SCHEMBL35394

SCHEMBL35394

O=P(Oc1ccc(OP(=O)(c2ccccc2)c2ccccc2)cc1)(c1ccccc1)c1ccccc1

nearest known ligand 0.60

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 2/20 0.60
TDP1 Q9NUW8 1/20 0.60
SRC P12931 1/20 0.50
ALDH1A1 P00352 1/20 0.50
CA2 P00918 8/20 0.48
CA4 P22748 8/20 0.48
CA5A P35218 8/20 0.48
CA12 O43570 7/20 0.48
CA1 P00915 7/20 0.48
CA7 P43166 7/20 0.48
CA9 Q16790 7/20 0.48
CA5B Q9Y2D0 7/20 0.48
MEN1 O00255 2/20 0.47
KMT2A Q03164 2/20 0.47
PKM P14618 1/20 0.44
HTT P42858 1/20 0.44
KDM4E B2RXH2 1/20 0.43
HPGD P15428 2/20 0.41
LMNA P02545 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL331195 0.95 L3MBTL1 (0.67) L3MBTL1TDP1SRCALDH1A1CA2
SCHEMBL9163448 0.93 L3MBTL1 (0.54) L3MBTL1TDP1SRCALDH1A1CA2
SCHEMBL9165442 0.93 L3MBTL1 (0.54) L3MBTL1TDP1SRCALDH1A1CA2
SCHEMBL29207963 0.93 L3MBTL1 (0.64) L3MBTL1TDP1SRCALDH1A1CA2
Phosphine SCHEMBL28875449 0.93 L3MBTL1 (0.64) L3MBTL1TDP1SRCALDH1A1CA2
SCHEMBL14995283 0.91 L3MBTL1 (0.52) L3MBTL1TDP1SRCALDH1A1CA2
SCHEMBL17491592 0.89 CYP3A4 (0.57) L3MBTL1TDP1ALDH1A1CA2CA4
SCHEMBL20643973 0.89 HPGD (0.53) L3MBTL1TDP1SRCALDH1A1CA2
SCHEMBL20710845 0.89 L3MBTL1 (0.50) L3MBTL1TDP1SRCALDH1A1CA2
SCHEMBL28388309 0.89 PKM (0.59) L3MBTL1TDP1ALDH1A1CA2CA4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 105 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20170218273-A1 FLAME-RETARDANT EPOXY RESIN, METHOD FOR PREPARING SAME, AND FLAME-RETARDANT EPOXY RESIN COMPOSITION CONTAINING SAME KOLON INDUSTRIES, INC. (KR) 2017-08-03 US claimed
EP-3521366-B1 CURABLE MODIFIED PETROLEUM RESIN, AND PREPARATION METHOD AND USE THEREOF KOLON INC (KR) 2025-07-30 EP disclosed
EP-3647333-B1 CURABLE PETROLEUM RESIN, PREPARATION METHOD THEREFOR, AND USE THEREOF KOLON INC (KR) 2025-06-18 EP disclosed
US-12054611-B2 Poly(phenylene ether), curable composition containing poly(phenylene ether), dry film, prepreg, cured object, laminate, and electronic component TAIYO HOLDINGS CO., LTD. (JP) 2024-08-06 US disclosed
CN-118255968-A Epoxy resin composition, epoxy resin composition containing reinforcing fiber, prepreg, and fiber-reinforced plastic using same 日铁化学材料株式会社 2024-06-28 CN disclosed
US-11901249-B2 Curable composition and cured product thereof DIC CORPORATION (JP) 2024-02-13 US disclosed
US-11873356-B2 Curable composition and cured product thereof DIC CORPORATION (JP) 2024-01-16 US disclosed
EP-3620459-B9 PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON STEEL CHEMICAL & MAT CO LTD (JP) 2023-10-04 EP disclosed
EP-3845578-B1 PHOSPHOROUS-CONTAINING EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, LAMINATED PLATE, MATERIAL FOR CIRCUIT BOARD AND CURED PRODUCT NIPPON STEEL CHEMICAL & MAT CO LTD (JP) 2023-06-07 EP disclosed
EP-3620459-B1 PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON STEEL CHEMICAL & MAT CO LTD (JP) 2023-05-24 EP disclosed
EP-0285969-B1 THERMOPLASTIC MOLDING COMPOSITIONS ON THE BASIS OF POLYPHENYLENE ETHER BASF Aktiengesellschaft (DE) 1992-05-27 EP disclosed
EP-0285964-B1 THERMOPLASTIC MOLDING COMPOSITIONS ON THE BASIS OF POLYPHENYLENEETHER BASF Aktiengesellschaft (DE) 1992-05-27 EP disclosed
EP-0285976-B1 POLYPHENYLENE ETHER-BASED THERMOPLASTIC MOULDING COMPOUNDS BASF Aktiengesellschaft (DE) 1992-05-27 EP disclosed
US-4866114-A Self-extinguishing, thermoplastic polyphenylene ether/polyamide molding materials and their use for the production of moldings BASF AKTIENGESELLSCHAFT (DE) 1989-09-12 US disclosed
EP-0289780-A2 Thermoplastic moulding compounds on the basis of polyphenylene ether BASF Aktiengesellschaft (DE) 1988-11-09 EP disclosed
EP-0285975-A2 Thermoplastic moulding compounds based on polyphenylene ether BASF Aktiengesellschaft (DE) 1988-10-12 EP disclosed
EP-0285976-A2 Polyphenylene ether-based thermoplastic moulding compounds BASF Aktiengesellschaft (DE) 1988-10-12 EP disclosed
EP-0285966-A2 Thermoplastic molding compositions on the basis of polyphenylene ether BASF Aktiengesellschaft (DE) 1988-10-12 EP disclosed
EP-0285964-A2 Thermoplastic molding compositions on the basis of polyphenyleneether BASF Aktiengesellschaft (DE) 1988-10-12 EP disclosed
EP-0285969-A2 Thermoplastic molding compositions on the basis of polyphenylene ether BASF Aktiengesellschaft (DE) 1988-10-12 EP disclosed