SCHEMBL28902896

SCHEMBL28902896

CCC(c1ccc(Oc2ccc(N3C(=O)C=CC3=O)cc2)c(OC)c1)c1ccc(Oc2ccc(N3C(=O)C=CC3=O)cc2)c(OC)c1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 7/20 0.50
G6PD P11413 1/20 0.45
TLR9 Q9NR96 1/20 0.45
NTRK1 P04629 1/20 0.41
IGF1R P08069 1/20 0.41
FGFR1 P11362 1/20 0.41
NTRK2 Q16620 1/20 0.41
MEN1 O00255 3/20 0.40
KMT2A Q03164 3/20 0.40
HTT P42858 3/20 0.40
ALDH1A1 P00352 2/20 0.40
HSP90AA1 P07900 2/20 0.40
HPGD P15428 2/20 0.40
LMNA P02545 1/20 0.40
PKM P14618 1/20 0.40
CCR6 P51684 1/20 0.40
ATM Q13315 1/20 0.40
BCHE P06276 1/20 0.40
TYR P14679 1/20 0.40
ACHE P22303 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28600979 0.88 MGLL (0.48) MGLLG6PDTLR9NTRK1IGF1R
SCHEMBL29208611 0.88 MGLL (0.48) MGLLG6PDTLR9MEN1KMT2A
SCHEMBL349905 0.84 MGLL (0.63) MGLLMEN1KMT2AHTTALDH1A1
SCHEMBL29191807 0.82 G6PD (0.45) MGLLG6PDTLR9MEN1KMT2A
SCHEMBL8852967 0.80 MGLL (0.58) MGLLG6PDTLR9ALDH1A1HSP90AA1
SCHEMBL29191806 0.79 MGLL (0.41) MGLLG6PDTLR9MEN1KMT2A
SCHEMBL7633213 0.78 MGLL (0.63) MGLLMEN1KMT2AHTTALDH1A1
SCHEMBL28601042 0.77 MGLL (0.50) MGLLMEN1KMT2AHTTALDH1A1
SCHEMBL30194282 0.77 MGLL (0.53) MGLLG6PDTLR9NTRK1IGF1R
SCHEMBL349156 0.77 MGLL (0.53) MGLLG6PDTLR9NTRK1IGF1R

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113845775-B Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material 江南大学 2022-06-21 CN claimed
CN-113845775-A Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material 江南大学 2021-12-28 CN claimed
CN-111978726-B Thermosetting resin composition and preparation method and application thereof 江南大学 2022-09-16 CN disclosed
CN-114836034-A Bismaleimide resin composition and application thereof 江南大学 2022-08-02 CN disclosed
CN-113845775-B Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material 江南大学 2022-06-21 CN disclosed
CN-113045897-B Bismaleimide resin composition, preparation method of composition, cured product and application of cured product 江南大学 2022-03-01 CN disclosed
CN-113845775-A Preparation method of hyperbranched polymer modified boron nitride heat-conducting and insulating composite material 江南大学 2021-12-28 CN disclosed
CN-111995867-B Thermosetting resin composition for packaging third-generation semiconductor device and preparation method thereof 江南大学 2021-10-12 CN disclosed
CN-113045897-A Bismaleimide resin composition, preparation method of composition, cured product and application of cured product 江南大学 2021-06-29 CN disclosed
CN-111995867-A Thermosetting resin composition for packaging third-generation semiconductor device and preparation method thereof 江南大学 2020-11-27 CN disclosed
CN-111978726-A Thermosetting resin composition and preparation method and application thereof 江南大学 2020-11-24 CN disclosed