SCHEMBL355260

SCHEMBL355260

[Cu].[Pd]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1883443 1.00
SCHEMBL6048097 1.00
SCHEMBL6742032 0.82
SCHEMBL2937101 0.82
SCHEMBL6742037 0.82
Hydrochloric Acid SCHEMBL1005184 0.82
SCHEMBL4392271 0.82
SCHEMBL7199066 0.82
SCHEMBL6048099 0.82
SCHEMBL8528784 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2549 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122081882-A Composite current collector, preparation method thereof, pole piece and solid-state battery 2026-05-26 CN claimed
CN-122071003-A Preparation method of copper-palladium alloy loaded nano titanium dioxide material for producing methane by photocatalytic carbon dioxide reduction 华东理工大学 2026-05-22 CN claimed
WO-2026102972-A1 PALLADIUM-PLATED/GOLD-PALLADIUM-PLATED COPPER BONDING WIRE WITH HIGH CORROSION RESISTANCE AND HIGH CONDUCTIVITY, AND PRODUCTION PROCESS THEREFOR 上海万生合金材料有限公司 2026-05-21 WO claimed
CN-119638118-B Device and method for recycling ammonia in heavy metal waste liquid and preparing nano metal material 生态环境部华南环境科学研究所(生态环境部生态环境应急研究所) 2026-05-15 CN claimed
CN-117483773-B Preparation method for constructing heterogeneous alloy nanostructure based on ultrasonic action 重庆融海超声医学工程研究中心有限公司 2026-05-15 CN claimed
US-20260131316-A1 BINARY COPPER-PALLADIUM ALLOY THIN FILM CATALYST AND METHOD OF PREPARING THE CATALYST KING FAHD UNIVERSITY OF PETROLEUM AND MINERALS (SA) 2026-05-14 US claimed
US-20260077341-A1 Palladium Copper Single-Atom Alloy Catalyst for Nitrate Reduction WU YIMIN (CA) 2026-03-19 US claimed
US-20250360467-A1 Systems and methods employing metal foil pumps for direct internal recycling of fusion reactor exhaust plasma COLORADO SCHOOL OF MINES 2025-11-27 US claimed
CN-116081840-B Method for treating oil refining alkaline residue waste liquid by homogeneous catalysis wet oxidation 中国石油化工股份有限公司 2025-06-03 CN claimed
CN-120001976-A Copper-palladium sheet nano-enzyme and preparation and application thereof 河北大学 2025-05-16 CN claimed
CN-1590513-A Selective hydrogenation technology of hydrocarbon material flow rich acetylene in hydrocarbon QILU PETROCHEMICAL CO SINOPEC (CN) 2005-03-09 CN claimed
US-20040265753-A1 Manufacturing method of cover layer of optical information storage media INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2004-12-30 US claimed
US-20040132282-A1 Copper transition layer for improving copper interconnection reliability JIANG QING-TANG (US) 2004-07-08 US claimed
US-20040118699-A1 copper ion source at a concentration of 0.1-1.0 M and a palladium ion source at a concentration of 0.0005 M-0.1 M; bias is configured to simultaneously deposit copper ions and palladium ions onto the plating surface. APPLIED MATERIALS, INC. 2004-06-24 US claimed
EP-1351291-A2 Copper doped transition layer for improving copper interconnection reliability TEXAS INSTRUMENTS INCORPORATED (US) 2003-10-08 EP claimed
US-20030186543-A1 INTEGRATED CIRCUIT IN SURFACE OF SEMICONDUCTOR COMPRISING DIELECTRIC LAYER WITH HOLE, BARRIER LAYER OVER DIELECTRIC INCLUDING WALLS AND BOTTOM OF HOLE AND OPERABLE TO SEAL COPPER, TRANSITION LAYER WITH COPPER DOPING GRADIENT TEXAS INSTRUMENTS INCORPORATED 2003-10-02 US claimed
US-6372363-B1 Method of improving and optimizing the hydrogen permeability of a palladium-copper membrane and novel membranes manufactured thereby WALTER JUDA ASSOCIATES, INC. 2002-04-16 US claimed
EP-0478075-B1 Decarboxylation processes UNION CARBIDE CHEM PLASTIC (US) 1998-11-11 EP claimed
US-5594081-A METALLOCENES MITSUBISHI CHEMICAL CORPORATION (JP) 1997-01-14 US claimed
EP-0420604-A1 Selectively conductive adhesive device for simultaneous electrical and mechanical coupling MOTOROLA, INC. (US) 1991-04-03 EP claimed