Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NR1H2 | P55055 | 2/20 | 0.33 |
| ▸ | NR1H3 | Q13133 | 2/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15091606 | 0.68 | NR1H2 (0.33) | NR1H2NR1H3ALDH1A1TSHR | |
| SCHEMBL1049841 | 0.63 | ALDH1A1 (0.41) | NR1H2NR1H3ALDH1A1TSHR | |
| SCHEMBL1053231 | 0.63 | ALDH1A1 (0.41) | NR1H2NR1H3ALDH1A1TSHR | |
| SCHEMBL1051334 | 0.63 | ALDH1A1 (0.41) | NR1H2NR1H3ALDH1A1TSHR | |
| SCHEMBL7737242 | 0.61 | NR1H2 (0.32) | NR1H2NR1H3ALDH1A1TSHR | |
| SCHEMBL10607287 | 0.60 | — | — | |
| SCHEMBL509827 | 0.60 | NR1H2 (0.33) | NR1H2NR1H3ALDH1A1TSHR | |
| SCHEMBL25284860 | 0.60 | MAPT (0.44) | NR1H2NR1H3TSHR | |
| SCHEMBL23701389 | 0.60 | ALDH1A1 (0.38) | NR1H2NR1H3ALDH1A1TSHR | |
| SCHEMBL21438997 | 0.60 | TSHR (0.38) | NR1H2NR1H3ALDH1A1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| CN-101641767-B | Silicon dielectric treating agent for use after etching, process for producing semiconductor device, and semiconductor device | FUJITSU LTD | 2013-10-30 | — | — | CN | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| EP-0452725-B1 | Fluorine containing diaminobenzene derivatives and its use | SAGAMI CHEM RES (JP) | 1995-11-08 | — | — | EP | disclosed |
| EP-0635533-A1 | Polyimide-based liquid crystal aligning agent | SAGAMI CHEMICAL RESEARCH CENTER (JP) | 1995-01-25 | — | — | EP | disclosed |
| US-5153304-A | Polyimides; liquid crystal tilting agent; water-repelling | SAGAMI CHEMICAL RESEARCH CENTER (JP) | 1992-10-06 | — | — | US | disclosed |
| US-5144078-A | Polyimide intermediates | SAGAMI CHEMICAL RESEARCH CENTER (JP) | 1992-09-01 | — | — | US | disclosed |
| US-5140087-A | Endcapped by a polyfluoroalkylsilanol at one end and a silanol at the other; molecular weight distribution; silicone rubbers; oil repellants | CHISSO CORPORATION (JP) | 1992-08-18 | — | — | US | disclosed |
| EP-0452725-A2 | Fluorine containing diaminobenzene derivatives and its use | SAGAMI CHEMICAL RESEARCH CENTER (JP) | 1991-10-23 | — | — | EP | disclosed |
| US-5047491-A | Molding materials; waterproofing, oil repellents, antifouling agents | CHISSO CORPORATION (JP) | 1991-09-10 | — | — | US | disclosed |
| US-4996280-A | Polyorganosiloxane compounds with amino group | CHISSO CORPORATION (JP) | 1991-02-26 | — | — | US | disclosed |
| US-4992521-A | Oil and water repellency, stain and heat resistance, release properties | CHISSO CORPORATION (JP) | 1991-02-12 | — | — | US | disclosed |
| US-4987203-A | Modifier of properties of epoxy resins, polyamides or polyurethanes | CHISSO CORPORATION (JP) | 1991-01-22 | — | — | US | disclosed |
| EP-0355497-A2 | Polyorganosiloxane compounds | Chisso Corporation (JP) | 1990-02-28 | — | — | EP | disclosed |
| EP-0353709-A2 | Polyorganosiloxane compounds with amino group | Chisso Corporation (JP) | 1990-02-07 | — | — | EP | disclosed |
| EP-0338577-A2 | Organosiloxane and process for preparing the same | Chisso Corporation (JP) | 1989-10-25 | — | — | EP | disclosed |