Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.39 |
| ▸ | CSNK2A1 | P68400 | 1/20 | 0.31 |
| ▸ | CDK4 | P11802 | 1/20 | 0.31 |
| ▸ | CCND1 | P24385 | 1/20 | 0.31 |
| ▸ | ADORA3 | P0DMS8 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL26937741 | 0.86 | SMPD3 (0.36) | KDM4EALDH1A1CDK4CCND1ADORA3 | |
| SCHEMBL11268737 | 0.86 | KDM4E (0.36) | KDM4EALDH1A1ADORA3 | |
| SCHEMBL5674014 | 0.78 | — | — | |
| SCHEMBL5267992 | 0.78 | — | — | |
| Hydrochloric Acid SCHEMBL11307967 | 0.76 | ALDH1A1 (0.34) | KDM4EALDH1A1CSNK2A1CDK4CCND1 | |
| Hydrochloric Acid SCHEMBL11466216 | 0.76 | ALDH1A1 (0.39) | ALDH1A1ADORA3 | |
| SCHEMBL3028139 | 0.74 | — | — | |
| SCHEMBL7558596 | 0.73 | KDM4E (0.38) | KDM4EALDH1A1 | |
| SCHEMBL14289963 | 0.73 | CSNK2A1 (0.33) | KDM4EALDH1A1CSNK2A1CDK4CCND1 | |
| SCHEMBL4353447 | 0.73 | ADORA1 (0.39) | KDM4EALDH1A1ADORA3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-5239187-A | — | — | None | — | — | JP | disclosed |
| JP-7224042-A | — | — | None | — | — | JP | disclosed |
| US-7714080-B2 | comprising alkoxysilyl-containing polyamide-imide resin, epoxy resin, curing promoter, and organic solvent; forms cured coating having heat resistance and water resistance through brief low-temperature heating and helps bonding of epoxy resin molding compound to semiconductor | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2010-05-11 | — | — | US | disclosed |
| US-7614145-B2 | Method for manufacturing multilayer circuit board and resin base material | ZEON CORPORATION (JP) | 2009-11-10 | — | — | US | disclosed |
| US-20080217617-A1 | Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same | ZEON CORPORATION (JP) | 2008-09-11 | — | — | US | disclosed |
| US-20060199923-A1 | comprising alkoxysilyl-containing polyamide-imide resin, epoxy resin, curing promoter, and organic solvent; forms cured coating having heat resistance and water resistance through brief low-temperature heating and helps bonding of epoxy resin molding compound to semiconductor | SHIN-ETSU CHEMICAL CO., LTD. | 2006-09-07 | — | — | US | disclosed |
| US-20050153059-A1 | Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board | ZEON CORPORATION (JP) | 2005-07-14 | — | — | US | disclosed |
| US-20040237295-A1 | Multilayer circuit board and resin base material, and its production method | ZEON CORPORATION (JP) | 2004-12-02 | — | — | US | disclosed |
| US-6007966-A | POLYMERIC BINDER CONTAINING STYRENE-MALEIC ANHYDRIDE COPOLYMER, UNSATURATED COMPOUND CONTAINING AT LEAST ONE HYDROXYL GROUP AND AT LEAST THREE ACRYLIC GROUPS AND A SATURATED ALCOHOL | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) | 1999-12-28 | — | — | US | disclosed |
| EP-0590420-B1 | Impact-resistant polyoxymethylene molding compositions | BASF AG (DE) | 1997-01-29 | — | — | EP | disclosed |
| US-5310822-A | Chemical resistance | BASF AKTIENGESELLSCHAFT (DE) | 1994-05-10 | — | — | US | disclosed |
| EP-0590420-A1 | Impact-resistant polyoxymethylene molding compositions | BASF Aktiengesellschaft (DE) | 1994-04-06 | — | — | EP | disclosed |
| JP-H05239187-A | METHOD FOR CURING EPOXY RESIN | SHIKOKU CHEM CORP | 1993-09-17 | — | — | JP | disclosed |
| US-5173543-A | Polyurethanes, polyesterethers, polyamideethers from polycarbonateether diols | BASF AKTIENGESELLSCHAFT (DE) | 1992-12-22 | — | — | US | disclosed |
| EP-0442359-A2 | Thermoplastic polyurethanes | BASF Aktiengesellschaft (DE) | 1991-08-21 | — | — | EP | disclosed |
| EP-0313724-A2 | Bis (acyloxymethyl) imidazole Derivative | THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK (US) | 1989-05-03 | — | — | EP | disclosed |
| US-4658035-A | REACTING 2-ALKYLIMIDAZOLE WITH FORMALDEHYDE | BASF AKTIENGESELLSCHAFT (DE) | 1987-04-14 | — | — | US | disclosed |
| EP-0073008-B1 | CATIONIC DYESTUFFS | BASF Aktiengesellschaft (DE) | 1984-11-07 | — | — | EP | disclosed |
| US-4472581-A | Imidazomethylene dyes | BASF AKTIENGESELLSCHAFT (DE) | 1984-09-18 | — | — | US | disclosed |
| EP-0073008-A2 | Cationic dyestuffs | BASF Aktiengesellschaft (DE) | 1983-03-02 | — | — | EP | disclosed |