SCHEMBL3665727

SCHEMBL3665727

CN(c1ccc(N2C(=O)C=CC2=O)cc1)c1ccc(N2C(=O)C=CC2=O)cc1

nearest known ligand 0.65

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 16/20 0.65
FAAH O00519 6/20 0.65
HSP90AA1 P07900 3/20 0.54
TDP1 Q9NUW8 2/20 0.54
PKM P14618 1/20 0.54
MAPK1 P28482 1/20 0.54
NPSR1 Q6W5P4 1/20 0.54
DDAH1 O94760 1/20 0.48
BCHE P06276 1/20 0.48
ALDH1A1 P00352 1/20 0.47
LMNA P02545 1/20 0.47
CCR6 P51684 1/20 0.47
CACNA1B Q00975 1/20 0.47
APBA1 Q02410 1/20 0.47
APOBEC3G Q9HC16 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7062361 0.92 MGLL (0.61) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL3759716 0.87 MGLL (0.65) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL3672504 0.82 MGLL (0.71) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL95324 0.81 MGLL (1.00) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL28774595 0.78 MEN1 (0.62) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL8467655 0.77 HSP90AA1 (0.64) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL5150580 0.77 MGLL (0.52) MGLLFAAHTDP1PKMMAPK1
SCHEMBL8995941 0.77 MGLL (0.57) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL4289960 0.77 MGLL (0.52) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL458382 0.77 MGLL (0.52) MGLLFAAHHSP90AA1TDP1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023127523-A1 RESIN COMPOSITION, MULTILAYER SHEET, PREPREG, CURED PRODUCT, SUBSTRATE WITH CURED PRODUCT, AND ELECTRONIC DEVICE 東洋インキSCホールディングス株式会社 2023-07-06 WO disclosed
US-9199434-B2 Resin composition, prepreg and their uses MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2015-12-01 US disclosed
US-20140235126-A1 RESIN COMPOSITION, PREPREG AND THEIR USES MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-08-21 US disclosed
US-8748541-B2 Resin composition, prepreg and their uses MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-06-10 US disclosed
EP-2090612-B1 Resin composition, prepreg and their uses MITSUBISHI GAS CHEMICAL CO (JP) 2010-11-10 EP disclosed
EP-2090612-A1 Resin composition, prepreg and their uses Mitsubishi Gas Chemical Company, Inc. (JP) 2009-08-19 EP disclosed
US-20090203279-A1 Resin composition, prepreg and their uses MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2009-08-13 US disclosed