SCHEMBL82113

SCHEMBL82113

COc1nc(C(Br)(Br)Br)nc(C(Br)(Br)Br)n1

nearest known ligand 0.35

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.35
KMT2A Q03164 3/20 0.35
ATM Q13315 2/20 0.35
MAPT P10636 1/20 0.35
TSHR P16473 1/20 0.35
LMNA P02545 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
HSD17B10 Q99714 1/20 0.32
ALDH1A1 P00352 2/20 0.31
HTT P42858 1/20 0.31
RECQL P46063 1/20 0.31
PRNP P04156 1/20 0.30
HRH4 Q9H3N8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL483080 0.86 GAA (0.37) MEN1KMT2AATMMAPTTSHR
SCHEMBL4219605 0.77 MEN1 (0.31) MEN1KMT2AATMMAPTTSHR
SCHEMBL35173 0.74 CYP1A2 (0.33) MEN1KMT2AATMMAPTTSHR
SCHEMBL11929988 0.70 HRH4 (0.34) MEN1KMT2AATMMAPTTSHR
SCHEMBL33145 0.69 ALDH1A1 (0.43) MEN1KMT2AATMMAPTTSHR
SCHEMBL1044951 0.68 CLK4 (0.50) MEN1KMT2AMAPT
SCHEMBL4219607 0.64 MEN1 (0.32) MEN1KMT2AATMMAPTTSHR
SCHEMBL11779440 0.63 ALDH1A1 (0.35) MEN1KMT2AATMMAPTTSHR
SCHEMBL3393748 0.63 MEN1 (0.34) MEN1KMT2AATMMAPTTSHR
SCHEMBL8943512 0.63 ALDH1A1 (0.35) MEN1KMT2AATMMAPTTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 552 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12422750-B2 Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device FUJIFILM CORPORATION (JP) 2025-09-23 US disclosed
CN-116648313-B Resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2025-05-16 CN disclosed
CN-119937247-A Curable resin composition, resin film, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2025-05-06 CN disclosed
CN-115190891-B Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2024-10-15 CN disclosed
CN-111566560-B Photosensitive resin composition, partition wall, organic electroluminescent element, image display device, and illumination 三菱化学株式会社 2024-09-17 CN disclosed
CN-114981360-B Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2024-09-10 CN disclosed
CN-115667404-B Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2024-05-03 CN disclosed
CN-117378044-A Polyimide-containing part forming composition, method for producing bonded body, method for producing device, and device 富士胶片株式会社 2024-01-09 CN disclosed
CN-117203746-A Method for manufacturing bonded body, method for manufacturing semiconductor device, and resin composition 富士胶片株式会社 2023-12-08 CN disclosed
CN-117120550-A Resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2023-11-24 CN disclosed
US-6153356-A MIXTURE OF UNSATURATED COMPOUND, CYANINE DYE AND PHOTOINITIATOR MITSUBISHI CHEMICAL CORPORATION (JP) 2000-11-28 US disclosed
EP-0704765-B1 A photoresist composition comprising a polyfunctional vinyl ether compound SUMITOMO CHEMICAL CO (JP) 1999-04-21 EP disclosed
US-5719008-A PHOTOLITHOGRAPHY, COLOR FILTERS SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-02-17 US disclosed
EP-0704765-A1 A photoresist composition comprising a polyfunctional vinyl ether compound SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1996-04-03 EP disclosed
EP-0557555-B1 Photopolymerizable composition MITSUBISHI CHEM CORP (JP) 1995-09-20 EP disclosed
EP-0557555-A1 Photopolymerizable composition Mitsubishi Chemical Corporation (JP) 1993-09-01 EP disclosed
US-5219709-A Addition polymerizable unsaturated compound, photoinitiator system of squarylium dye and halomethyl-s-triazine compound MITSUBISHI KASEI CORPORATION (JP) 1993-06-15 US disclosed
EP-0458325-A1 Negative photosensitive composition and method for forming a resist pattern Mitsubishi Chemical Corporation (JP) 1991-11-27 EP disclosed
EP-0379200-A2 Photopolymerizable composition MITSUBISHI KASEI CORPORATION (JP) 1990-07-25 EP disclosed
US-4101323-A Radiation-sensitive copying composition HOECHST AKTIENGESELLSCHAFT (DE) 1978-07-18 US disclosed