SCHEMBL35173

SCHEMBL35173

COc1nc(C(Cl)(Cl)Cl)nc(C(Cl)(Cl)Cl)n1

nearest known ligand 0.37

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.33
MEN1 O00255 2/20 0.31
KMT2A Q03164 2/20 0.31
ATM Q13315 2/20 0.31
MAPT P10636 1/20 0.31
TSHR P16473 1/20 0.31
HTT P42858 1/20 0.31
RECQL P46063 1/20 0.31
KDM4E B2RXH2 1/20 0.30
LMNA P02545 1/20 0.30
PKM P14618 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL821298 0.86 GAA (0.37) KDM4ELMNAPKM
SCHEMBL5695550 0.81 KDM4E (0.31) CYP1A2KDM4ELMNAPKM
SCHEMBL10601414 0.78 PDE10A (0.37)
SCHEMBL79695 0.76 CCNB2 (0.31) KDM4E
SCHEMBL8608222 0.75
SCHEMBL9615303 0.75 ALDH1A1 (0.64) CYP1A2MEN1KMT2AMAPTTSHR
SCHEMBL29267401 0.75
SCHEMBL9184999 0.74 KDM4E (0.30) KDM4ELMNAPKM
SCHEMBL82113 0.74 MEN1 (0.35) MEN1KMT2AATMMAPTTSHR
SCHEMBL13578705 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 132 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5496903-A PHOTPOLYMERIZABLE COATING NIPPON PAINT COMPANY, LTD. (JP) 1996-03-05 US claimed
US-12416860-B2 Photoresist film and application thereof CHANG CHUN PLASTICS CO., LTD. (TW) 2025-09-16 US disclosed
US-20250224674-A1 PHOTOSENSITIVE RESIN FILM AND APPLICATION THEREOF CHANG CHUN PLASTICS CO., LTD. (TW) 2025-07-10 US disclosed
US-20250076763-A1 PHOTOSENSITIVE RESIN LAMINATE AND APPLICATION THEREOF CHANG CHUN PLASTICS CO., LTD. (TW) 2025-03-06 US disclosed
CN-119556523-A Photosensitive resin laminate and use thereof 长春人造树脂厂股份有限公司 2025-03-04 CN disclosed
CN-118591770-A UV curable quantum dot formulations 昭荣化学工业株式会社 2024-09-03 CN disclosed
CN-117631439-A Photoresist film and application thereof 长春人造树脂厂股份有限公司 2024-03-01 CN disclosed
US-20240069440-A1 PHOTORESIST FILM AND APPLICATION THEREOF CHANG CHUN PLASTICS CO., LTD. (TW) 2024-02-29 US disclosed
CN-110032042-B Negative photoresist composition for laser ablation and method of use thereof 默克专利有限公司 2022-05-27 CN disclosed
EP-2016464-B1 NEGATIVE PHOTORESIST COMPOSITIONS MERCK PATENT GMBH (DE) 2021-04-28 EP disclosed
EP-1035124-A1 Borate compound, and photopolymerizable composition and recording material which contain the same FUJI PHOTO FILM CO., LTD. (JP) 2000-09-13 EP disclosed
EP-0422686-B1 Image-forming material containing an aluminate complex FUJI PHOTO FILM CO LTD (JP) 1997-04-16 EP disclosed
US-5532373-A Aluminate complex and use thereof in photopolymerizable composition and image-forming material FUJI PHOTO FILM CO., LTD. (JP) 1996-07-02 US disclosed
US-5496903-A PHOTPOLYMERIZABLE COATING NIPPON PAINT COMPANY, LTD. (JP) 1996-03-05 US disclosed
EP-0461651-B1 Recording medium FUJI PHOTO FILM CO LTD (JP) 1994-02-16 EP disclosed
US-5250384-A Light-sensitive heat-sensitive composition and recording material comprising same and image formation process using same FUJI PHOTO FILM CO., LTD. (JP) 1993-10-05 US disclosed
US-5202304-A RECORDING MEDIUM FUJI PHOTO FILM CO., LTD. (JP) 1993-04-13 US disclosed
US-5180652-A LIGHT- AND HEAT-SENSITIVE COMPOSITION, AND RECORDING MATERIAL FUJI PHOTO FILM CO., LTD. (JP) 1993-01-19 US disclosed
EP-0461651-A1 Recording medium FUJI PHOTO FILM CO., LTD. (JP) 1991-12-18 EP disclosed
EP-0422686-A2 Aluminate complex and use thereof in photopolymerizable composition and image-forming material FUJI PHOTO FILM CO., LTD. (JP) 1991-04-17 EP disclosed