Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 14/20 | 0.55 |
| ▸ | FAAH | O00519 | 4/20 | 0.47 |
| ▸ | HSP90AA1 | P07900 | 3/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.44 |
| ▸ | PKM | P14618 | 1/20 | 0.44 |
| ▸ | HTT | P42858 | 1/20 | 0.44 |
| ▸ | ATM | Q13315 | 1/20 | 0.44 |
| ▸ | HPN | P05981 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28554487 | 0.97 | MGLL (0.56) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL332066 | 0.96 | MGLL (0.51) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL29353660 | 0.96 | MGLL (0.51) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL28264654 | 0.90 | MGLL (0.52) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL349905 | 0.87 | MGLL (0.63) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL30540114 | 0.85 | MGLL (0.58) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL486939 | 0.85 | MGLL (0.58) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL487151 | 0.84 | MGLL (0.70) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL29754402 | 0.84 | MGLL (0.70) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL9491223 | 0.84 | MGLL (0.70) | MGLLFAAHHSP90AA1ALDH1A1PKM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117645771-A | Solvent-free high-low temperature resistant bulletproof composite matrix resin and preparation method thereof | 上海鑫丰泰新材料科技有限公司 | 2024-03-05 | — | — | CN | claimed |
| CN-118139742-A | Resin-coated metal foil, printed wiring board, method for manufacturing the same, and semiconductor package | 株式会社力森诺科 | 2024-06-04 | — | — | CN | disclosed |
| CN-118104403-A | Curable adhesive composition, film-like adhesive, method for producing multilayer wiring board, and multilayer wiring board | 株式会社力森诺科 | 2024-05-28 | — | — | CN | disclosed |
| CN-117980415-A | Thermosetting resin composition and thermosetting article | 宝理塑料赢创有限公司 | 2024-05-03 | — | — | CN | disclosed |
| CN-117881738-A | Resin composition, prepreg, laminated board, resin film, printed circuit board, and semiconductor package | 株式会社力森诺科 | 2024-04-12 | — | — | CN | disclosed |
| CN-117882007-A | Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and method for producing multilayer printed wiring board | 株式会社力森诺科 | 2024-04-12 | — | — | CN | disclosed |
| CN-112313281-B | Thermosetting resin composition, prepreg, laminated board, printed wiring board, semiconductor package, and method for producing thermosetting resin composition | 株式会社力森诺科 | 2024-03-29 | — | — | CN | disclosed |
| CN-117645771-A | Solvent-free high-low temperature resistant bulletproof composite matrix resin and preparation method thereof | 上海鑫丰泰新材料科技有限公司 | 2024-03-05 | — | — | CN | disclosed |
| CN-117561309-A | Resin composition, resin film, printed circuit board, and semiconductor package | 株式会社力森诺科 | 2024-02-13 | — | — | CN | disclosed |
| CN-112585004-B | Copper foil processing method, copper foil, laminate, copper-clad laminate, printed wiring board, and high-speed communication module | 株式会社力森诺科 | 2023-11-03 | — | — | CN | disclosed |
| CN-112313281-A | Thermosetting resin composition, prepreg, laminate, printed wiring board, semiconductor package, and method for producing thermosetting resin composition | 昭和电工材料株式会社 | 2021-02-02 | — | — | CN | disclosed |
| CN-105602197-B | Resin composition, and prepreg, laminate, and printed wiring board using same | 昭和电工材料株式会社 | 2020-11-20 | — | — | CN | disclosed |
| CN-110678505-A | Method for producing prepreg, laminate, printed wiring board, and semiconductor package | 日立化成株式会社 | 2020-01-10 | — | — | CN | disclosed |
| CN-110662795-A | Prepreg, method for producing same, laminate, printed wiring board, and semiconductor package | 日立化成株式会社 | 2020-01-07 | — | — | CN | disclosed |
| CN-109071778-B | Thermosetting resin composition, method for producing same, prepreg, laminate, and printed wiring board | HITACHI CHEMICAL CO.,LTD. (JP) | 2019-12-10 | — | — | CN | disclosed |
| CN-110511566-A | Thermosetting resin composition, method for producing same, prepreg, laminate, and printed wiring board | HITACHI CHEMICAL CO LTD | 2019-11-29 | — | — | CN | disclosed |
| CN-108401433-B | Resin varnish, prepreg, laminate, and printed wiring board | 日立化成株式会社 | 2019-05-28 | — | — | CN | disclosed |
| CN-109071778-A | THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING SAME, PREPREG, LAMINATE, AND PRINTED WIRING BOARD | 日立化成株式会社 | 2018-12-21 | — | — | CN | disclosed |
| US-5725948-A | POLYIMIDE FROM A BISMALEIMIDE AND A DIAMINE | TOMOEGAWA PAPER CO., LTD. (JP) | 1998-03-10 | — | — | US | disclosed |
| EP-0342912-A1 | Thermosetting resin compositions | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1989-11-23 | — | — | EP | disclosed |