Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PLA2G7 | Q13093 | 1/20 | 0.46 |
| ▸ | MAPT | P10636 | 3/20 | 0.40 |
| ▸ | PTGS2 | P35354 | 3/20 | 0.37 |
| ▸ | LMNA | P02545 | 3/20 | 0.36 |
| ▸ | MAPK1 | P28482 | 3/20 | 0.36 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.36 |
| ▸ | RAB9A | P51151 | 2/20 | 0.36 |
| ▸ | XBP1 | P17861 | 1/20 | 0.36 |
| ▸ | POLB | P06746 | 2/20 | 0.34 |
| ▸ | PDE4A | P27815 | 1/20 | 0.34 |
| ▸ | PDE4B | Q07343 | 1/20 | 0.34 |
| ▸ | PDE4C | Q08493 | 1/20 | 0.34 |
| ▸ | PDE4D | Q08499 | 1/20 | 0.34 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.34 |
| ▸ | NPC1 | O15118 | 1/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.34 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | HTT | P42858 | 1/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL295508 | 1.00 | PLA2G7 (0.46) | PLA2G7MAPTPTGS2LMNAMAPK1 | |
| SCHEMBL18431381 | 0.91 | PLA2G7 (0.36) | PLA2G7MAPTNPC1 | |
| SCHEMBL9891196 | 0.91 | PLA2G7 (0.36) | PLA2G7MAPTNPC1 | |
| SCHEMBL19418706 | 0.91 | PLA2G7 (0.36) | PLA2G7MAPTNPC1 | |
| SCHEMBL9891197 | 0.88 | PLA2G7 (0.36) | PLA2G7MAPTMAPK1NPSR1ALDH1A1 | |
| SCHEMBL19418703 | 0.88 | PLA2G7 (0.36) | PLA2G7MAPTMAPK1NPSR1ALDH1A1 | |
| SCHEMBL18431385 | 0.88 | PLA2G7 (0.36) | PLA2G7MAPTMAPK1NPSR1ALDH1A1 | |
| SCHEMBL2700597 | 0.85 | PLA2G7 (0.43) | PLA2G7MAPTPTGS2LMNAMAPK1 | |
| SCHEMBL2700595 | 0.85 | PLA2G7 (0.43) | PLA2G7MAPTPTGS2LMNAMAPK1 | |
| SCHEMBL10233179 | 0.85 | ENPP2 (0.37) | PLA2G7MAPTPTGS2LMNAALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 840 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0780729-B1 | Chemical-sensitization photoresist composition | TOKYO OHKA KOGYO CO LTD (JP) | 2002-07-10 | — | — | EP | claimed |
| US-6042988-A | ALKALI-SOLUBLE RESIN, A COMPOUND CAPABLE OF GENERATING AN ACID BY IRRADIATION AND A CROSSLINKING AGENT, AND FURTHER CONTAINS AN ORGANIC CARBOXYLIC ACID AS ACIDIC COMPOUND AND ORGANIC AMINE AS ALKALINE COMPOUND; DEFINITION AND PRECISION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-03-28 | — | — | US | claimed |
| US-5902713-A | Chemical-sensitization photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-05-11 | — | — | US | claimed |
| EP-0780729-A1 | Chemical-sensitization photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-06-25 | — | — | EP | claimed |
| US-20250321485-A1 | RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-10-16 | — | — | US | disclosed |
| CN-120044752-A | Photosensitive resin composition | 东京应化工业株式会社 | 2025-05-27 | — | — | CN | disclosed |
| CN-119452307-A | Resist auxiliary film composition and pattern forming method using the same | 三菱瓦斯化学株式会社 | 2025-02-14 | — | — | CN | disclosed |
| CN-119422108-A | Resist composition and method for forming resist film using same | 三菱瓦斯化学株式会社 | 2025-02-11 | — | — | CN | disclosed |
| CN-112136081-B | Photosensitive transfer material, method for manufacturing circuit wiring, and method for manufacturing touch panel | 富士胶片株式会社 | 2024-11-19 | — | — | CN | disclosed |
| CN-113946103-B | Dry film resist, method for manufacturing circuit wiring, input device, and display device | 富士胶片株式会社 | 2024-05-07 | — | — | CN | disclosed |
| CN-117769684-A | Resist auxiliary film composition and pattern forming method using the same | 三菱瓦斯化学株式会社 | 2024-03-26 | — | — | CN | disclosed |
| CN-117716290-A | Resist composition and method for forming resist film using the same | 三菱瓦斯化学株式会社 | 2024-03-15 | — | — | CN | disclosed |
| US-5928837-A | Negative-working chemical-sensitization photoresist composition comprising oxime sulfonate compounds | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-07-27 | — | — | US | disclosed |
| US-5929271-A | Compounds for use in a positive-working resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-07-27 | — | — | US | disclosed |
| US-5925495-A | Photoresist laminate and method for patterning using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-07-20 | — | — | US | disclosed |
| US-5902713-A | Chemical-sensitization photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-05-11 | — | — | US | disclosed |
| US-5817444-A | POLYHYDROXYSTYRENE SUBSTITUTED WITH TETRAHYDROPYRAN GROUPS, POLYHYDROXYSTYRENE SUBSTITUTED WITH ALKOXYALKYL GROUPS | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-10-06 | — | — | US | disclosed |
| EP-0848289-A1 | Negative-working chemical sensitization photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-06-17 | — | — | EP | disclosed |
| EP-0821274-A1 | Chemical-sensitization resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1998-01-28 | — | — | EP | disclosed |
| EP-0780729-A1 | Chemical-sensitization photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-06-25 | — | — | EP | disclosed |