Predicted protein targets (top 2)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | IAPP | P10997 | 3/20 | 0.49 |
| ▸ | TYR | P14679 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3657566 | 1.00 | IAPP (0.49) | IAPPTYR | |
| SCHEMBL31676616 | 1.00 | IAPP (0.49) | IAPPTYR | |
| SCHEMBL272405 | 0.80 | TYR (0.48) | TYR | |
| SCHEMBL29131809 | 0.79 | IAPP (0.58) | IAPPTYR | |
| SCHEMBL10608049 | 0.77 | TYR (0.73) | TYR | |
| SCHEMBL10607947 | 0.77 | TYR (0.73) | TYR | |
| SCHEMBL10608016 | 0.77 | TYR (0.73) | TYR | |
| SCHEMBL6436060 | 0.77 | TYR (0.73) | TYR | |
| SCHEMBL3654000 | 0.76 | TYR (0.45) | TYR | |
| SCHEMBL7855812 | 0.76 | TYR (0.64) | TYR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 83 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2203783-A2 | THICK FILM RESISTS | AZ Electronic Materials USA Corp. (US) | 2010-07-07 | — | — | EP | claimed |
| WO-2009040661-A2 | THICK FILM RESISTS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2009-04-02 | — | — | WO | claimed |
| US-20090081589-A1 | THICK FILM RESISTS | MERCK PATENT GMBH (DE) | 2009-03-26 | — | — | US | claimed |
| EP-4702010-A1 | PHOTOACTIVE COMPOUNDS | Merck Patent GmbH (DE) | 2026-03-04 | — | — | EP | disclosed |
| US-20250376552-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-12-11 | — | — | US | disclosed |
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596608-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-20250236697-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-24 | — | — | US | disclosed |
| US-20250230283-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-17 | — | — | US | disclosed |
| WO-2024223739-A1 | PHOTOACTIVE COMPOUNDS | MERCK PATENT GMBH (DE) | 2024-10-31 | — | — | WO | disclosed |
| EP-0677789-A1 | Positive photoresist composition | Fuji Photo Film Co., Ltd. (JP) | 1995-10-18 | — | — | EP | disclosed |
| EP-0658807-A1 | Positive-working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1995-06-21 | — | — | EP | disclosed |
| US-5360692-A | Positive type 1,2-naphthoquinonediazide photoresist composition containing benzotriazole light absorbing agent | FUJI PHOTO FILM CO., LTD. (JP) | 1994-11-01 | — | — | US | disclosed |
| US-5340688-A | Containing mixture of 1,2-naphthoquinonediazidosulfonate esters of polyhydroxy compounds and alkali soluble resin | FUJI PHOTO FILM CO., LTD. (JP) | 1994-08-23 | — | — | US | disclosed |
| US-5324619-A | Sensitivity, resolution, heat resistance, developability | FUJI PHOTO FILM CO., LTD. (JP) | 1994-06-28 | — | — | US | disclosed |
| US-5324618-A | Provides pattern having high sensitivity, excellent resolution, developability and heat resistance | FUJI PHOTO FILM CO., LTD. (JP) | 1994-06-28 | — | — | US | disclosed |
| US-5318875-A | Resolution; heat resistance; photosensitivity; developability; integrated circuits; semiconductors | FUJI PHOTO FILM CO., LTD. (JP) | 1994-06-07 | — | — | US | disclosed |
| EP-0555861-A1 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1993-08-18 | — | — | EP | disclosed |
| EP-0445819-A2 | Positive type photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1991-09-11 | — | — | EP | disclosed |