Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.47 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.47 |
| ▸ | ALOX15 | P16050 | 3/20 | 0.47 |
| ▸ | TSHR | P16473 | 3/20 | 0.47 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.47 |
| ▸ | ALOX12 | P18054 | 2/20 | 0.47 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.47 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 3/20 | 0.47 |
| ▸ | THRB | P10828 | 2/20 | 0.41 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.41 |
| ▸ | LMNA | P02545 | 1/20 | 0.41 |
| ▸ | RECQL | P46063 | 1/20 | 0.41 |
| ▸ | ATM | Q13315 | 1/20 | 0.41 |
| ▸ | TP53 | P04637 | 1/20 | 0.41 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.41 |
| ▸ | CASP1 | P29466 | 1/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.41 |
| ▸ | GAA | P10253 | 2/20 | 0.41 |
| ▸ | G6PD | P11413 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2222520 | 0.98 | ALDH1A1 (0.46) | ALDH1A1CYP3A4ALOX15TSHRHSD17B10 | |
| SCHEMBL1261746 | 0.82 | G6PD (0.46) | ALDH1A1CYP3A4ALOX15TSHRHSD17B10 | |
| SCHEMBL27245488 | 0.82 | ALDH1A1 (0.45) | ALDH1A1CYP3A4ALOX15TSHRHSD17B10 | |
| SCHEMBL3166941 | 0.75 | MAPT (0.47) | ALDH1A1TDP1LMNASMN1; SMN2KCNH3 | |
| SCHEMBL16714786 | 0.75 | SIGMAR1 (0.58) | ALDH1A1MAPK1L3MBTL1LMNAATM | |
| SCHEMBL144972 | 0.75 | TDP1 (0.52) | ALDH1A1CYP3A4ALOX15TSHRHSD17B10 | |
| SCHEMBL28977466 | 0.74 | MAPT (0.36) | ALDH1A1L3MBTL1GAAKCNH3MAPT | |
| SCHEMBL8744834 | 0.71 | TDP1 (0.58) | ALDH1A1CYP3A4ALOX15TSHRHSD17B10 | |
| SCHEMBL13776661 | 0.71 | ALDH1A1 (0.77) | ALDH1A1CYP3A4ALOX15TSHRHSD17B10 | |
| SCHEMBL94935 | 0.71 | ALDH1A1 (0.77) | ALDH1A1CYP3A4ALOX15TSHRHSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240201593-A1 | COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM | NISSAN CHEMICAL CORPORATION (JP) | 2024-06-20 | — | — | US | disclosed |
| US-11577995-B2 | Fiber-sizing agent, inorganic reinforcement material, resin composition, and molded article | MITSUI CHEMICALS, INC. (JP) | 2023-02-14 | — | — | US | disclosed |
| CN-114059672-A | Metal embedded part for hoisting assembly type concrete prefabricated part | 任丘市鑫标汽车配件有限公司 | 2022-02-18 | — | — | CN | disclosed |
| CN-111683786-B | Flux and solder paste | 千住金属工业株式会社 | 2022-01-11 | — | — | CN | disclosed |
| US-11179813-B2 | Flux and solder paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2021-11-23 | — | — | US | disclosed |
| CN-213448899-U | Metal embedded part for hoisting assembly type concrete prefabricated part | 任丘市鑫标汽车配件有限公司 | 2021-06-15 | — | — | CN | disclosed |
| US-20210078901-A1 | FIBER-SIZING AGENT, INORGANIC REINFORCEMENT MATERIAL, RESIN COMPOSITION, AND MOLDED ARTICLE | MITSUI CHEMICALS, INC. (JP) | 2021-03-18 | — | — | US | disclosed |
| US-20210069837-A1 | Flux and Solder Paste | SENJU METAL INDUSTRY CO., LTD. (JP) | 2021-03-11 | — | — | US | disclosed |
| CN-112469532-A | Flux composition, solder paste, solder joint, and solder joint method | 千住金属工业株式会社 | 2021-03-09 | — | — | CN | disclosed |
| CN-111683786-A | Flux and solder paste | 千住金属工业株式会社 | 2020-09-18 | — | — | CN | disclosed |
| CN-1930252-A | Curable liquid resin composition | DSM IP ASSESTS BV (NL) | 2007-03-14 | — | — | CN | disclosed |
| EP-1195083-B1 | UNDERFILLING MATERIAL FOR SEMICONDUCTOR PACKAGE | SUNSTAR ENGINEERING INC (JP) | 2006-01-11 | — | — | EP | disclosed |
| US-6881591-B2 | Underfilling material for semiconductor package | SUNSTAR SUISSE SA (CH) | 2005-04-19 | — | — | US | disclosed |
| US-20040112631-A1 | Underfilling material for semiconductor package | SUNSTAR GIKEN KABUSHIKI KAISHA | 2004-06-17 | — | — | US | disclosed |
| US-6660943-B1 | One-package type thermosetting urethane comprising prepolymer obtained by reacting polyol with excessive polyisocyanate; fine powder-coated curing agent; storage stability; low temperature curing | SUNSTAR GIKEN KABUSHIKI KAISHA (JP) | 2003-12-09 | — | — | US | disclosed |
| EP-1195083-A1 | UNDERFILLING MATERIAL FOR SEMICONDUCTOR PACKAGE | SUNSTAR GIKEN KABUSHIKI KAISHA (JP) | 2002-04-10 | — | — | EP | disclosed |
| WO-2001005203-A1 | UNDERFILLING MATERIAL FOR SEMICONDUCTOR PACKAGE | SUNSTAR GIKEN KABUSHIKI KAISHA (JP) | 2001-01-18 | — | — | WO | disclosed |
| US-5270353-A | Styrene-based polymer, filler | IDEMITSU KOSAN CO., LTD. (JP) | 1993-12-14 | — | — | US | disclosed |
| US-5079313-A | Mercapto-polysiloxane grafted with acrylate, dispersion of silicone resins in epoxy resins | SUNSTAR GIKEN KABUSHIKI KAISHA (JP) | 1992-01-07 | — | — | US | disclosed |
| US-4851481-A | CURABLE STABLE EPOXY DISPERSIONS WITH CROSSLINKED SILICONE PARTICLES; ANTICRACKING AGENTS; TOUGHNESS | SUNSTAR GIKEN KABUSHIKI KAISHA (JP) | 1989-07-25 | — | — | US | disclosed |