SCHEMBL364323

SCHEMBL364323

C=C(C)C(=O)OC12CC3CC(CC(C3)C1(O)O)C2

nearest known ligand 0.34

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.31
EPHX2 P34913 1/20 0.31
ELANE P08246 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3182587 0.84 SCN1A (0.32) ALDH1A1
SCHEMBL3856231 0.83 GLA (0.32) ALDH1A1
SCHEMBL15205966 0.80 TSHR (0.31) ALDH1A1
SCHEMBL5668031 0.80 TGM2 (0.34)
SCHEMBL18823007 0.79 ALDH1A1 (0.31) ALDH1A1
SCHEMBL15205287 0.79 EPHX2 (0.31) ALDH1A1EPHX2
SCHEMBL13244778 0.78 ALDH1A1 (0.34) ALDH1A1EPHX2
SCHEMBL1069286 0.77 ALDH1A1 (0.31) ALDH1A1
SCHEMBL15206176 0.77 MEN1 (0.32) ALDH1A1EPHX2
SCHEMBL5693012 0.76 SCN1A (0.31) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 93 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12386265-B2 Pattern forming method and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2025-08-12 US disclosed
US-12264073-B2 Composite material ADEKA CORPORATION (JP) 2025-04-01 US disclosed
US-20240295822-A1 PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2024-09-05 US disclosed
US-12013644-B2 Method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2024-06-18 US disclosed
US-11584810-B2 Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, method of manufacturing electronic device, compound, and resin FUJIFILM CORPORATION (JP) 2023-02-21 US disclosed
EP-3537217-B1 POSITIVE RESIST COMPOSITION, RESIN USED FOR THE POSITIVE RESIST COMPOSITION, COMPOUND USED FOR SYNTHESIS OF THE RESIN AND PATTERN FORMING METHOD USING THE POSITIVE RESIST COMPOSITION FUJIFILM CORP (JP) 2022-08-31 EP disclosed
CN-109643064-B Photosensitive or radiation-sensitive resin composition, film thereof, pattern forming method, electronic device manufacturing method, compound, and resin 富士胶片株式会社 2022-07-26 CN disclosed
CN-114706271-A Processing liquid for semiconductor manufacturing and pattern forming method 富士胶片株式会社 2022-07-05 CN disclosed
US-20220121123-A1 METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2022-04-21 US disclosed
CN-108885412-B Processing liquid for semiconductor manufacturing and pattern forming method 富士胶片株式会社 2022-04-05 CN disclosed
US-20070224539-A1 Resist composition and pattern forming method using the same FUJIFILM CORPORATION (JP) 2007-09-27 US disclosed
EP-1837704-A2 Resist composition and pattern forming method using the same FUJIFILM Corporation (JP) 2007-09-26 EP disclosed
US-20070178405-A1 Positive resist composition and method of pattern formation with the same FUJI PHOTO FILM CO., LTD. 2007-08-02 US disclosed
US-20070134588-A1 Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition FUJIFILM CORPORATION (JP) 2007-06-14 US disclosed
EP-1795960-A2 Positive resist composition, resin used for the positive resist composition, compound used for synthesis of the resin and pattern forming method using the positive resist composition Fujifilm Corporation (JP) 2007-06-13 EP disclosed
EP-1754999-A2 Positive resist composition and method of pattern formation with the same Fuji Photo Film Co., Ltd. (JP) 2007-02-21 EP disclosed
US-6824956-B2 ADDITION POLYMER CONTAINING UNITS OF AN ADAMANTYL ESTER HAVING HYDROXY GROUPS FUJI PHOTO FILM CO., LTD. (JP) 2004-11-30 US disclosed
US-20040191676-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2004-09-30 US disclosed
US-20030194640-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2003-10-16 US disclosed
EP-1338922-A2 Positive resist composition FUJI PHOTO FILM CO., LTD. (JP) 2003-08-27 EP disclosed