Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.35 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.35 |
| ▸ | PRKCA | P17252 | 1/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12808882 | 0.86 | TSHR (0.33) | TSHRCYP2C9PRKCATDP1 | |
| SCHEMBL15426519 | 0.84 | PRKCA (0.32) | TSHRCYP2C9PRKCATDP1 | |
| SCHEMBL27721131 | 0.84 | TSHR (0.32) | TSHRCYP2C9TDP1 | |
| Hydrochloric Acid SCHEMBL5710062 | 0.83 | ALDH1A1 (0.37) | — | |
| Hydrochloric Acid SCHEMBL5710195 | 0.83 | ALDH1A1 (0.37) | — | |
| SCHEMBL3483316 | 0.83 | — | — | |
| SCHEMBL10067038 | 0.82 | CYP2C9 (0.34) | TSHRCYP2C9 | |
| SCHEMBL5719 | 0.81 | — | — | |
| SCHEMBL14007344 | 0.81 | — | — | |
| SCHEMBL6041979 | 0.81 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240060004-A1 | DETERGENT COMPOSITION FOR FIBERS | KAO CORPORATION (JP) | 2024-02-22 | — | — | US | disclosed |
| US-20240052261-A1 | DETERGENT COMPOSITION FOR FIBERS | KAO CORPORATION (JP) | 2024-02-15 | — | — | US | disclosed |
| EP-4269547-A1 | DETERGENT COMPOSITION FOR FIBERS | Kao Corporation (JP) | 2023-11-01 | — | — | EP | disclosed |
| EP-4269680-A1 | DETERGENT COMPOSITION FOR TEXTILES | Kao Corporation (JP) | 2023-11-01 | — | — | EP | disclosed |
| WO-2023120235-A1 | CLEANING AGENT COMPOSITION | 花王株式会社 | 2023-06-29 | — | — | WO | disclosed |
| WO-2023120236-A1 | DETERGENT COMPOSITION FOR RIGID ARTICLE | 花王株式会社 | 2023-06-29 | — | — | WO | disclosed |
| US-20220025307-A1 | WIPING DETERGENT COMPOSITION FOR TEXTILE PRODUCTS | KAO CORPORATION (JP) | 2022-01-27 | — | — | US | disclosed |
| EP-3904585-A1 | WIPING DETERGENT COMPOSITION FOR FIBER PRODUCT | Kao Corporation (JP) | 2021-11-03 | — | — | EP | disclosed |
| WO-2021079798-A1 | WIPE MATERIAL | 花王株式会社 | 2021-04-29 | — | — | WO | disclosed |
| WO-2020138001-A1 | WIPING DETERGENT COMPOSITION FOR FIBER PRODUCT | 花王株式会社 | 2020-07-02 | — | — | WO | disclosed |
| WO-2020138002-A1 | WIPING DETERGENT SHEET FOR FIBER PRODUCT | 花王株式会社 | 2020-07-02 | — | — | WO | disclosed |
| CN-109312278-A | liquid detergent composition | 花王株式会社 | 2019-02-05 | — | — | CN | disclosed |
| CN-109219651-A | Liquid detergent composition for fiber products | 花王株式会社 | 2019-01-15 | — | — | CN | disclosed |
| CN-109196082-A | Liquid detergent composition for fiber products | 花王株式会社 | 2019-01-11 | — | — | CN | disclosed |
| US-8217115-B2 | Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor package | SUMITOMO BAKELITE COMPANY, LTD (JP) | 2012-07-10 | — | — | US | disclosed |
| CN-101536172-B | Liquid resin composition, semiconductor wafer with adhesive layer, semiconductor element with adhesive layer, package and method for manufacturing the same | SUMITOMO BAKELITE CO | 2012-05-30 | — | — | CN | disclosed |
| US-20100006998-A1 | LIQUID RESIN COMPOSITION, SEMICONDUCTOR WAFER HAVING ADHESIVE LAYER, SEMICONDUCTOR ELEMENT HAVING ADHESIVE LAYER, SEMICONDUCTOR PACKAGE, PROCESS FOR MANUFACTURING SEMICONDUCTOR ELEMENT AND PROCESS FOR MANUFACTURING SEMICONDUCTOR PACKAGE | SUMITOMO BAKELITE CO., LTD. (JP) | 2010-01-14 | — | — | US | disclosed |
| CN-101536172-A | Liquid resin composition, semiconductor wafer with adhesive layer, semiconductor element with adhesive layer, semiconductor package, method for manufacturing semiconductor element, and method for manu | SUMITOMO BAKELITE CO (JP) | 2009-09-16 | — | — | CN | disclosed |
| CN-100414038-C | Fiber product treating agent composition | KAO CORP (JP) | 2008-08-27 | — | — | CN | disclosed |
| CN-1829838-A | Fiber product treating agent composition | KAO CORP (JP) | 2006-09-06 | — | — | CN | disclosed |