SCHEMBL36306

SCHEMBL36306

CCCOCN(OCCC)c1nc(N(OCCC)OCCC)nc(N(OCCC)OCCC)n1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL196668 0.86 TSHR (0.31)
SCHEMBL8411784 0.85 MEN1 (0.31)
SCHEMBL18843568 0.79
SCHEMBL5718733 0.78
SCHEMBL633501 0.70 ADRB2 (0.35)
SCHEMBL236952 0.70 MAPT (0.36)
SCHEMBL11713396 0.69
SCHEMBL11765536 0.66 SLC29A1 (0.30)
SCHEMBL20991778 0.66 HTT (0.36)
SCHEMBL11581934 0.66

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 258 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2845878-B1 POLYALKYLENE CARBONATE RESIN COMPOSITION HAVING AN INTERPENETRATING CROSSLINKED STRUCTURE SK INNOVATION CO LTD (KR) 2017-07-12 EP claimed
US-8664003-B2 Chip provided with film having hole pattern with the use of thermoresponsive polymer and method of producing the same TOYAMA PREFECTURE (JP) 2014-03-04 US claimed
EP-0211382-B1 Resin compositions and a process for preparing laminates therefrom DOW CHEMICAL CO (US) 1994-06-01 EP claimed
EP-0155469-B1 EPOXY RESIN COMPOSITION AND A PROCESS FOR PREPARING LAMINATES THEREFROM THE DOW CHEMICAL COMPANY (US) 1988-07-20 EP claimed
US-4143029-A HEXAKIS/ALKOXYMETHYL/MELAMINE, A TRIHYDROCARBYLCARBONYL MELAMINE, AND A BIS/MALEIMIDE UNIROYAL, INC. (US) 1979-03-06 US claimed
EP-4398289-A1 CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROCESSING LIQUID FUJIFILM Corporation (JP) 2024-07-10 EP disclosed
WO-2024143211-A1 MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER 富士フイルム株式会社 2024-07-04 WO disclosed
WO-2024143210-A1 MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER 富士フイルム株式会社 2024-07-04 WO disclosed
WO-2024143209-A1 METHOD FOR PRODUCING MULTILAYER BODY, PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR MEMBER 富士フイルム株式会社 2024-07-04 WO disclosed
WO-2024143212-A1 METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR MEMBER, AND RESIN COMPOSITION 富士フイルム株式会社 2024-07-04 WO disclosed
WO-2024122173-A1 (METH)ACRYLIC RESIN 株式会社レゾナック 2024-06-13 WO disclosed
WO-2024122170-A1 ADHESIVE COMPOSITION AND ADHESIVE SHEET 株式会社レゾナック 2024-06-13 WO disclosed
EP-0074010-A2 Coating compositions for thermoplastic polymers BAYER AG (DE) 1983-03-16 EP disclosed
EP-0017187-B1 COATING COMPOSITIONS CONTAINING POLYSILOXANE, THEIR USE AND THERMOPLASTS COATED THEREWITH BAYER AG (DE) 1982-10-20 EP disclosed
US-4315091-A SILOXANES BAYER AKTIENGESELLSCHAFT (DE) 1982-02-09 US disclosed
EP-0017187-A1 Coating compositions containing polysiloxane, their use and thermoplasts coated therewith BAYER AG (DE) 1980-10-15 EP disclosed
US-4225645-A CONTAINING A HEXAALKOXYMETHYL MELAMINE UNIROYAL, INC. (US) 1980-09-30 US disclosed
US-4162276-A CONTAINING A HEXAALKOXYMETHYLMELAMINE, ORGANIC HALOGEN COMPOUND, A PHOSPHOCYCLOPENTANE-1-OXIDE UNIROYAL, INC. (US) 1979-07-24 US disclosed
US-4147678-A HEXAKIS(ALKOXYMETHYL)MELAMINE, ORGANIC HALIDE, ANTIMONY COMPOUND UNIROYAL, INC. (US) 1979-04-03 US disclosed
US-4143029-A HEXAKIS/ALKOXYMETHYL/MELAMINE, A TRIHYDROCARBYLCARBONYL MELAMINE, AND A BIS/MALEIMIDE UNIROYAL, INC. (US) 1979-03-06 US disclosed