Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 16/20 | 0.63 |
| ▸ | HSP90AA1 | P07900 | 3/20 | 0.49 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.49 |
| ▸ | HPGD | P15428 | 2/20 | 0.49 |
| ▸ | HTT | P42858 | 2/20 | 0.49 |
| ▸ | PKM | P14618 | 2/20 | 0.49 |
| ▸ | LMNA | P02545 | 2/20 | 0.49 |
| ▸ | MEN1 | O00255 | 1/20 | 0.49 |
| ▸ | CCR6 | P51684 | 1/20 | 0.49 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.49 |
| ▸ | ATM | Q13315 | 1/20 | 0.49 |
| ▸ | FAAH | O00519 | 6/20 | 0.47 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.44 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.44 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.41 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7633213 | 0.90 | MGLL (0.63) | MGLLHSP90AA1ALDH1A1HPGDHTT | |
| SCHEMBL28273833 | 0.88 | MGLL (0.59) | MGLLHSP90AA1ALDH1A1HPGDHTT | |
| SCHEMBL8733745 | 0.87 | MGLL (0.55) | MGLLHSP90AA1ALDH1A1HTTPKM | |
| SCHEMBL28288548 | 0.85 | MGLL (0.56) | MGLLHSP90AA1ALDH1A1HPGDHTT | |
| SCHEMBL28308627 | 0.85 | MGLL (0.59) | MGLLHSP90AA1ALDH1A1HPGDHTT | |
| SCHEMBL28554487 | 0.85 | MGLL (0.56) | MGLLHSP90AA1ALDH1A1HTTPKM | |
| SCHEMBL332066 | 0.84 | MGLL (0.51) | MGLLHSP90AA1ALDH1A1HTTPKM | |
| SCHEMBL29353660 | 0.84 | MGLL (0.51) | MGLLHSP90AA1ALDH1A1HTTPKM | |
| SCHEMBL28600979 | 0.84 | MGLL (0.48) | MGLLHSP90AA1ALDH1A1HPGDHTT | |
| SCHEMBL28902896 | 0.84 | MGLL (0.50) | MGLLHSP90AA1ALDH1A1HPGDHTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 256 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115895257-B | Method for improving surface quality of bismaleimide resin condensate | 中国航发北京航空材料研究院 | 2024-06-21 | — | — | CN | claimed |
| CN-117903035-A | Maleimide resin, process for producing the same, 3D-printable maleimide resin composition, process for producing the same, and device produced therefrom | 上海信斯帝克新材料有限公司 | 2024-04-19 | — | — | CN | claimed |
| CN-117645771-A | Solvent-free high-low temperature resistant bulletproof composite matrix resin and preparation method thereof | 上海鑫丰泰新材料科技有限公司 | 2024-03-05 | — | — | CN | claimed |
| CN-117487309-A | Epoxy plastic package material and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2024-02-02 | — | — | CN | claimed |
| CN-115895257-A | Method for improving surface quality of bismaleimide resin cured product | 中国航发北京航空材料研究院 | 2023-04-04 | — | — | CN | claimed |
| CN-114361382-A | Composite pole piece with multifunctional coating modification and preparation method and application thereof | 国联汽车动力电池研究院有限责任公司 | 2022-04-15 | — | — | CN | claimed |
| CN-110121530-B | Resin composition, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | 三菱瓦斯化学株式会社 | 2022-02-11 | — | — | CN | claimed |
| CN-110114407-B | Resin composition, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board | 三菱瓦斯化学株式会社 | 2021-10-22 | — | — | CN | claimed |
| CN-108289820-B | Method for cosmetic treatment of keratin materials | 莱雅公司 | 2021-07-13 | — | — | CN | claimed |
| CN-108047448-B | Bismaleimide polymer and preparation method thereof | 国联汽车动力电池研究院有限责任公司 | 2021-03-02 | — | — | CN | claimed |
| CN-109096442-B | Method for toughening modified bismaleimide resin through in-situ self-assembly | 中国航发北京航空材料研究院 | 2020-11-13 | — | — | CN | claimed |
| CN-109054381-B | Modified maleimide resin composition, prepreg and laminated board prepared from same | 苏州生益科技有限公司 | 2020-09-11 | — | — | CN | claimed |
| CN-109988330-A | One kind coating modified diaphragm resistant to high temperature and the preparation method and application thereof | 国联汽车动力电池研究院有限责任公司 | 2019-07-09 | — | — | CN | claimed |
| CN-107011657-B | A kind of high-ductility bimaleimide resin and its preparation method and application | 中国科学院化学研究所 | 2019-05-21 | — | — | CN | claimed |
| CN-108976418-A | A kind of three-dimensional structure fire retardant and preparation method thereof based on three phosphonitrile of furan derivatives and ring | 中国科学院宁波材料技术与工程研究所 | 2018-12-11 | — | — | CN | claimed |
| CN-103347930-B | Curable resin composition and cured product thereof | MITSUBISHI GAS CHEMICAL CO | 2015-06-24 | — | — | CN | claimed |
| EP-0449292-B1 | Multilayer printed circuit board and production thereof | HITACHI LTD (JP) | 1997-08-20 | — | — | EP | claimed |
| CN-118355077-A | Resin composition, laminate, prepreg, cured product, substrate with cured product, and electronic device | 爱天思株式会社 | 2024-07-16 | — | — | CN | disclosed |
| EP-0449292-A2 | Multilayer printed circuit board and production thereof | HITACHI, LTD. (JP) | 1991-10-02 | — | — | EP | disclosed |
| EP-0364785-A1 | Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board | HITACHI, LTD. (JP) | 1990-04-25 | — | — | EP | disclosed |