SCHEMBL3660464

SCHEMBL3660464

Cc1csc(C(=O)C(C)(N2CCOCC2)S(C)(=O)=O)c1

nearest known ligand 0.39

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
DAO P14920 1/20 0.39
SMN1; SMN2 Q16637 5/20 0.38
ALDH1A1 P00352 4/20 0.38
TSHR P16473 1/20 0.38
MAPK1 P28482 1/20 0.38
KMT2A Q03164 4/20 0.35
MEN1 O00255 3/20 0.35
KDM4E B2RXH2 2/20 0.35
THRB P10828 1/20 0.35
RECQL P46063 1/20 0.35
LMNA P02545 3/20 0.34
HTT P42858 2/20 0.34
GAA P10253 1/20 0.34
MAPT P10636 2/20 0.34
POLB P06746 1/20 0.34
CNR2 P34972 3/20 0.33
CNR1 P21554 2/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
PKM P14618 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL57063 0.87 ALDH1A1 (0.46) DAOSMN1; SMN2ALDH1A1TSHRMAPK1
Acetic Acid SCHEMBL31398487 0.83 DAO (0.45) DAOSMN1; SMN2ALDH1A1TSHRMAPK1
SCHEMBL9564682 0.79 HPGD (0.40) DAOSMN1; SMN2ALDH1A1TSHRMAPK1
SCHEMBL10383861 0.78 HPGD (0.39) DAOSMN1; SMN2ALDH1A1TSHRMAPK1
SCHEMBL5367666 0.78 DAO (0.39) DAOSMN1; SMN2ALDH1A1TSHRMAPK1
SCHEMBL29051656 0.75 SMN1; SMN2 (0.44) DAOSMN1; SMN2ALDH1A1TSHRMAPK1
SCHEMBL1290533 0.75 SMN1; SMN2 (0.43) SMN1; SMN2ALDH1A1TSHRMAPK1KMT2A
SCHEMBL28278808 0.74 DAO (0.41) DAOSMN1; SMN2ALDH1A1TSHRMAPK1
SCHEMBL10384869 0.74 DAO (0.35) DAOALDH1A1MAPK1KMT2AMEN1
SCHEMBL10385894 0.74 DAO (0.49) DAOSMN1; SMN2ALDH1A1MAPK1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2172526-A1 Pressure-Sensitive Adhesive Sheet for Laser Processing and Method for Laser Processing Nitto Denko Corporation (JP) 2010-04-07 EP disclosed