SCHEMBL3680847

SCHEMBL3680847

C=C(C)C(=O)OC(C)(C)C12CC3CC(CC(C(C)(C)O)(C3)C1)C2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3680710 0.94 CYP17A1 (0.32)
SCHEMBL18994332 0.87
SCHEMBL678282 0.86 PKM (0.33)
SCHEMBL12326325 0.85 CYP17A1 (0.30)
SCHEMBL16708436 0.85
SCHEMBL10203937 0.85 CYP17A1 (0.30)
SCHEMBL172055 0.85 CYP17A1 (0.36)
SCHEMBL15281488 0.85 CYP17A1 (0.36)
SCHEMBL16708432 0.85 ALDH1A1 (0.33)
SCHEMBL16708441 0.83 CYP17A1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 73 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024024440-A1 SILICONE-CONTAINING COPOLYMER, LEVELING AGENT, COATING COMPOSITION, RESIST COMPOSITION, COLOR FILTER, AND METHOD FOR PRODUCING SILICONE-CONTAINING COPOLYMER DIC株式会社 2024-02-01 WO disclosed
US-20230400769-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-12-14 US disclosed
US-20230400769-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-12-14 US disclosed
US-20230185192-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-06-15 US disclosed
US-20230185192-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2023-06-15 US disclosed
WO-2023054126-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN-FORMING METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD 富士フイルム株式会社 2023-04-06 WO disclosed
CN-111372787-B Flexographic printing plate precursor 住友理工株式会社 2021-12-21 CN disclosed
WO-2020246409-A1 FLUORORESIN, ACTIVE ENERGY RAY-CURABLE COMPOSITION, THERMOSETTING COMPOSITION, AND CURED PRODUCTS OF COMPOSITIONS DIC株式会社 2020-12-10 WO disclosed
CN-111372787-A Flexographic printing plate precursor 住友理工株式会社 2020-07-03 CN disclosed
EP-2554555-B1 METHODS FOR PRODUCING AN ADAMANTYL (METH)ACRYLATE MONOMER AND A (METH)ACRYLIC COPOLYMER THAT CONTAINS REPEATING UNITS DERIVED FROM THE MONOMER MITSUBISHI GAS CHEMICAL CO (JP) 2019-09-18 EP disclosed
US-8062829-B2 Chemically amplified resist composition and chemically amplified resist composition for immersion lithography SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2011-11-22 US disclosed
US-8062829-B2 Chemically amplified resist composition and chemically amplified resist composition for immersion lithography SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2011-11-22 US disclosed
WO-2011108767-A1 METHOD OF FORMING PATTERN FUJIFILM CORPORATION (JP) 2011-09-09 WO disclosed
WO-2010114107-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2010-10-07 WO disclosed
WO-2010114158-A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2010-10-07 WO disclosed
US-20100168464-A1 METHOD FOR PRODUCING ADAMANTYL (METH)ACRYLATES MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2010-07-01 US disclosed
US-20090220890-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND CHEMICALLY AMPLIFIED RESIST COMPOSITION FOR IMMERSION LITHOGRAPHY SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2009-09-03 US disclosed
US-20090220890-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION AND CHEMICALLY AMPLIFIED RESIST COMPOSITION FOR IMMERSION LITHOGRAPHY SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2009-09-03 US disclosed
US-7078562-B2 Adamantane derivatives and resin compositions using the same as raw material MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2006-07-18 US disclosed
US-20050158662-A1 Adamantane derivatives and resin compositions using the same as raw material MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2005-07-21 US disclosed