Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SELL | P14151 | 1/20 | 0.60 |
| ▸ | SELP | P16109 | 1/20 | 0.60 |
| ▸ | PIK3CA | P42336 | 5/20 | 0.58 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.50 |
| ▸ | MAPT | P10636 | 4/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.45 |
| ▸ | RECQL | P46063 | 3/20 | 0.45 |
| ▸ | POLB | P06746 | 2/20 | 0.45 |
| ▸ | MPI | P34949 | 2/20 | 0.45 |
| ▸ | TLR2 | O60603 | 1/20 | 0.45 |
| ▸ | NSD2 | O96028 | 1/20 | 0.45 |
| ▸ | PKM | P14618 | 1/20 | 0.45 |
| ▸ | GRK6 | P43250 | 1/20 | 0.45 |
| ▸ | TLR1 | Q15399 | 1/20 | 0.45 |
| ▸ | TLR6 | Q9Y2C9 | 1/20 | 0.45 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.45 |
| ▸ | HPGD | P15428 | 2/20 | 0.44 |
| ▸ | RAB9A | P51151 | 2/20 | 0.44 |
| ▸ | LMNA | P02545 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6847306 | 0.82 | PIK3CA (0.82) | SELLSELPPIK3CAHDAC1MAPT | |
| SCHEMBL11419973 | 0.82 | SELL (0.56) | SELLSELPPIK3CAHDAC1MAPT | |
| SCHEMBL15673064 | 0.82 | SELL (0.56) | SELLSELPPIK3CAHDAC1MAPT | |
| SCHEMBL2986601 | 0.82 | HSP90AB1 (0.57) | SELLSELPPIK3CAHDAC1MAPT | |
| SCHEMBL8041510 | 0.80 | PIK3CA (0.68) | SELLSELPPIK3CAHDAC1MAPT | |
| SCHEMBL7773826 | 0.80 | SELL (0.54) | SELLSELPPIK3CAHDAC1MAPT | |
| SCHEMBL29557383 | 0.79 | ALDH1A1 (0.59) | SELLSELPPIK3CAHDAC1MAPT | |
| SCHEMBL9313474 | 0.79 | SELL (0.58) | SELLSELPPIK3CAHDAC1MAPT | |
| SCHEMBL4213430 | 0.79 | ALDH1A1 (0.59) | SELLSELPPIK3CAHDAC1MAPT | |
| SCHEMBL63797 | 0.79 | ALDH1A1 (0.55) | SELLSELPPIK3CAHDAC1MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 175 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2203783-A2 | THICK FILM RESISTS | AZ Electronic Materials USA Corp. (US) | 2010-07-07 | — | — | EP | claimed |
| WO-2009040661-A2 | THICK FILM RESISTS | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2009-04-02 | — | — | WO | claimed |
| US-20090081589-A1 | THICK FILM RESISTS | MERCK PATENT GMBH (DE) | 2009-03-26 | — | — | US | claimed |
| EP-4702010-A1 | PHOTOACTIVE COMPOUNDS | Merck Patent GmbH (DE) | 2026-03-04 | — | — | EP | disclosed |
| US-20250376552-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-12-11 | — | — | US | disclosed |
| US-20250264801-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-08-21 | — | — | US | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596608-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-20250236697-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-24 | — | — | US | disclosed |
| US-20250230283-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-17 | — | — | US | disclosed |
| EP-0445680-A2 | Positive type photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1991-09-11 | — | — | EP | disclosed |
| EP-0443820-A2 | Radiation-sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1991-08-28 | — | — | EP | disclosed |
| EP-0428398-A2 | Radiation-sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1991-05-22 | — | — | EP | disclosed |
| EP-0410760-A2 | Light-sensitive compositions | FUJI PHOTO FILM CO., LTD. (JP) | 1991-01-30 | — | — | EP | disclosed |
| EP-0395049-A1 | Positive-working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1990-10-31 | — | — | EP | disclosed |
| EP-0385442-A1 | Positive-working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1990-09-05 | — | — | EP | disclosed |
| EP-0365318-A2 | Radiation-sensitive resin composition | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1990-04-25 | — | — | EP | disclosed |
| US-4883739-A | PHOTORESISTS | FUJI PHOTO FILM CO., LTD. (JP) | 1989-11-28 | — | — | US | disclosed |
| EP-0307951-A2 | Light-sensitive resin composition | FUJI PHOTO FILM CO., LTD. (JP) | 1989-03-22 | — | — | EP | disclosed |