SCHEMBL353943

SCHEMBL353943

O=C(c1ccccc1)c1c(O)cc(O)cc1O

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FASN P49327 1/20 0.64
MEN1 O00255 4/20 0.62
KMT2A Q03164 4/20 0.62
GAA P10253 2/20 0.62
USP2 O75604 1/20 0.62
KEAP1 Q14145 1/20 0.62
NFE2L2 Q16236 1/20 0.62
ALDH1A1 P00352 2/20 0.56
L3MBTL1 Q9Y468 3/20 0.54
TDP1 Q9NUW8 2/20 0.54
ATM Q13315 1/20 0.54
MAPT P10636 3/20 0.52
LMNA P02545 3/20 0.52
RAB9A P51151 2/20 0.52
SLC5A1 P13866 2/20 0.52
SLC5A2 P31639 2/20 0.52
POLB P06746 2/20 0.51
SMN1; SMN2 Q16637 1/20 0.51
NPC1 O15118 1/20 0.50
HPGD P15428 2/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3656921 0.88 FASN (0.73) FASNMEN1KMT2AGAAUSP2
SCHEMBL6847967 0.86 FASN (0.64) FASNMEN1KMT2AGAAUSP2
SCHEMBL8965058 0.86 CYP3A4 (0.63) FASNMEN1KMT2AGAAUSP2
SCHEMBL21178163 0.84 MEN1 (0.81) FASNMEN1KMT2AGAAUSP2
Iriflophenone SCHEMBL9148205 0.84 FASN (0.67) FASNMEN1KMT2AGAAUSP2
SCHEMBL25707508 0.83 MEN1 (0.50) FASNMEN1KMT2AGAAUSP2
SCHEMBL2315545 0.83 FASN (0.65) FASNMEN1KMT2AGAAUSP2
SCHEMBL1456378 0.82 HPGD (0.68) MEN1KMT2AGAAUSP2ALDH1A1
SCHEMBL3656913 0.82 FASN (0.58) FASNMEN1KMT2AGAAUSP2
SCHEMBL30550350 0.82 ALDH1A1 (0.56) MEN1KMT2AGAAUSP2KEAP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1301 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119439618-A Negative photosensitive resin composition, preparation method thereof and hardening film 深圳市道尔顿电子材料股份有限公司 2025-02-14 CN claimed
CN-112731765-B Fluorine-containing resin composition, preparation method thereof and preparation method of cured film containing fluorine-containing resin composition 西安瑞联新材料股份有限公司 2024-03-26 CN claimed
US-20230407114-A1 THREE-DIMENSIONAL PRINTING PERIDOT PRINT LLC 2023-12-21 US claimed
CN-112888498-B Composition useful for making acid gas separation membranes 住友化学株式会社 2023-07-14 CN claimed
US-20230194984-A1 FLUORINE-CONTAINING RESIN COMPOSITION AND PREPARATION METHOD THEREOF, AND PREPARATION METHOD OF CURED FILM CONTAINING SAME XI'AN MANARECO NEW MATERIALS CO., LTD. (CN) 2023-06-22 US claimed
WO-2022142537-A1 FLUORINE-CONTAINING RESIN COMPOSITION, PREPARATION METHOD THEREFOR, AND PREPARATION METHOD FOR CURED FILM CONTAINING SAME 西安瑞联新材料股份有限公司 2022-07-07 WO claimed
WO-2022115112-A1 THREE-DIMENSIONAL PRINTING HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (US) 2022-06-02 WO claimed
CN-112731765-A Fluorine-containing resin composition, preparation method thereof and preparation method of cured film containing fluorine-containing resin composition 西安瑞联新材料股份有限公司 2021-04-30 CN claimed
US-10494483-B2 Photosensitive resin composition, organic light emitting display device including the same, and method for manufacturing organic light emitting display device SAMSUNG DISPLAY CO., LTD. (KR) 2019-12-03 US claimed
US-10409162-B2 Highly heat resistant polysilsesquioxane-based photosensitive resin composition LTC CO., LTD. (KR) 2019-09-10 US claimed
US-20040197696-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-6790582-B1 NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT CLARIANT FINANCE BVI LIMITED (VG) 2004-09-14 US claimed
US-6686120-B2 THERMAL ACID GENERATOR AND A METHOD OF FORMING A PATTERN USING THE SAME. THE PHOTORESIST COMPOSITION INCLUDES ABOUT 100 PARTS BY WEIGHT OF AN ALKALI-SOLUBLE ACRYL COPOLYMER, ABOUT 5-100 PARTS BY WEIGHT OF 1,2-QUINONEDIAZIDE COMPOUND, ABOUT SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-02-03 US claimed
US-20030134222-A1 Photoresist composition and method of forming pattern using the same SAMSUNG ELECTRONICS CO., LTD. 2003-07-17 US claimed
EP-0395346-B1 Photosensitive composition FUJI PHOTO FILM CO LTD (JP) 1996-11-27 EP claimed
US-5254432-A Photosensitive composition FUJI PHOTO FILM CO., LTD. (JP) 1993-10-19 US claimed
EP-0503402-A1 Coloured positive working light sensitive recording material and process for the production of a colour proofing image using this material HOECHST AKTIENGESELLSCHAFT (DE) 1992-09-16 EP claimed
US-5089373-A High resolving power, sensitivity FUJI PHOTO FILM CO., LTD. (JP) 1992-02-18 US claimed
EP-0395346-A2 Photosensitive composition Fuji Photo Film Co., Ltd. (JP) 1990-10-31 EP claimed
US-4308368-A PHOTORESISTS, PRINTING PLATES, STORAGE STABILITY DAICEL CHEMICAL INDUSTRIES LTD. (JP) 1981-12-29 US claimed