SCHEMBL4353447

SCHEMBL4353447

CCc1nc(CO)c(CO)[nH]1

nearest known ligand 0.39

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
ADORA1 P30542 5/20 0.39
ADORA3 P0DMS8 4/20 0.39
ADORA2A P29274 3/20 0.39
DDAH1 O94760 1/20 0.34
GAA P10253 1/20 0.32
HTT P42858 1/20 0.32
KDM4E B2RXH2 1/20 0.32
ALDH1A1 P00352 1/20 0.32
TNKS2 Q9H2K2 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7558596 0.84 KDM4E (0.38) KDM4EALDH1A1
SCHEMBL4356818 0.83 GLA (0.35) ADORA1ADORA3ADORA2AKDM4EALDH1A1
SCHEMBL4356446 0.80 ALDH1A1 (0.42) ALDH1A1
SCHEMBL9081675 0.79 GPR84 (0.45) ALDH1A1
SCHEMBL6003149 0.78 ADORA1 (0.39) ADORA1ADORA3ADORA2ADDAH1GAA
SCHEMBL9082048 0.77 GPR84 (0.46) ALDH1A1
SCHEMBL4356039 0.77 GPR84 (0.46) ALDH1A1
SCHEMBL9082364 0.77 GPR84 (0.46) ALDH1A1
SCHEMBL9081998 0.77 GPR84 (0.46) ALDH1A1
SCHEMBL9082927 0.77 GPR84 (0.46) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4663190-A CURING EPOXY RESIN, DIBASIC ACID, IMIDAZOLE HITACHI CHEMICAL COMPANY, LTD. (JP) 1987-05-05 US claimed
CN-103709200-A Organic coordination zero-dimension single-molecular magnet material of Mn as well as preparation method and application of material UNIV BEIJING TECHNOLOGY 2014-04-09 CN disclosed
US-20120162588-A1 LIQUID CRYSTAL ALIGNMENT AGENT, AND LIQUID CRYSTAL ALIGNMENT FILM AND LIQUID CRYSTAL DISPLAY ELEMENT FORMED FROM THE LIQUID CRYSTAL ALIGNMENT AGENT CHI MEI CORPORATION (TW) 2012-06-28 US disclosed
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed
EP-0611758-B1 Process for synthesizing 4-halo-5(hydroxymethyl) imidazole compounds and certain novel 4-halo-5(hydroxymethyl) imidazole compounds SHIKOKU CHEM (JP) 1996-10-16 EP disclosed
US-5514811-A Process for synthesizing 4-halo-5-(hydroxymethyl) imidazole compounds SHIKOKU CHEMICALS CORPORATION (JP) 1996-05-07 US disclosed
EP-0611758-A1 Process for synthesizing 4-halo-5(hydroxymethyl) imidazole compounds and certain novel 4-halo-5(hydroxymethyl) imidazole compounds SHIKOKU CHEMICALS CORPORATION (JP) 1994-08-24 EP disclosed
US-4663190-A CURING EPOXY RESIN, DIBASIC ACID, IMIDAZOLE HITACHI CHEMICAL COMPANY, LTD. (JP) 1987-05-05 US disclosed
US-4658035-A REACTING 2-ALKYLIMIDAZOLE WITH FORMALDEHYDE BASF AKTIENGESELLSCHAFT (DE) 1987-04-14 US disclosed
EP-0171584-A1 Process for the preparation of 2-alkyl-4,5-dihydroxyimidazoles BASF Aktiengesellschaft (DE) 1986-02-19 EP disclosed