SCHEMBL35981

SCHEMBL35981

Cc1ccc(S(=O)(=O)ON=C(C#N)c2ccccc2)cc1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.42
MEN1 O00255 2/20 0.41
KMT2A Q03164 2/20 0.41
RECQL P46063 1/20 0.41
KDM4E B2RXH2 2/20 0.41
MAPT P10636 3/20 0.41
ALDH1A1 P00352 7/20 0.40
PLA2G7 Q13093 1/20 0.40
MAPK1 P28482 2/20 0.39
POLB P06746 1/20 0.39
TDP1 Q9NUW8 2/20 0.39
TP53 P04637 1/20 0.39
VDR P11473 1/20 0.38
HSP90AA1 P07900 1/20 0.38
PKM P14618 1/20 0.38
XBP1 P17861 1/20 0.38
MPI P34949 1/20 0.38
HTT P42858 1/20 0.38
RAB9A P51151 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL35980 1.00 LMNA (0.42) LMNAMEN1KMT2ARECQLKDM4E
SCHEMBL1227015 1.00 LMNA (0.42) LMNAMEN1KMT2ARECQLKDM4E
SCHEMBL10097225 0.94 MAPT (0.44) LMNAMEN1KMT2ARECQLKDM4E
SCHEMBL28408422 0.94 MAPT (0.44) LMNAMEN1KMT2ARECQLKDM4E
SCHEMBL10097224 0.93 ALDH1A1 (0.40) LMNAMEN1KMT2AMAPTALDH1A1
SCHEMBL18957974 0.93 ALDH1A1 (0.40) LMNAMEN1KMT2AMAPTALDH1A1
SCHEMBL10083959 0.93 ALDH1A1 (0.40) LMNAMEN1KMT2AMAPTALDH1A1
SCHEMBL6304419 0.93 ALDH1A1 (0.47) LMNAMEN1KMT2AMAPTALDH1A1
SCHEMBL6304421 0.93 ALDH1A1 (0.47) LMNAMEN1KMT2AMAPTALDH1A1
SCHEMBL10083960 0.90 TCF4 (0.38) LMNAMEN1KMT2ARECQLKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1104 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120065622-A Photosensitive resin composition and method for producing microlens 东京应化工业株式会社 2025-05-30 CN disclosed
CN-114600045-B Photosensitive resin composition, photosensitive dry film and pattern forming method 信越化学工业株式会社 2025-05-09 CN disclosed
CN-119620544-A Photosensitive resin composition, dry film, photosensitive dry film, resist film, molded substrate with mold, and method for producing plated molded article 东京应化工业株式会社 2025-03-14 CN disclosed
CN-112136081-B Photosensitive transfer material, method for manufacturing circuit wiring, and method for manufacturing touch panel 富士胶片株式会社 2024-11-19 CN disclosed
CN-110317174-B Hydrogen barrier agent, composition for forming hydrogen barrier film, method for producing hydrogen barrier film, and electronic device 东京应化工业株式会社 2024-10-22 CN disclosed
CN-118829948-A Method for manufacturing plating shaped article 东京应化工业株式会社 2024-10-22 CN disclosed
CN-118742854-A Chemically amplified positive photosensitive composition, method for producing molded substrate with mold, and method for producing plated molded article 东京应化工业株式会社 2024-10-01 CN disclosed
US-20240199854-A1 COMPOSITION, CURED FILM, STRUCTURAL BODY, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND MANUFACTURING METHOD OF CURED FILM FUJIFLIM CORPORATION (JP) 2024-06-20 US disclosed
CN-113946103-B Dry film resist, method for manufacturing circuit wiring, input device, and display device 富士胶片株式会社 2024-05-07 CN disclosed
CN-117590696-A Photosensitive resin composition 东京应化工业株式会社 2024-02-23 CN disclosed
US-5714625-A Cyanooxime sulfonate compound TOKYO OHKA KOGYO CO., LTD. (JP) 1998-02-03 US disclosed
EP-0821274-A1 Chemical-sensitization resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1998-01-28 EP disclosed
EP-0780729-A1 Chemical-sensitization photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1997-06-25 EP disclosed
EP-0768572-A1 Photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1997-04-16 EP disclosed
EP-0241423-B1 PROCESS FOR THE PRODUCTION OF POSITIVE IMAGES CIBA-GEIGY AG (CH) 1993-09-15 EP disclosed
EP-0199672-B1 OXIME SULPHONATES CONTAINING REACTIVE GROUPS CIBA-GEIGY AG (CH) 1988-06-01 EP disclosed
US-4736055-A STARING MATERIAL FOR PHOTORESIST POLYMERS CIBA-GEIGY CORPORATION (US) 1988-04-05 US disclosed
EP-0241423-A2 Process for the production of positive images CIBA-GEIGY AG (CH) 1987-10-14 EP disclosed
US-4540598-A LATENT OXIME SULFONATE CATALYSTS CIBA-GEIGY CORPORATION (US) 1985-09-10 US disclosed
EP-0139609-A1 Process for curing acid-curable lacquers CIBA-GEIGY AG (CH) 1985-05-02 EP disclosed