Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TGFBR1 | P36897 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Methacrylic Acid SCHEMBL35548 | 1.00 | TGFBR1 (0.38) | TGFBR1 | |
| Methacrylic Acid SCHEMBL27853218 | 0.90 | LMNA (0.36) | TGFBR1 | |
| Methacrylic Acid SCHEMBL10565942 | 0.89 | TGFBR1 (0.45) | TGFBR1 | |
| Methacrylic Acid SCHEMBL6437286 | 0.89 | TGFBR1 (0.45) | TGFBR1 | |
| Methacrylic Acid SCHEMBL10779267 | 0.88 | TGFBR1 (0.36) | TGFBR1 | |
| Methacrylic Acid SCHEMBL10783061 | 0.88 | TGFBR1 (0.36) | TGFBR1 | |
| Methacrylic Acid SCHEMBL23012601 | 0.86 | TGFBR1 (0.35) | TGFBR1 | |
| Methacrylic Acid SCHEMBL7745845 | 0.84 | TGFBR1 (0.34) | TGFBR1 | |
| Methacrylic Acid SCHEMBL51594 | 0.80 | TGFBR1 (0.39) | TGFBR1 | |
| Methacrylic Acid SCHEMBL8383578 | 0.80 | TGFBR1 (0.39) | TGFBR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 236 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20140340891-A1 | LED COLOR CONVERSION FILTER, METHOD OF MANUFACTURING SAME, AND LED MODULE INCLUDING SAME | SOL COMPONENT CO., LTD. (KR) | 2014-11-20 | — | — | US | claimed |
| EP-2770252-A1 | LED COLOR CONVERSION FILTER, METHOD OF MANUFACTURING SAME, AND LED MODULE INCLUDING SAME | Cho, Shim Hyun (KR) | 2014-08-27 | — | — | EP | claimed |
| EP-0720053-B1 | Photosensitive resin composition, photosensitive printing plate and method of manufacturing printing master plate | TOKYO OHKA KOGYO CO LTD (JP) | 2002-09-04 | — | — | EP | claimed |
| US-5885746-A | COMPRISING A POLYMER BINDER, A MONOMER, A PHOTOINITIATOR ACTIVATED BY VISIBLE LASER LIGHT, A PHOTOSENSITIVE ACID-GENERATING AGENT AND A CHROMOGEN; OFFSET PRINTING; STORAGE STABILITY; RESOLUTION; MATERIALS HANDLING; EFFICIENCY | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-03-23 | — | — | US | claimed |
| EP-0283990-B1 | A heat-resistant photosensitive resin composition | TOKYO OHKA KOGYO CO LTD (JP) | 1994-01-26 | — | — | EP | claimed |
| US-5087552-A | Photosensitive resin composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1992-02-11 | — | — | US | claimed |
| US-4996132-A | Heat-resistant photosensitive resin composition | TOYKO OHKA KOGYO CO. LTD. (JP) | 1991-02-26 | — | — | US | claimed |
| EP-0283990-A2 | A heat-resistant photosensitive resin composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1988-09-28 | — | — | EP | claimed |
| EP-0280295-A2 | A heat-resistant photosensitive resin composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1988-08-31 | — | — | EP | claimed |
| US-4526920-A | Contains poly(meth)acrylic ester of oxy or polyoxyalkane polyol, polymerization initiator, filler | MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) | 1985-07-02 | — | — | US | claimed |
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-16 | — | — | US | disclosed |
| EP-4660704-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2025-12-10 | — | — | EP | disclosed |
| US-20250355350-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-20 | — | — | US | disclosed |
| EP-4650874-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED COATING, INTERLAYER INSULATING FILM, SURFACE PROTECTING FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-11-19 | — | — | EP | disclosed |
| EP-4636011-A1 | POLYMER, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-10-22 | — | — | EP | disclosed |
| US-5087552-A | Photosensitive resin composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1992-02-11 | — | — | US | disclosed |
| EP-0100688-B1 | CURABLE COATING COMPOSITION | MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) | 1987-04-22 | — | — | EP | disclosed |
| US-4526920-A | Contains poly(meth)acrylic ester of oxy or polyoxyalkane polyol, polymerization initiator, filler | MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) | 1985-07-02 | — | — | US | disclosed |
| EP-0100688-A2 | Curable coating composition | MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) | 1984-02-15 | — | — | EP | disclosed |
| US-4426243-A | Room-temperature-curable, quick-setting acrylic/epoxy adhesives and methods of bonding | ILLINOIS TOOL WORKS INC. (US) | 1984-01-17 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ARCN1, PRDM9, LBR | TGFBR1 1229/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.