SCHEMBL3682860

SCHEMBL3682860

CCC[SiH2]c1ccccc1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.38
KDM4E B2RXH2 2/20 0.32
CYP3A4 P08684 1/20 0.32
MAPT P10636 1/20 0.32
PSIP1 O75475 1/20 0.32
AOC3 Q16853 1/20 0.31
ALDH1A1 P00352 2/20 0.31
CES2 O00748 1/20 0.31
CES1 P23141 1/20 0.31
PCSK9 Q8NBP7 1/20 0.31
GAA P10253 1/20 0.31
HPGD P15428 1/20 0.31
LTA4H P09960 1/20 0.31
LMNA P02545 1/20 0.31
MAPK1 P28482 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
KDM1A O60341 1/20 0.31
MAOA P21397 1/20 0.31
MAOB P27338 1/20 0.31
FFAR1 O14842 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL706469 0.86
SCHEMBL1274186 0.85 LTA4H (0.38) TP53CES2CES1PCSK9LTA4H
Fluoride SCHEMBL27639867 0.83 LTA4H (0.36) TP53CES2CES1PCSK9LTA4H
Fluoride SCHEMBL27639869 0.83 LTA4H (0.36) TP53CES2CES1PCSK9LTA4H
SCHEMBL3678757 0.83 LTA4H (0.38) TP53CES2CES1PCSK9LTA4H
SCHEMBL6443323 0.81 DNM1 (0.40) TP53ALDH1A1CES2CES1LTA4H
SCHEMBL9665893 0.81 DNM1 (0.40) TP53ALDH1A1CES2CES1LTA4H
SCHEMBL6445686 0.81 DNM1 (0.40) TP53ALDH1A1CES2CES1LTA4H
SCHEMBL31216177 0.81 DNM1 (0.40) TP53ALDH1A1CES2CES1LTA4H
SCHEMBL6443439 0.81 DNM1 (0.40) TP53ALDH1A1CES2CES1LTA4H

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 80 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114207038-B Resin composition, method for producing cured product, pattern cured product, interlayer insulating film, covercoat, surface protective film, and electronic component 艾曲迪微系统股份有限公司 2024-03-22 CN disclosed
US-11912889-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-27 US disclosed
US-20230257503-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE MITSUBISHI CHEMICAL CORPORATION (JP) 2023-08-17 US disclosed
EP-4212256-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE Mitsubishi Chemical Corporation (JP) 2023-07-19 EP disclosed
CN-116075368-A Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2023-05-05 CN disclosed
EP-2658877-B1 STABILIZATION OF POLYMERS THAT CONTAIN A HYDROLYZABLE FUNCTIONALITY BRIDGESTONE CORP (JP) 2023-04-12 EP disclosed
US-11542397-B2 Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-03 US disclosed
EP-4063948-A1 ELECTROCHROMIC DISPLAY ELEMENT AND METHOD FOR PRODUCING ELECTROCHROMIC DISPLAY ELEMENT Ricoh Company, Ltd. (JP) 2022-09-28 EP disclosed
US-11413682-B2 Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid TOKYO OHKA KOGYO CO., LTD. (JP) 2022-08-16 US disclosed
CN-110249004-B Polyimide precursor composition 东京应化工业株式会社 2022-07-19 CN disclosed
US-20050065294-A1 Electrically insulative powder coatings and compositions and methods for making them CRAMER MICHELE LE (US) 2005-03-24 US disclosed
US-6858164-B2 Silicone-oil soluble polymer, image display medium using the silicone-oil soluble polymer and image display device using the image display medium RICOH COMPANY LIMITED (JP) 2005-02-22 US disclosed
US-20050011836-A1 Additives for reversed-phase HPLC mobile phases AGILENT TECHNOLOGIES, INC. 2005-01-20 US disclosed
EP-0714952-B1 Method of curing a siloxane polymer DOW CORNING ASIA LTD (JP) 1999-10-27 EP disclosed
US-5861468-A Curable siloxane polymer composition and method of curing DOW CORNING ASIA, LTD. (JP) 1999-01-19 US disclosed
EP-0714952-A1 Curable siloxane polymer composition and method of curing DOW CORNING ASIA, Ltd. (JP) 1996-06-05 EP disclosed
US-5260377-A Crosslinkable carbosilane polymer formulations UNIVERSITY OF SOUTHERN CALIFORNIA (US) 1993-11-09 US disclosed
WO-1993017063-A1 CROSSLINKABLE CARBOSILANE POLYMER FORMULATIONS UNIVERSITY OF SOUTHERN CALIFORNIA (US) 1993-09-02 WO disclosed
US-5112710-A ELECTROPHOTOGRAPHIC IMAGE FORMING METHOD SEIKO EPSON CORPORATION (JP) 1992-05-12 US disclosed
CN-87100628-A The production method of silicoorganic compound and make the sterilant and the miticide of activeconstituents with it 1988-03-02 CN disclosed