SCHEMBL27961581 0.77 TP53 (0.74) TP53ALDH1A1CYP2A6CYP1A2MAPK1
Ethylbenzene SCHEMBL8832672 0.77 TP53 (0.74) TP53ALDH1A1CYP2A6CYP1A2MAPK1
Ethylbenzene SCHEMBL27405402 0.75 TP53 (0.93) TP53ALDH1A1CYP2A6CYP1A2TSHR
Water SCHEMBL9174447 0.75 TSHR (0.37) ALDH1A1CYP1A2TSHRTDP1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed