Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 5/20 | 0.56 |
| ▸ | KDM4E | B2RXH2 | 4/20 | 0.56 |
| ▸ | MEN1 | O00255 | 2/20 | 0.56 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.56 |
| ▸ | USP2 | O75604 | 1/20 | 0.56 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.52 |
| ▸ | HPGD | P15428 | 2/20 | 0.52 |
| ▸ | RECQL | P46063 | 1/20 | 0.52 |
| ▸ | CA1 | P00915 | 1/20 | 0.46 |
| ▸ | CA2 | P00918 | 1/20 | 0.46 |
| ▸ | LMNA | P02545 | 2/20 | 0.44 |
| ▸ | HTT | P42858 | 1/20 | 0.44 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.42 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.42 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.42 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.42 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.42 |
| ▸ | G6PD | P11413 | 1/20 | 0.42 |
| ▸ | PKM | P14618 | 1/20 | 0.42 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30058203 | 1.00 | MAPT (0.56) | MAPTKDM4EMEN1KMT2AUSP2 | |
| SCHEMBL1860044 | 0.82 | HTT (0.50) | MAPTKDM4EMEN1KMT2AUSP2 | |
| SCHEMBL29372751 | 0.80 | ACHE (0.48) | MAPTKDM4EMEN1KMT2AUSP2 | |
| SCHEMBL14507725 | 0.80 | KDM4E (0.58) | MAPTKDM4EMEN1KMT2AUSP2 | |
| SCHEMBL994122 | 0.80 | MAPT (0.46) | MAPTKDM4EMEN1KMT2AUSP2 | |
| SCHEMBL19003392 | 0.80 | SELL (0.48) | MAPTKDM4EMEN1KMT2AUSP2 | |
| SCHEMBL2562811 | 0.80 | ACHE (0.48) | MAPTKDM4EMEN1KMT2AUSP2 | |
| SCHEMBL70458 | 0.80 | ACHE (0.48) | MAPTKDM4EMEN1KMT2AUSP2 | |
| SCHEMBL68382 | 0.76 | CA1 (0.56) | MAPTKDM4EMEN1KMT2AUSP2 | |
| SCHEMBL283464 | 0.74 | ACHE (0.48) | MAPTKDM4EMEN1KMT2AUSP2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7745516-B2 | Composition of polyimide and sterically-hindered hydrophobic epoxy | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2010-06-29 | — | — | US | claimed |
| US-7604754-B2 | Resistor compositions for electronic circuitry applications | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2009-10-20 | — | — | US | claimed |
| US-20080185561-A1 | Resistor compositions for electronic circuitry applications | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2008-08-07 | — | — | US | claimed |
| US-20080185361-A1 | Compositions for electronic circuitry applications and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2008-08-07 | — | — | US | claimed |
| EP-1943311-A1 | COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO | E.I.Du pont de nemours and company (US) | 2008-07-16 | — | — | EP | claimed |
| WO-2007047384-A1 | COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-04-26 | — | — | WO | claimed |
| US-20070083017-A1 | Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2007-04-12 | — | — | US | claimed |
| US-7745516-B2 | Composition of polyimide and sterically-hindered hydrophobic epoxy | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2010-06-29 | — | — | US | disclosed |
| US-7604754-B2 | Resistor compositions for electronic circuitry applications | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2009-10-20 | — | — | US | disclosed |
| US-20080185561-A1 | Resistor compositions for electronic circuitry applications | U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT | 2008-08-07 | — | — | US | disclosed |
| US-20080185361-A1 | Compositions for electronic circuitry applications and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2008-08-07 | — | — | US | disclosed |
| EP-1943311-A1 | COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO | E.I.Du pont de nemours and company (US) | 2008-07-16 | — | — | EP | disclosed |
| WO-2007047384-A1 | COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2007-04-26 | — | — | WO | disclosed |
| US-20070083017-A1 | Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto | CDA PROCESSING LIMITED LIABILITY COMPANY | 2007-04-12 | — | — | US | disclosed |
| US-5206312-A | Polysiloxanes hydrosilated with unsaturated aromatic alcohols and siloxy-containing compounds having hydroxy groups to advance polyepoxides and epoxy resins; electronics; coatings; composites | THE DOW CHEMICAL COMPANY (US) | 1993-04-27 | — | — | US | disclosed |