Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TYR | P14679 | 1/20 | 0.45 |
| ▸ | CDK1 | P06493 | 1/20 | 0.39 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.36 |
| ▸ | BID | P55957 | 2/20 | 0.35 |
| ▸ | BCL2L1 | Q07817 | 2/20 | 0.35 |
| ▸ | MCL1 | Q07820 | 2/20 | 0.35 |
| ▸ | BAK1 | Q16611 | 2/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.35 |
| ▸ | MMP2 | P08253 | 1/20 | 0.35 |
| ▸ | F7 | P08709 | 1/20 | 0.35 |
| ▸ | MAPT | P10636 | 1/20 | 0.35 |
| ▸ | F3 | P13726 | 1/20 | 0.35 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.35 |
| ▸ | ECE1 | P42892 | 1/20 | 0.35 |
| ▸ | SGMS1 | Q86VZ5 | 1/20 | 0.35 |
| ▸ | SGMS2 | Q8NHU3 | 1/20 | 0.35 |
| ▸ | MUS81 | Q96NY9 | 1/20 | 0.35 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.35 |
| ▸ | SAE1 | Q9UBE0 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18339444 | 0.85 | PRKCI (0.38) | — | |
| SCHEMBL28202939 | 0.80 | TYR (0.42) | TYRALOX15 | |
| SCHEMBL272405 | 0.78 | TYR (0.48) | TYR | |
| SCHEMBL25238284 | 0.77 | TYR (0.60) | TYRHIF1AMAPT | |
| SCHEMBL10986621 | 0.76 | MGLL (0.56) | HIF1ABIDBCL2L1MCL1BAK1 | |
| SCHEMBL3657566 | 0.76 | IAPP (0.49) | TYR | |
| SCHEMBL3654003 | 0.76 | IAPP (0.49) | TYR | |
| SCHEMBL31676616 | 0.76 | IAPP (0.49) | TYR | |
| SCHEMBL6436060 | 0.76 | TYR (0.73) | TYRBIDBCL2L1MCL1BAK1 | |
| SCHEMBL10607947 | 0.76 | TYR (0.73) | TYRBIDBCL2L1MCL1BAK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2203783-A2 | THICK FILM RESISTS | AZ Electronic Materials USA Corp. (US) | 2010-07-07 | — | — | EP | claimed |
| WO-2009040661-A2 | THICK FILM RESISTS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2009-04-02 | — | — | WO | claimed |
| US-20090081589-A1 | THICK FILM RESISTS | MERCK PATENT GMBH (DE) | 2009-03-26 | — | — | US | claimed |
| EP-4702010-A1 | PHOTOACTIVE COMPOUNDS | Merck Patent GmbH (DE) | 2026-03-04 | — | — | EP | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-20250230283-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-17 | — | — | US | disclosed |
| WO-2024223739-A1 | PHOTOACTIVE COMPOUNDS | MERCK PATENT GMBH (DE) | 2024-10-31 | — | — | WO | disclosed |
| EP-4317287-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2024-02-07 | — | — | EP | disclosed |
| EP-1877865-B1 | NANOCOMPOSITE PHOTORESIST COMPOSITION FOR IMAGING THICK FILMS | MERCK PATENT GMBH (DE) | 2019-11-13 | — | — | EP | disclosed |
| EP-2203783-B1 | THICK FILM RESISTS | MERCK PATENT GMBH (DE) | 2019-11-13 | — | — | EP | disclosed |
| US-5360692-A | Positive type 1,2-naphthoquinonediazide photoresist composition containing benzotriazole light absorbing agent | FUJI PHOTO FILM CO., LTD. (JP) | 1994-11-01 | — | — | US | disclosed |
| US-5340688-A | Containing mixture of 1,2-naphthoquinonediazidosulfonate esters of polyhydroxy compounds and alkali soluble resin | FUJI PHOTO FILM CO., LTD. (JP) | 1994-08-23 | — | — | US | disclosed |
| US-5324619-A | Sensitivity, resolution, heat resistance, developability | FUJI PHOTO FILM CO., LTD. (JP) | 1994-06-28 | — | — | US | disclosed |
| US-5324618-A | Provides pattern having high sensitivity, excellent resolution, developability and heat resistance | FUJI PHOTO FILM CO., LTD. (JP) | 1994-06-28 | — | — | US | disclosed |
| US-5318875-A | Resolution; heat resistance; photosensitivity; developability; integrated circuits; semiconductors | FUJI PHOTO FILM CO., LTD. (JP) | 1994-06-07 | — | — | US | disclosed |
| EP-0555861-A1 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1993-08-18 | — | — | EP | disclosed |
| EP-0445819-A2 | Positive type photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1991-09-11 | — | — | EP | disclosed |
| EP-0193166-B1 | LIGHT-SENSITIVE COMPOSITION AND LIGHT-SENSITIVE POSITIVE REGISTRATION MATERIAL | HOECHST CELANESE CORPORATION (US) | 1991-05-08 | — | — | EP | disclosed |
| EP-0193166-A2 | Light-sensitive composition and light-sensitive positive registration material | HOECHST CELANESE CORPORATION (US) | 1986-09-03 | — | — | EP | disclosed |