SCHEMBL678282

SCHEMBL678282

C=C(C)C(=O)OC(C)(C)C12CC3CC(CC(O)(C3)C1)C2

nearest known ligand 0.33

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
PKM P14618 1/20 0.33
MDH1 P40925 1/20 0.33
MDH2 P40926 1/20 0.33
HSD11B1 P28845 4/20 0.33
DPP4 P27487 3/20 0.32
ALDH1A1 P00352 2/20 0.31
ABL1 P00519 1/20 0.31
TSHR P16473 1/20 0.31
RIN1 Q13671 1/20 0.31
CNR1 P21554 1/20 0.30
CNR2 P34972 1/20 0.30
NPC1 O15118 1/20 0.30
RAB9A P51151 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3680710 0.91 CYP17A1 (0.32) ALDH1A1
SCHEMBL1218938 0.87
SCHEMBL5901482 0.87
SCHEMBL3680847 0.86
SCHEMBL13115388 0.85 PKM (0.37) PKMMDH1MDH2HSD11B1DPP4
SCHEMBL1217993 0.85 HSD11B1 (0.34) PKMHSD11B1DPP4L3MBTL1
SCHEMBL6369192 0.85 MDH1 (0.34) PKMMDH1MDH2HSD11B1DPP4
SCHEMBL15281488 0.85 CYP17A1 (0.36) ALDH1A1NPC1
SCHEMBL172055 0.85 CYP17A1 (0.36) ALDH1A1NPC1
SCHEMBL1216441 0.84 HSD11B1 (0.34) PKMMDH1MDH2HSD11B1DPP4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 68 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240019779-A1 COMPOUNDS AND PHOTORESIST COMPOSITIONS INCLUDING THE SAME U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2024-01-18 US disclosed
US-11809077-B2 Photoresist compositions and pattern formation methods ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2023-11-07 US disclosed
US-20230314934-A1 PHOTOACTIVE COMPOUNDS, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2023-10-05 US disclosed
US-20230213862-A1 PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2023-07-06 US disclosed
US-20230161257-A1 PHOTORESIST COMPOSITIONS AND PATTERN FORMATION METHODS U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2023-05-25 US disclosed
US-9862695-B2 Monomer having N-acyl carbamoyl group and lactone skeleton, and polymeric compound DAICEL CORPORATION (JP) 2018-01-09 US disclosed
US-20160060374-A1 MONOMER HAVING N-ACYL CARBAMOYL GROUP AND LACTONE SKELETON, AND POLYMERIC COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2016-03-03 US disclosed
US-9170488-B2 Resist pattern-forming method, and radiation-sensitive resin composition JSR CORPORATION (JP) 2015-10-27 US disclosed
US-20140295350-A1 RESIST PATTERN-FORMING METHOD, AND RADIATION-SENSITIVE RESIN COMPOSITION JSR CORP (JP) 2014-10-02 US disclosed
US-8795954-B2 Resist pattern-forming method, and radiation-sensitive resin composition JSR CORPORATION (JP) 2014-08-05 US disclosed
US-20050014087-A1 Photoresist polymeric compound and photoresist resin composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-01-20 US disclosed
US-6806335-B2 FOR USE IN FINE PATTERNING OF SEMICONDUCTORS DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2004-10-19 US disclosed
US-20040006189-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. 2004-01-08 US disclosed
EP-1354897-A1 POLYMER FOR PHOTORESIST AND RESIN COMPOSITIONS THEREFOR Daicel Chemical Industries, Ltd. (JP) 2003-10-22 EP disclosed
US-20030148210-A1 Polymer for photoresist and resin compositions therefor DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-08-07 US disclosed
US-6552143-B2 Addition polymer including units of 1-oxo-perhydro-5,6-didehydro-4,7-methanoisobenzofuran; making a semiconductor using the photoresist; high adhesion, fine patterns DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-04-22 US disclosed
US-20020169266-A1 Polymeric compound and resin composition for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2002-11-14 US disclosed
US-6440636-B1 HIGH ETCHING RESISTANCE, TRANSPARENCY, ALKALI SOLUBILITY, AND ADHESION; ACRYLIC ESTERS HAVING ADAMANTANE GROUP KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-27 US disclosed
EP-1172694-A1 POLYMERIC COMPOUND FOR PHOTORESIST AND RESIN COMPOSITION FOR PHOTORESIST Daicel Chemical Industries, Ltd. (JP) 2002-01-16 EP disclosed
EP-1055654-A1 PROCESS FOR THE PREPARATION OF ORGANIC COMPOUNDS WITH IMIDE CATALYSTS Daicel Chemical Industries, Ltd. (JP) 2000-11-29 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20030148210-A1 Polymer for photoresist and resin compositions therefor LCP1, DOT1L, PRMT1 PKM 2160/4885MDH1 2783/4885MDH2 3335/4885
US-20240019779-A1 COMPOUNDS AND PHOTORESIST COMPOSITIONS INCLUDING THE SAME CRY1, CCNT1, CCNA1 PKM 1050/4885MDH1 3562/4885MDH2 2495/4885
US-20230314934-A1 PHOTOACTIVE COMPOUNDS, PHOTORESIST COMPOSITIONS INCLUDING THE SAME, AND PATTERN FORMATION METHODS CRY1, CBR3, C1S PKM 1685/4885MDH1 4244/4885MDH2 3092/4885
US-20160060374-A1 MONOMER HAVING N-ACYL CARBAMOYL GROUP AND LACTONE SKELETON, AND POLYMERIC COMPOUND CNKSR1, NMRAL1, CCNA1 PKM 3126/4885MDH1 1405/4885MDH2 929/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.