SCHEMBL3483316

SCHEMBL3483316

COCC(COC)OC(COC)COC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17280903 0.83 TSHR (0.32)
SCHEMBL13986705 0.83
SCHEMBL3483490 0.83 TSHR (0.35)
SCHEMBL19638069 0.83 USP2 (0.30)
SCHEMBL20445508 0.83
SCHEMBL8071629 0.81 MAPK1 (0.36)
SCHEMBL11276459 0.78 ROCK2 (0.30)
SCHEMBL17280902 0.78 TSHR (0.32)
SCHEMBL19401567 0.78
SCHEMBL51157 0.77

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240060004-A1 DETERGENT COMPOSITION FOR FIBERS KAO CORPORATION (JP) 2024-02-22 US disclosed
US-20240052261-A1 DETERGENT COMPOSITION FOR FIBERS KAO CORPORATION (JP) 2024-02-15 US disclosed
EP-4269680-A1 DETERGENT COMPOSITION FOR TEXTILES Kao Corporation (JP) 2023-11-01 EP disclosed
EP-4269547-A1 DETERGENT COMPOSITION FOR FIBERS Kao Corporation (JP) 2023-11-01 EP disclosed
US-20220025307-A1 WIPING DETERGENT COMPOSITION FOR TEXTILE PRODUCTS KAO CORPORATION (JP) 2022-01-27 US disclosed
EP-3904585-A1 WIPING DETERGENT COMPOSITION FOR FIBER PRODUCT Kao Corporation (JP) 2021-11-03 EP disclosed
WO-2021079798-A1 WIPE MATERIAL 花王株式会社 2021-04-29 WO disclosed
WO-2020138001-A1 WIPING DETERGENT COMPOSITION FOR FIBER PRODUCT 花王株式会社 2020-07-02 WO disclosed
WO-2020138002-A1 WIPING DETERGENT SHEET FOR FIBER PRODUCT 花王株式会社 2020-07-02 WO disclosed
CN-110418828-A Composition for heat cycle system and heat cycle system AGC INC 2019-11-05 CN disclosed
US-20170037299-A1 NONIONIC INVERSION AGENTS FOR WATER-IN-OIL LATICES AND METHODS OF USE NORRISEAL-WELLMARK, INC. 2017-02-09 US disclosed
EP-2727980-A1 LUBRICANT OIL COMPOSITION FOR COMPRESSION REFRIGERATOR Idemitsu Kosan Co., Ltd (JP) 2014-05-07 EP disclosed
US-8217115-B2 Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor package SUMITOMO BAKELITE COMPANY, LTD (JP) 2012-07-10 US disclosed
US-20100006998-A1 LIQUID RESIN COMPOSITION, SEMICONDUCTOR WAFER HAVING ADHESIVE LAYER, SEMICONDUCTOR ELEMENT HAVING ADHESIVE LAYER, SEMICONDUCTOR PACKAGE, PROCESS FOR MANUFACTURING SEMICONDUCTOR ELEMENT AND PROCESS FOR MANUFACTURING SEMICONDUCTOR PACKAGE SUMITOMO BAKELITE CO., LTD. (JP) 2010-01-14 US disclosed