Predicted protein targets (top 2)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TYR | P14679 | 2/20 | 0.48 |
| ▸ | PRKCI | P41743 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2976454 | 0.88 | TYR (0.44) | TYRPRKCI | |
| SCHEMBL2382145 | 0.86 | TYR (0.61) | TYRPRKCI | |
| SCHEMBL6343723 | 0.84 | TYR (0.70) | TYRPRKCI | |
| SCHEMBL10607947 | 0.83 | TYR (0.73) | TYR | |
| SCHEMBL10608016 | 0.83 | TYR (0.73) | TYR | |
| SCHEMBL6436060 | 0.83 | TYR (0.73) | TYR | |
| SCHEMBL10608049 | 0.83 | TYR (0.73) | TYR | |
| SCHEMBL2989003 | 0.82 | KDM4E (0.43) | TYRPRKCI | |
| SCHEMBL30045892 | 0.82 | KDM4E (0.43) | TYRPRKCI | |
| SCHEMBL29131809 | 0.81 | IAPP (0.58) | TYRPRKCI |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 174 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2203783-A2 | THICK FILM RESISTS | AZ Electronic Materials USA Corp. (US) | 2010-07-07 | — | — | EP | claimed |
| WO-2009040661-A2 | THICK FILM RESISTS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2009-04-02 | — | — | WO | claimed |
| US-20090081589-A1 | THICK FILM RESISTS | MERCK PATENT GMBH (DE) | 2009-03-26 | — | — | US | claimed |
| JP-3164740-A | — | — | None | — | — | JP | disclosed |
| US-12547074-B2 | Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element | RESONAC CORPORATION (JP) | 2026-02-10 | — | — | US | disclosed |
| US-20250376552-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-12-11 | — | — | US | disclosed |
| US-12405198-B2 | Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device | RESONAC CORPORATION (JP) | 2025-09-02 | — | — | US | disclosed |
| US-20250264801-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-08-21 | — | — | US | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596608-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-1028354-A1 | Positive photosensitive resin composition, method of forming relief pattern, and electronic part | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2000-08-16 | — | — | EP | disclosed |
| EP-0961169-A1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 1999-12-01 | — | — | EP | disclosed |
| US-5985507-A | PHOTORESISTS WITH THERMAL PROPERTIES | OLIN MICROELECTRONIC CHEMICALS, INC. (US) | 1999-11-16 | — | — | US | disclosed |
| US-5945516-A | PRIOR TO ESTERIFICATION OF THE POLYHYDROXY PHENOL WITH THE NAPHTHOQUINONE DIAZIDE SULFONYL HALIDE, THE REACTANTS ARE INITIALLY DISSOLVED IN AN APROTIC SOLVENT TOGETHER WITH STRONG BASE; NONPRECIPITATING, FOR FORMATION OF PHOTORESISTS | SHIPLEY COMPANY, L.L.C. (US) | 1999-08-31 | — | — | US | disclosed |
| WO-1999042507-A1 | SELECTED HIGH THERMAL NOVOLAKS AND POSITIVE-WORKING RADIATION-SENSITIVE COMPOSITIONS | OLIN MICROELECTRONIC CHEMICALS, INC. (US) | 1999-08-26 | — | — | WO | disclosed |
| US-5821345-A | DISSOLVING WITH A STRONG BASE AND APROTIC SOLVENT; ESTER INTERCHANGE | SHIPLEY COMPANY, L.L.C. (US) | 1998-10-13 | — | — | US | disclosed |
| EP-0863436-A1 | Heat resistant photosensitive polymer composition, process for forming pattern and semiconductor device | HITACHI CHEMICAL CO., LTD. (JP) | 1998-09-09 | — | — | EP | disclosed |
| US-5674657-A | PHENOLIC RESIN COPOLYMER COMPRISING META-CRESOL, PARA-CRESOL AND OTHER PHENOLIC MONOMER SELECTED FROM XYLENOLS, METHOXYPHENOLS; RADIATION SENSITIVITY | OLIN MICROELECTRONIC CHEMICALS, INC. (US) | 1997-10-07 | — | — | US | disclosed |
| JP-H03164740-A | POSITIVE TYPE PHOTORESIST COMPOSITION AND MANUFACTURE OF RESIST PATTERN | HITACHI CHEM CO LTD | 1991-07-16 | — | — | JP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12547074-B2 | Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element | JMJD6, RARA, BCR | TYR 123/4885PRKCI 2607/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.