SCHEMBL35897

SCHEMBL35897

CC(C)S(=O)(=O)C(=[N+]=[N-])S(=O)(=O)C(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3365287 0.87
SCHEMBL3370821 0.84
SCHEMBL3369701 0.84
SCHEMBL4594406 0.76
SCHEMBL562168 0.70
SCHEMBL17202842 0.69
SCHEMBL64665 0.67
SCHEMBL63969 0.64
SCHEMBL8679718 0.63
SCHEMBL28612684 0.63 CA5A (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2106 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2326744-B1 METAL COMPOSITIONS AND METHODS OF MAKING SAME PRYOG LLC (US) 2022-06-01 EP claimed
EP-1830228-B1 COMPOUND FOR RESIST AND RADIATION-SENSITIVE COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2015-08-05 EP claimed
US-RE40211-E1 Diazodisulfones WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2008-04-01 US claimed
US-7150956-B2 Chemical amplification type positive resist composition, resist laminated material, resist pattern forming method and method of manufacturing semiconductor device TOKYO OHKA KOGYO CO., LTD. (JP) 2006-12-19 US claimed
US-7026497-B2 Adhesive compound and method for forming photoresist pattern using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2006-04-11 US claimed
US-6921621-B2 Positive resist composition of chemical amplification type, resist coated material, method of forming resist pattern, and process for producing semiconductor device TOKYO OHKA KOGYO CO., LTD. (JP) 2005-07-26 US claimed
US-20050158651-A1 Adhesive compound and method for forming photoresist pattern using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2005-07-21 US claimed
US-20050112498-A1 Chemical amplification type positive resist composition, resist laminated material, resist pattern forming method and method of manufacturing semiconductor device TOYKO OHKA KOGYO CO., LTD. 2005-05-26 US claimed
US-6730451-B2 FLUOROACRYLATE POLYMERS; TRANSPARENCY; PREVENTING NEGATIVE WORKING; LOW ABSORPTION OF FLUORINE EXCIMER LASER LIGHT; HIGH TRANSMITTANCE TO VACUUM ULTRAVIOLET RADITION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2004-05-04 US claimed
EP-1400853-A1 POSITIVE RESIST COMPOSITION OF CHEMICAL AMPLIFICATION TYPE, RESIST COATED MATERIAL, METHOD OF FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE TOKYO OHKA KOGYO CO., LTD. (JP) 2004-03-24 EP claimed
US-6660447-B2 Copolymers of fluorinated vinyl phenol units and acrylonitrile units has high transmittance to VUV radiation SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-12-09 US claimed
US-20030190550-A1 Positive resist composition of chemical amplification type, resist coated material, method of forming resist pattern, and process for producing semiconductor device TOKYO OHKA KOGYO CO., LTD. (JP) 2003-10-09 US claimed
US-6436606-B1 POLYMERS AND PHOTORESISTS COATING SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-08-20 US claimed
US-6033826-A POLYHYDROXYSTYRENE DERIVATIVE CONTAINING AN ACETAL OR KETAL GROUP WHICH CAN EASILY BE ELIMINATED IN THE PRESENCE OF AN ACID IN THE MOLECULE AND HAVING A VERY NARROW MOLECULAR WEIGHT DISTRIBUTION GIVES A RESIST MATERIAL WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2000-03-07 US claimed
EP-0440375-B1 Diazodisulfones WAKO PURE CHEM IND LTD (JP) 1994-07-13 EP claimed
EP-0440375-A1 Diazodisulfones WAKO PURE CHEMICAL INDUSTRIES LTD (JP) 1991-08-07 EP claimed
JP-11269230-A None JP disclosed
US-12612500-B2 Heat labile foam-in-place polyurethane foam BATTELLE SAVANNAH RIVER ALLIANCE LLC (US) 2026-04-28 US disclosed
EP-0440375-A1 Diazodisulfones WAKO PURE CHEMICAL INDUSTRIES LTD (JP) 1991-08-07 EP disclosed
EP-0440374-A2 Chemical amplified resist material WAKO PURE CHEMICAL INDUSTRIES LTD (JP) 1991-08-07 EP disclosed